The AMD XC2S200-6FGG611C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for industrial automation, telecommunications, digital signal processing, and embedded system applications. As a leading Xilinx FPGA solution, the XC2S200-6FGG611C offers superior flexibility and cost-effectiveness compared to traditional ASICs.

XC2S200-6FGG611C Key Features and Benefits

The XC2S200-6FGG611C stands out in the FPGA market due to its comprehensive feature set designed for demanding applications. This device combines high gate density with advanced I/O capabilities, delivering reliable performance across various operating conditions.

High-Density Logic Architecture

The XC2S200-6FGG611C features an impressive 5,292 logic cells organized in a 28 x 42 CLB (Configurable Logic Block) array. This architecture provides 1,176 total CLBs, enabling complex digital designs without compromising system performance. The device supports system clock rates up to 200 MHz, ensuring fast data processing for time-critical applications.

Advanced Memory Resources

Memory capabilities distinguish the XC2S200-6FGG611C from competing solutions. The device integrates 56K bits of dedicated block RAM and 75,264 bits of distributed RAM. This dual-memory architecture supports various data storage requirements, from high-speed buffering to lookup table implementations.

Flexible I/O Configuration

With 284 maximum user I/O pins, the XC2S200-6FGG611C provides extensive connectivity options. The device supports 16 different I/O standards including LVTTL, LVCMOS2, PCI 3.3V/5V, HSTL, SSTL, GTL+, and AGP-2X, ensuring compatibility with virtually any system interface requirement.

XC2S200-6FGG611C Technical Specifications

Spartan-II FPGA Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG611C CLB architecture incorporates four logic cells per block, organized into two identical slices. Each logic cell contains a 4-input lookup table (LUT), dedicated carry logic, and a storage element configurable as either an edge-triggered D-type flip-flop or level-sensitive latch.

LUT-Based Function Generators

The 4-input LUTs serve multiple purposes within the XC2S200-6FGG611C architecture. Beyond implementing combinatorial logic functions, each LUT can operate as a 16×1-bit synchronous RAM. Two LUTs within a slice combine to create 16×2-bit or 32×1-bit synchronous RAM configurations, or a 16×1-bit dual-port synchronous RAM.

Dedicated Arithmetic Support

High-speed arithmetic operations benefit from dedicated carry logic within each CLB. The XC2S200-6FGG611C supports two separate carry chains per CLB, with two bits per chain height. An integrated XOR gate enables single-bit full adder implementation within one logic cell, while a dedicated AND gate optimizes multiplier designs.

Input/Output Block (IOB) Architecture

The XC2S200-6FGG611C IOB design supports high-speed interfaces with comprehensive signal standard compatibility. Each IOB features programmable input buffers, output drivers, and three registers for input, output, and 3-state control.

Supported I/O Standards

The device accommodates diverse interface requirements through support for multiple signaling standards:

• Single-Ended Standards: LVTTL (2-24mA), LVCMOS2, PCI (3V/5V, 33/66 MHz)
• Differential Standards: GTL, GTL+, HSTL Class I/III/IV, SSTL2/3 Class I/II, CTT
• High-Speed Interfaces: AGP-2X compatible

I/O Banking Structure

Eight I/O banks organize the XC2S200-6FGG611C periphery, with each bank supporting independent VCCO voltage configuration. This architecture enables mixed-voltage designs within a single device, provided compatible standards share the same bank.

Block RAM Configuration

The 14 block RAM modules in the XC2S200-6FGG611C provide 56K bits of high-speed, dual-port memory. Each 4,096-bit block supports independent port configurations with selectable aspect ratios from 4096×1 to 256×16. Built-in bus-width conversion simplifies data path designs requiring different port widths.

Clock Distribution and DLL Features

Four Delay-Locked Loops deliver advanced clock management capabilities. The DLL architecture eliminates clock distribution delay by automatically compensating for routing delays, ensuring clock edges arrive at internal flip-flops synchronously with input clock edges.

DLL Capabilities

• Zero propagation delay clock distribution
• Clock multiplication (2X)
• Clock division (÷1.5, ÷2, ÷2.5, ÷3, ÷4, ÷5, ÷8, ÷16)
• Four quadrature phase outputs (0°, 90°, 180°, 270°)
• Board-level clock deskewing support

XC2S200-6FGG611C Package Information

FGG Package Specifications

The FGG (Fine Pitch Ball Grid Array, Pb-Free) package provides excellent thermal performance and signal integrity for high-density designs. This RoHS-compliant package supports both commercial and environmentally conscious manufacturing requirements.

Pin Assignment and Configuration

The XC2S200-6FGG611C supports multiple configuration modes for design flexibility:

Design Development Support

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG611C receives full support from Xilinx ISE development tools. The integrated design environment provides automatic mapping, placement, and routing with timing-driven optimization. HDL design entry supports both VHDL and Verilog implementations.

Configuration Data Requirements

XC2S200-6FGG611C Application Areas

The versatile architecture makes the XC2S200-6FGG611C suitable for numerous applications:

• Industrial Control Systems: Motor drives, process automation, sensor interfaces
• Telecommunications: Protocol conversion, data multiplexing, signal processing
• Consumer Electronics: Video processing, display controllers, audio systems
• Automotive Electronics: Dashboard controllers, infotainment systems
• Medical Devices: Patient monitoring, diagnostic equipment interfaces
• Aerospace and Defense: Avionics, radar processing, communication systems

Comparison: XC2S200-6FGG611C vs ASIC Solutions

Advantages Over Mask-Programmed ASICs

The XC2S200-6FGG611C eliminates several ASIC-related challenges:

Ordering Information and Part Number Decoder

XC2S200-6FGG611C Part Number Breakdown

• XC2S200: Spartan-II device, 200K system gates
• -6: Speed grade (higher performance than -5)
• FGG: Fine Pitch BGA, Pb-Free package
• 611: Pin count
• C: Commercial temperature range (0°C to +85°C)

Available Speed Grade Options

Technical Documentation Resources

Engineers designing with the XC2S200-6FGG611C should reference these essential documents:

• DS001: Spartan-II FPGA Family Data Sheet (complete specifications)
• Module 1: Introduction and Ordering Information
• Module 2: Functional Description
• Module 3: DC and Switching Characteristics
• Module 4: Pinout Tables

Why Choose the XC2S200-6FGG611C for Your Next Project

The AMD XC2S200-6FGG611C delivers an optimal balance of performance, flexibility, and cost-effectiveness for mid-range FPGA applications. Its 200,000 system gates, comprehensive memory resources, and extensive I/O capabilities address diverse design requirements while maintaining competitive pricing. The Pb-free FGG package meets modern environmental standards without sacrificing reliability.

For designers seeking a proven programmable logic solution with robust development tool support and extensive application flexibility, the XC2S200-6FGG611C represents an excellent choice. Whether implementing digital signal processing algorithms, communication protocols, or complex control systems, this Spartan-II family member provides the resources and performance needed to achieve design success.