The AMD XC2S200-6FGG623C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional performance for demanding industrial, commercial, and embedded applications. This high-density FPGA solution combines advanced 0.18μm CMOS technology with comprehensive programmable logic capabilities, making it an ideal choice for engineers requiring reliable digital signal processing and control system implementations.
Key Features of the XC2S200-6FGG623C FPGA
High-Density Logic Architecture
The XC2S200-6FGG623C provides substantial logic resources for complex digital designs:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
Advanced Memory Configuration
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks × 4K bits) |
Performance Specifications
| Parameter |
Rating |
| Maximum System Frequency |
Up to 263 MHz |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Process Technology |
0.18 μm CMOS |
| Speed Grade |
-6 (Higher Performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
XC2S200-6FGG623C Package Information
Fine-Pitch BGA Package Details
The XC2S200-6FGG623C utilizes a Fine-Pitch Ball Grid Array (FBGA) package configuration, providing:
- Reliable surface-mount attachment
- Excellent thermal dissipation characteristics
- Compact footprint for space-constrained applications
- Enhanced signal integrity for high-speed designs
Spartan-II FPGA Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG623C features a robust CLB architecture with:
- Four Logic Cells (LCs) per CLB organized in two slices
- 4-input Look-Up Tables (LUTs) for function generation
- Dedicated carry logic for high-speed arithmetic operations
- Cascade chains for wide-input function implementation
- Abundant registers and latches with enable, set, and reset capabilities
Input/Output Block (IOB) Capabilities
The versatile I/O architecture supports 16 high-performance interface standards:
| I/O Standard |
Reference Voltage (VREF) |
Output Voltage (VCCO) |
| LVTTL |
N/A |
3.3V |
| LVCMOS2 |
N/A |
2.5V |
| PCI (3V/5V, 33MHz/66MHz) |
N/A |
3.3V |
| GTL |
0.8V |
N/A |
| GTL+ |
1.0V |
N/A |
| HSTL Class I |
0.75V |
1.5V |
| HSTL Class III/IV |
0.9V |
1.5V |
| SSTL3 Class I/II |
1.5V |
3.3V |
| SSTL2 Class I/II |
1.25V |
2.5V |
| CTT |
1.5V |
3.3V |
| AGP-2X |
1.32V |
3.3V |
Advanced Clock Management with DLL Technology
Delay-Locked Loop (DLL) Features
The XC2S200-6FGG623C incorporates four fully digital Delay-Locked Loop circuits providing:
- Zero propagation delay clock distribution
- Low clock skew across the entire device
- Advanced clock domain control capabilities
- Clock multiplication (2× frequency doubling)
- Clock division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, or 16×)
- Four quadrature phase outputs (0°, 90°, 180°, 270°)
- Board-level clock deskewing capability
Global Clock Distribution Network
| Resource |
Quantity |
| Primary Global Clock Nets |
4 |
| Dedicated Clock Input Pins |
4 |
| DLL Units |
4 |
| Secondary Backbone Lines |
24 |
SelectRAM Hierarchical Memory System
Block RAM Configuration
The XC2S200-6FGG623C provides flexible block RAM resources:
| Configuration |
Depth |
Width |
Address Bus |
Data Bus |
| Narrow |
4,096 |
1 |
ADDR[11:0] |
DATA[0] |
| Standard |
2,048 |
2 |
ADDR[10:0] |
DATA[1:0] |
| Wide |
1,024 |
4 |
ADDR[9:0] |
DATA[3:0] |
| Byte-Wide |
512 |
8 |
ADDR[8:0] |
DATA[7:0] |
| Word-Wide |
256 |
16 |
ADDR[7:0] |
DATA[15:0] |
Dual-Port RAM Capabilities
- Fully synchronous dual-ported operation
- Independent control signals for each port
- Configurable port widths with built-in bus-width conversion
- Independent read/write operations
Configuration Options for XC2S200-6FGG623C
Supported Configuration Modes
| Mode |
CCLK Direction |
Data Width |
Serial DOUT |
| Master Serial |
Output |
1-bit |
Yes |
| Slave Serial |
Input |
1-bit |
Yes |
| Slave Parallel |
Input |
8-bit |
No |
| Boundary-Scan (JTAG) |
N/A |
1-bit |
No |
Configuration File Size
The XC2S200-6FGG623C requires a configuration bitstream of approximately 1,335,840 bits for complete device programming.
IEEE 1149.1 Boundary-Scan Support
The XC2S200-6FGG623C provides full compliance with IEEE 1149.1 (JTAG) standard:
- EXTEST instruction for external interconnect testing
- SAMPLE/PRELOAD instruction for device testing
- BYPASS instruction for chain optimization
- USERCODE instructions for user-defined functions
- CFG_IN/CFG_OUT for configuration and readback
- INTEST for internal testing capabilities
Target Applications for XC2S200-6FGG623C FPGA
The XC2S200-6FGG623C excels in diverse application domains:
Industrial Control Systems
- Programmable Logic Controllers (PLCs)
- Motor drive control
- Industrial automation equipment
- Process control systems
Digital Signal Processing
- Audio/video processing
- Filter implementations
- Data acquisition systems
- Real-time signal analysis
Communications Infrastructure
- Protocol converters
- Network interface controllers
- Telecommunications equipment
- Data routing systems
Embedded Systems
- Custom peripheral controllers
- Interface bridging solutions
- State machine implementations
- Co-processing applications
Development Tools and Software Support
Xilinx ISE Design Suite Compatibility
The XC2S200-6FGG623C is fully supported by comprehensive development tools:
- Automatic mapping, placement, and routing
- HDL synthesis support (VHDL/Verilog)
- Timing-driven implementation
- Static timing analysis
- In-circuit debugging capabilities
- Comprehensive simulation support
Design Library Resources
Access to over 400 primitives and macros including:
- Arithmetic functions and comparators
- Counters and data registers
- Decoders and encoders
- Multiplexers and shift registers
- Boolean functions and barrel shifters
Why Choose XC2S200-6FGG623C Over Traditional ASICs
The XC2S200-6FGG623C offers significant advantages compared to mask-programmed ASICs:
Cost-Effective Development
- No initial NRE (Non-Recurring Engineering) costs
- Reduced development cycle time
- Lower risk during prototyping phases
Design Flexibility
- Unlimited reprogrammability
- Field-upgradable designs
- In-system reconfiguration capability
Rapid Time-to-Market
- Faster design iterations
- Immediate design verification
- No manufacturing delays
XC2S200-6FGG623C Ordering Information
Part Number Breakdown
| Component |
Description |
| XC2S200 |
Device Type (Spartan-II, 200K Gates) |
| -6 |
Speed Grade (Higher Performance) |
| FGG |
Package Type (Fine-Pitch BGA, Pb-Free) |
| 623 |
Pin Count |
| C |
Temperature Range (Commercial: 0°C to +85°C) |
Technical Documentation and Resources
For comprehensive design resources, datasheets, and application notes for Xilinx FPGA products including the XC2S200-6FGG623C, engineers can access official AMD/Xilinx documentation portals and authorized distributor resources.
Available Documentation
- Complete datasheet (DS001)
- User guides and application notes
- Development board schematics
- Reference designs and IP cores
- BSDL files for boundary-scan implementation
Conclusion
The AMD XC2S200-6FGG623C Spartan-II FPGA represents a proven, reliable solution for engineers requiring high-performance programmable logic in a cost-effective package. With 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and advanced clock management capabilities, this FPGA delivers the flexibility and performance needed for demanding industrial, commercial, and embedded applications. The combination of mature 0.18μm technology, comprehensive I/O standard support, and robust development tool ecosystem makes the XC2S200-6FGG623C an excellent choice for both new designs and legacy system upgrades.
