The AMD XC2S200-6FGG611C is a high-performance Field Programmable Gate Array (FPGA) from the legendary Spartan-II family. This programmable logic device delivers exceptional processing capabilities for industrial automation, telecommunications, and embedded systems applications. Engineers worldwide trust the XC2S200-6FGG611C for mission-critical designs requiring reliable, cost-effective programmable logic solutions.
XC2S200-6FGG611C Key Features and Benefits
The XC2S200-6FGG611C FPGA combines advanced 0.18µm CMOS technology with a flexible architecture that meets demanding design requirements. This device offers unlimited in-system reprogrammability, enabling field upgrades without hardware replacement. Unlike mask-programmed ASICs, the XC2S200-6FGG611C eliminates lengthy development cycles and reduces engineering risk.
Why Choose the XC2S200-6FGG611C for Your Design?
- Superior alternative to traditional ASIC implementations
- Zero initial NRE (Non-Recurring Engineering) costs
- Rapid prototyping with fast design iteration cycles
- In-field programmability for future feature updates
- Comprehensive development tool ecosystem support
XC2S200-6FGG611C Technical Specifications
The following technical specifications define the XC2S200-6FGG611C performance envelope and design parameters:
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG611C |
| Manufacturer |
AMD (formerly Xilinx) |
| FPGA Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Speed Grade |
-6 (Fastest) |
| Package Type |
Fine Pitch BGA |
| Operating Voltage |
2.5V |
| Process Technology |
0.18µm CMOS |
| Maximum Frequency |
263 MHz |
| Temperature Range |
Commercial (0°C to +85°C) |
XC2S200-6FGG611C Memory Architecture
The XC2S200-6FGG611C features a hierarchical SelectRAM memory system that provides flexible on-chip storage options:
| Memory Type |
Capacity |
Features |
| Distributed RAM |
75,264 bits |
16 bits per LUT, synchronous operation |
| Block RAM |
56 Kbits |
Dual-port, 4096-bit configurable blocks |
| Total On-Chip RAM |
131,264 bits |
Combined distributed and block RAM |
Each block RAM cell operates as a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The data widths of the two ports can be configured independently, providing built-in bus width conversion capabilities.
XC2S200-6FGG611C Clock Management
Four Delay-Locked Loops (DLLs) positioned at each die corner deliver precise clock management:
| DLL Feature |
Capability |
| Clock Deskewing |
Eliminates clock distribution delays |
| Frequency Synthesis |
2× clock multiplication |
| Phase Shifting |
90°, 180°, 270° phase control |
| Board-Level Deskew |
Mirror mode for external clock alignment |
XC2S200-6FGG611C Programmable I/O Features
The XC2S200-6FGG611C Input/Output Blocks (IOBs) support multiple interface standards for seamless system integration:
| I/O Standard |
Voltage Level |
Application |
| LVTTL |
3.3V |
General-purpose logic |
| LVCMOS |
2.5V/3.3V |
Low-voltage CMOS interfaces |
| PCI |
3.3V |
PCI bus compliance |
| GTL+ |
1.0V reference |
High-speed memory interfaces |
| SSTL |
2.5V/3.3V |
DDR memory connectivity |
XC2S200-6FGG611C Configuration Modes
The XC2S200-6FGG611C supports multiple configuration options for maximum design flexibility:
| Mode |
Data Width |
CCLK Direction |
Application |
| Master Serial |
1-bit |
Output |
Platform Flash PROM |
| Slave Serial |
1-bit |
Input |
Microprocessor configuration |
| Slave Parallel |
8-bit |
Input |
High-speed parallel loading |
| Boundary-Scan |
1-bit |
N/A |
JTAG programming |
The bitstream size for the XC2S200-6FGG611C is 1,335,840 bits, enabling rapid configuration through any supported mode.
XC2S200-6FGG611C Application Areas
The XC2S200-6FGG611C excels in diverse application domains:
Industrial Applications
- Programmable Logic Controllers (PLCs)
- Motor drive control systems
- Industrial networking equipment
- Process automation controllers
Telecommunications
- Protocol converters and bridges
- Network interface controllers
- Base station processing
- Fiber optic transceivers
Consumer Electronics
- Set-top boxes
- Digital video processing
- Audio/video encoders
- Display controllers
Embedded Systems
- Real-time signal processing
- Custom peripheral interfaces
- Hardware acceleration engines
- System-on-Chip implementations
XC2S200-6FGG611C Development Tools
Engineers designing with the XC2S200-6FGG611C leverage comprehensive AMD development resources:
| Tool |
Function |
| ISE Design Suite |
Complete FPGA design environment |
| ISE WebPACK |
Free entry-level design tools |
| ChipScope Pro |
Real-time on-chip debugging |
| ModelSim |
Functional simulation |
| Synthesis Tools |
XST and third-party synthesizers |
XC2S200-6FGG611C Design Considerations
Power Supply Requirements
| Supply Rail |
Voltage |
Function |
| VCCINT |
2.5V ±5% |
Core logic power |
| VCCO |
1.5V to 3.3V |
I/O bank power |
| GND |
0V |
Ground reference |
Thermal Management
The XC2S200-6FGG611C commercial temperature grade operates reliably across the 0°C to +85°C ambient range. Proper PCB thermal design with adequate copper pour and airflow ensures optimal performance.
Signal Integrity
The Fine Pitch BGA package provides excellent signal integrity characteristics with controlled impedance paths and minimal parasitic inductance for high-speed designs.
XC2S200-6FGG611C Ordering Information
The part number decodes as follows:
| Code Element |
Meaning |
| XC2S200 |
Spartan-II 200K system gates |
| -6 |
Speed grade (fastest) |
| FGG |
Fine pitch BGA, Pb-free |
| 611 |
Pin count |
| C |
Commercial temperature range |
XC2S200-6FGG611C vs. Alternative Solutions
When comparing the XC2S200-6FGG611C against competing solutions, consider these advantages:
| Feature |
XC2S200-6FGG611C |
Traditional ASIC |
| Development Cost |
Low (no NRE) |
High ($500K+) |
| Time to Market |
Weeks |
6-12 months |
| Design Changes |
Unlimited |
Requires new masks |
| Risk Level |
Low |
High |
| Volume Flexibility |
Any quantity |
High-volume only |
Where to Source XC2S200-6FGG611C Components
The XC2S200-6FGG611C is available through authorized AMD distributors and electronic component suppliers worldwide. For comprehensive Xilinx FPGA product information, technical documentation, and purchasing options, consult specialized FPGA distributors who maintain verified inventory and provide manufacturer-backed support.
XC2S200-6FGG611C Summary
The AMD XC2S200-6FGG611C Spartan-II FPGA delivers a compelling combination of performance, flexibility, and cost-effectiveness for programmable logic applications. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O support, this device addresses a broad spectrum of industrial, telecommunications, and embedded system requirements. The proven Spartan-II architecture ensures reliable operation backed by extensive development tool support and worldwide availability.
