The AMD XC2S200-6FGG624C is a powerful Spartan-II Field Programmable Gate Array (FPGA) designed for high-volume, cost-sensitive applications requiring exceptional flexibility and performance. This 200K system gate FPGA delivers superior alternative to traditional mask-programmed ASICs while eliminating lengthy development cycles and reducing inherent design risks.
XC2S200-6FGG624C Key Features and Specifications
The XC2S200-6FGG624C combines advanced semiconductor technology with versatile architecture to meet demanding digital design requirements. Engineers and designers choose this Xilinx FPGA for its balanced combination of logic density, memory resources, and I/O capabilities.
Core Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Highest Performance) |
| Package Type |
624-Pin Fine-Pitch BGA (Pb-Free) |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Operating Frequency |
Up to 263MHz |
Memory Architecture Specifications
The XC2S200-6FGG624C provides comprehensive on-chip memory resources for data buffering, FIFO implementation, and register file applications:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| RAM Configuration |
Single-Port and Dual-Port |
XC2S200-6FGG624C Package and Pin Configuration
624-Pin Fine-Pitch BGA Package Details
The FGG624 package offers optimal thermal performance and reliable board-level assembly. The “G” designation indicates RoHS-compliant, Pb-free packaging that meets modern environmental standards.
| Package Parameter |
Value |
| Package Type |
FBGA-624 |
| Ball Pitch |
Fine-Pitch Array |
| RoHS Compliance |
Yes (Pb-Free) |
| Terminal Form |
Ball Grid Array |
| Package Shape |
Square |
Operating Temperature Range
The -6 speed grade operates within the commercial temperature range, ensuring reliable performance across typical operating environments:
| Temperature Parameter |
Range |
| Operating Temperature |
0°C to +85°C |
| Temperature Grade |
Commercial |
XC2S200-6FGG624C Architecture Features
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG624C contains 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB provides flexible combinatorial logic and registered storage for implementing complex digital functions.
Input/Output Blocks (IOBs)
Programmable IOBs support multiple I/O standards and voltage levels, enabling seamless interfacing with various peripheral devices and communication protocols.
Delay-Locked Loops (DLLs)
Four integrated DLLs provide precise clock management and distribution throughout the device, ensuring optimal timing performance for high-speed designs.
Block RAM Resources
Dedicated 56K-bit block RAM enables efficient implementation of memory-intensive applications including:
- FIFO buffers
- Data lookup tables
- Coefficient storage
- Frame buffers
- Register files
XC2S200-6FGG624C Application Areas
Telecommunications and Networking
The XC2S200-6FGG624C excels in telecommunications infrastructure applications including routers, switches, base stations, and network interface controllers where high-speed data processing is essential.
Industrial Automation
Industrial control systems benefit from this FPGA’s reprogrammability and real-time processing capabilities for motion control, process automation, and embedded systems.
Consumer Electronics
Cost-effective system gate density makes the XC2S200-6FGG624C ideal for high-volume consumer applications including digital displays, gaming systems, and multimedia devices.
Automotive Electronics
Advanced driver-assistance systems (ADAS), infotainment platforms, and automotive sensor processing leverage this FPGA’s reliability and performance characteristics.
Medical Equipment
Patient monitoring systems, diagnostic instruments, and medical imaging equipment utilize the XC2S200-6FGG624C for signal processing and control functions.
XC2S200-6FGG624C Design Advantages
ASIC Replacement Benefits
Choosing the XC2S200-6FGG624C over mask-programmed ASICs provides significant advantages:
- Eliminated NRE Costs: No initial tooling or mask charges required
- Reduced Time-to-Market: Immediate prototyping without fabrication delays
- Design Flexibility: In-system reprogrammability enables field upgrades
- Risk Mitigation: Design changes possible without hardware replacement
- Unlimited Reprogrammability: Modify functionality as requirements evolve
Development Tool Support
The XC2S200-6FGG624C is supported by comprehensive development tools including ISE Design Suite for synthesis, implementation, and timing analysis.
XC2S200-6FGG624C Ordering Information
Part Number Breakdown
| Code Element |
Meaning |
| XC2S200 |
Spartan-II 200K Gate Device |
| -6 |
Speed Grade (Highest Performance) |
| FGG |
Fine-Pitch BGA, Pb-Free |
| 624 |
Pin Count |
| C |
Commercial Temperature Range |
XC2S200-6FGG624C Electrical Characteristics
Power Supply Requirements
| Supply Rail |
Voltage |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
Configurable |
Performance Metrics
| Parameter |
Specification |
| Maximum System Clock |
263MHz |
| Speed Grade |
-6 (Fastest) |
| Process Node |
0.18μm |
Why Choose the XC2S200-6FGG624C FPGA
The XC2S200-6FGG624C represents an optimal balance between logic density, memory resources, I/O capability, and cost-effectiveness. Engineers select this device for applications requiring:
- High gate count for complex logic implementations
- Substantial on-chip memory for data-intensive applications
- Extensive I/O for multi-channel interfacing
- Commercial temperature operation
- RoHS-compliant, Pb-free packaging
- Proven Spartan-II architecture reliability
XC2S200-6FGG624C Summary
The AMD XC2S200-6FGG624C Spartan-II FPGA delivers 200,000 system gates, 5,292 logic cells, and comprehensive memory resources in a 624-pin Pb-free BGA package. With its -6 speed grade enabling operation up to 263MHz, this versatile programmable logic device serves telecommunications, industrial, consumer, automotive, and medical applications requiring cost-effective, high-performance digital solutions. The unlimited in-system reprogrammability ensures long-term design flexibility while eliminating traditional ASIC development risks and costs.
