The AMD XC2S200-6FGG622C is a high-performance field-programmable gate array from the renowned Spartan-II FPGA family. This versatile programmable logic device delivers exceptional value for engineers seeking reliable digital design solutions without the high costs associated with traditional ASICs. Whether you’re developing industrial control systems, telecommunications equipment, or embedded applications, this FPGA offers the flexibility and performance your projects demand.
Key Features of the AMD XC2S200-6FGG622C FPGA
The XC2S200-6FGG622C combines cutting-edge 0.18-micron CMOS technology with a robust architecture designed for demanding applications. Here’s what makes this FPGA stand out in the competitive semiconductor market.
High-Density Logic Resources
This Spartan-II device provides substantial logic capacity for complex digital designs. The XC2S200-6FGG622C features 200,000 system gates and 5,292 logic cells arranged in a 28 × 42 CLB array with 1,176 configurable logic blocks. These resources enable engineers to implement sophisticated algorithms, state machines, and data processing pipelines within a single chip.
Advanced Memory Architecture
Memory performance plays a crucial role in FPGA applications. The XC2S200-6FGG622C includes 75,264 bits of distributed RAM alongside 56K bits of dedicated block RAM. This dual-memory architecture supports both high-speed register files and larger data buffers, making it ideal for DSP applications, FIFO implementations, and lookup table-intensive designs.
Robust I/O Capabilities
With 284 user-configurable I/O pins, the XC2S200-6FGG622C provides extensive connectivity options for interfacing with external components. The Fine-Pitch Ball Grid Array (FBGA) package ensures reliable connections while minimizing board space requirements. All I/O pins support multiple voltage standards and offer programmable slew rate control.
AMD XC2S200-6FGG622C Technical Specifications
| Specification |
Value |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Maximum User I/O |
284 |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Speed Grade |
-6 (Fastest) |
| Core Voltage |
2.5V |
| Process Technology |
0.18 µm CMOS |
| Operating Temperature |
0°C to 85°C (Commercial) |
Spartan-II FPGA Architecture Details
Understanding the internal architecture helps engineers maximize the XC2S200-6FGG622C’s potential in their designs.
Configurable Logic Blocks (CLBs)
Each CLB contains four logic cells organized as two slices. Every slice includes two 4-input function generators (LUTs), carry logic, and two storage elements. This structure supports both combinatorial and sequential logic implementations with maximum efficiency.
Four Delay-Locked Loops (DLLs)
The XC2S200-6FGG622C incorporates four DLLs positioned at each corner of the die. These clock management resources eliminate clock distribution delays, multiply or divide clock frequencies, and provide phase-shifted clock outputs. Engineers can achieve precise timing control across their entire design.
Block RAM Configuration
The dedicated block RAM offers true dual-port capability with independent read and write operations on each port. Configurable data widths range from 1-bit to 16-bit, supporting diverse memory applications including FIFOs, circular buffers, and content-addressable memories.
XC2S200-6FGG622C Package Information
BGA Package Advantages
The FBGA package format delivers several benefits for PCB design and manufacturing. Ball grid arrays provide superior electrical performance through shorter connection paths. Additionally, the uniform ball distribution simplifies routing and improves thermal dissipation. The Pb-free (RoHS compliant) “G” designation in the part number indicates lead-free solder balls meeting environmental standards.
Part Number Breakdown
- XC2S200: Spartan-II device with 200K system gates
- -6: Fastest speed grade for maximum performance
- FGG: Fine-pitch BGA, Pb-free packaging
- 622: Package pin count variant
- C: Commercial temperature range (0°C to 85°C)
Why Choose the AMD XC2S200-6FGG622C for Your Design
Cost-Effective ASIC Alternative
The XC2S200-6FGG622C eliminates the substantial NRE (non-recurring engineering) costs associated with custom ASIC development. Engineers can iterate designs rapidly without waiting for mask fabrication. This programmable approach significantly reduces time-to-market while maintaining production-grade reliability.
Field Upgradability
Unlike fixed-function ASICs, Spartan-II FPGAs support in-system reconfiguration. Product enhancements, bug fixes, and feature additions deploy through simple firmware updates without hardware modifications. This flexibility extends product lifecycles and reduces warranty costs.
Comprehensive Development Ecosystem
AMD (formerly Xilinx) provides robust development tools for the Spartan-II family. The ISE Design Suite offers synthesis, implementation, and simulation capabilities. Extensive documentation, reference designs, and application notes accelerate development cycles. For those exploring the broader Xilinx FPGA portfolio, numerous resources support migration paths to newer device families.
Target Applications for AMD XC2S200-6FGG622C
The XC2S200-6FGG622C excels in numerous application domains requiring programmable logic solutions.
Industrial Automation and Control
Manufacturing equipment, motor drives, and PLC implementations benefit from the device’s deterministic timing and extensive I/O capabilities. Real-time control loops execute with consistent latency across all operating conditions.
Telecommunications Infrastructure
Base station equipment, network switches, and protocol converters leverage the FPGA’s parallel processing architecture. High-speed serial interfaces and clock management resources support demanding communications standards.
Medical Equipment
Diagnostic imaging systems, patient monitors, and laboratory instruments require reliable, certifiable hardware platforms. The Spartan-II architecture provides the stability and long-term availability these applications demand.
Consumer Electronics
Video processing, audio systems, and display controllers utilize the XC2S200-6FGG622C’s DSP-friendly architecture. On-chip memory reduces system complexity while maintaining performance targets.
Aerospace and Defense Prototyping
Rapid prototyping capabilities enable engineers to validate complex algorithms before committing to radiation-hardened or military-grade implementations.
Configuration Options and Programming
Supported Configuration Modes
The XC2S200-6FGG622C supports multiple configuration schemes to match various system requirements.
Master Serial Mode
The FPGA actively reads configuration data from an external serial PROM. This standalone approach suits applications requiring autonomous startup without processor intervention.
Slave Parallel Mode
An external microcontroller or processor loads configuration data through an 8-bit parallel interface. This method provides faster configuration times and enables dynamic reconfiguration scenarios.
Slave Serial Mode
Similar to master serial mode, but with an external clock source controlling the configuration timing. This approach suits multi-device configurations sharing a common bitstream source.
Boundary Scan (JTAG) Mode
IEEE 1149.1 compliant JTAG interface enables configuration, debugging, and board-level testing through a standardized four-wire interface.
Configuration Data Requirements
A fully configured XC2S200 device requires approximately 1,335,840 bits of configuration data. Compatible serial PROMs include the XC18V02 and XC18V04 devices from the Platform Flash family.
Design Considerations for AMD XC2S200-6FGG622C
Power Supply Requirements
The XC2S200-6FGG622C requires a 2.5V core supply (VCCINT) with ±5% tolerance. I/O banks support various voltage standards from 1.8V to 3.3V through VCCO supplies. Proper decoupling capacitor placement ensures stable operation across all loading conditions.
Thermal Management
Under typical operating conditions, the device dissipates moderate power levels. Standard PCB copper planes and airflow provide adequate cooling for most applications. High-utilization designs may require additional thermal analysis using provided power estimation tools.
Signal Integrity
The FBGA package geometry demands careful PCB stackup design and trace routing. Controlled impedance traces, appropriate termination schemes, and proper ground plane design ensure reliable high-speed signal transmission.
Ordering Information and Availability
The AMD XC2S200-6FGG622C remains available through authorized distributors worldwide. Volume pricing and lead times vary based on market conditions. Contact your preferred distributor for current inventory status and competitive quotations.
Related Part Numbers
Engineers may also consider these alternative configurations based on specific project requirements:
- Different speed grades (-5 for cost optimization)
- Industrial temperature range variants (I suffix)
- Alternative package options (PQ208, FG256)
Conclusion
The AMD XC2S200-6FGG622C Spartan-II FPGA delivers proven performance, extensive resources, and cost-effective programmability for diverse electronic design applications. Its mature architecture, comprehensive tool support, and global availability make it a reliable choice for both new designs and legacy system maintenance. Engineers seeking flexible digital logic solutions will find this device meets demanding requirements while simplifying development workflows.
For technical documentation, datasheets, and application support, consult the official AMD documentation portal or contact authorized distribution partners.
