The AMD XC2S200-6FGG617C is a high-performance Field Programmable Gate Array (FPGA) belonging to the renowned Spartan-II family. This powerful programmable logic device delivers exceptional flexibility and cost-effectiveness for engineers developing complex digital systems. Built on proven 0.18µm CMOS technology with 2.5V core voltage operation, the XC2S200-6FGG617C provides 200,000 system gates and advanced clock management features ideal for telecommunications, industrial automation, and embedded applications.
XC2S200-6FGG617C Key Features and Architecture Overview
The XC2S200-6FGG617C leverages the Spartan-II architecture, which combines Configurable Logic Blocks (CLBs), Input/Output Blocks (IOBs), and dedicated Block RAM resources. This Xilinx FPGA design philosophy ensures optimal balance between logic density, memory capacity, and signal routing efficiency.
Core Logic Resources
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
Embedded Memory Configuration
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (14 × 4,096-bit blocks) |
| Total Configuration Bits |
1,335,840 |
XC2S200-6FGG617C Package and Electrical Specifications
Fine-Pitch BGA Package Details
| Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FGG) |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
23 mm × 23 mm |
| Mounting Type |
Surface Mount (SMD/SMT) |
| Lead-Free Compliance |
Yes (RoHS Compliant) |
Operating Conditions and Speed Grade
| Parameter |
Value |
| Speed Grade |
-6 (Fastest) |
| Core Voltage (VCCINT) |
2.5V (2.375V – 2.625V) |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Maximum Frequency |
263 MHz |
XC2S200-6FGG617C I/O Standards and Interface Capabilities
The XC2S200-6FGG617C supports multiple I/O standards, enabling seamless integration with diverse system components and communication protocols.
Supported I/O Standards
| Category |
Standards Supported |
| Single-Ended |
LVTTL, LVCMOS (3.3V/2.5V/1.8V) |
| Differential |
LVDS, BLVDS, LVPECL |
| High-Speed |
GTL, GTL+, HSTL, SSTL |
| Legacy |
PCI (3.3V), PCI-X |
Clock Management Features
| Feature |
Description |
| Delay-Locked Loops (DLLs) |
4 (one per corner) |
| Global Clock Networks |
4 primary + 24 secondary |
| Clock Skew Elimination |
Automatic DLL compensation |
| Frequency Synthesis |
1.5× to 16× multiplication |
XC2S200-6FGG617C Block RAM Architecture
Dual-Port RAM Specifications
| Parameter |
Value |
| Memory Blocks |
14 blocks |
| Bits Per Block |
4,096 |
| Port Configuration |
Fully synchronous dual-port |
| Data Width Options |
1, 2, 4, 8, or 16 bits |
| Independent Port Control |
Yes |
The block RAM modules support configurable aspect ratios, allowing designers to implement memory structures ranging from deep narrow RAMs (4096 × 1) to wide shallow configurations (256 × 16).
XC2S200-6FGG617C Configuration Modes
Available Configuration Options
| Mode |
Data Width |
CCLK Direction |
Serial DOUT |
| Master Serial |
1-bit |
Output |
Yes |
| Slave Serial |
1-bit |
Input |
Yes |
| Slave Parallel |
8-bit |
Input |
No |
| Boundary-Scan (JTAG) |
1-bit |
N/A |
No |
XC2S200-6FGG617C Applications and Use Cases
Industrial Applications
The robust architecture and commercial temperature rating make the XC2S200-6FGG617C suitable for motor control systems, programmable logic controllers (PLCs), and factory automation equipment requiring real-time signal processing.
Telecommunications Applications
High-speed I/O capabilities and abundant logic resources enable implementation of communication protocols including HDLC framing, ATM cell processing, and digital signal encoding/decoding functions.
Consumer Electronics Applications
Cost-effective gate density and low power consumption characteristics support applications in set-top boxes, digital displays, and multimedia processing systems.
XC2S200-6FGG617C Design Tool Support
Development Software Compatibility
| Tool |
Support Level |
| Xilinx ISE Design Suite |
Full Support |
| Foundation Series |
Compatible |
| WebPACK |
Free Download Available |
| ChipScope Pro |
Logic Analyzer Integration |
HDL Language Support
| Language |
Status |
| VHDL |
Fully Supported |
| Verilog |
Fully Supported |
| ABEL |
Legacy Support |
| Schematic Entry |
Available |
XC2S200-6FGG617C Ordering Information
Part Number Decoder
| Segment |
Meaning |
| XC2S |
Spartan-II Family |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade (Fastest) |
| FGG |
Fine-Pitch BGA, Pb-Free |
| 617 |
Pin Count |
| C |
Commercial Temperature |
Why Choose the AMD XC2S200-6FGG617C FPGA?
The XC2S200-6FGG617C delivers exceptional value for engineers requiring substantial logic capacity without premium pricing. Its -6 speed grade designation indicates the fastest performance tier within the Spartan-II family, enabling clock frequencies up to 263 MHz for demanding timing-critical applications.
The lead-free (Pb-free) FGG package ensures compliance with RoHS environmental directives while maintaining excellent thermal characteristics and board-level reliability. Combined with comprehensive development tool support and extensive documentation, the XC2S200-6FGG617C represents an optimal choice for both prototype development and high-volume production deployments.
