The AMD XC2S200-6FGG608C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional programmable logic capabilities for industrial, commercial, and embedded applications. This 200,000-gate FPGA combines cost-effective implementation with advanced digital processing features, making it a preferred choice for engineers requiring reliable programmable solutions.

XC2S200-6FGG608C Key Features and Overview

The XC2S200-6FGG608C represents the flagship device in the Spartan-II FPGA family, offering an optimal balance between performance, power consumption, and design flexibility. Built on proven 0.18µm CMOS technology, this FPGA delivers system performance up to 263MHz while maintaining low power operation at 2.5V core voltage.

Primary Specifications at a Glance

XC2S200-6FGG608C Detailed Architecture

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG608C features 1,176 Configurable Logic Blocks arranged in a 28 × 42 array, providing substantial logic resources for complex digital designs. Each CLB contains four Logic Cells (LCs), offering flexible implementation of combinatorial and sequential logic functions.

Each Logic Cell includes a 4-input function generator (LUT), carry logic for arithmetic operations, and a storage element that can function as either a flip-flop or a latch. This architecture enables efficient implementation of wide-input functions, high-speed counters, and shift registers.

Block RAM Memory Resources

The integrated 56Kbit Block RAM provides high-speed, dual-port memory capabilities essential for FIFO buffers, data caching, and memory-intensive applications. Key Block RAM features include:

• Dual-Port Architecture: Each Block RAM cell offers a fully synchronous dual-ported 4,096-bit RAM with independent control signals per port
• Flexible Data Widths: Configurable data widths from 1-bit to 16-bit on each port independently
• Column Organization: Memory blocks are organized in two columns along each vertical edge of the device
• Independent Clocking: Supports asynchronous operation between ports for maximum design flexibility

Distributed RAM Capabilities

Beyond Block RAM, the XC2S200-6FGG608C provides 75,264 bits of distributed RAM implemented within the CLBs. This distributed memory is ideal for small, fast memory requirements such as register files, lookup tables, and temporary storage buffers.

Input/Output Capabilities and Standards

I/O Architecture

The XC2S200-6FGG608C supports 284 user-configurable I/O pins organized into multiple I/O banks. Each Input/Output Block (IOB) provides programmable input and output characteristics, enabling direct interface with various voltage standards and signal types.

Supported I/O Standards

The flexible I/O architecture supports 16 different I/O standards, allowing seamless integration with diverse system components and eliminating the need for external level-shifting circuitry.

Clock Management with Delay-Locked Loops (DLLs)

DLL Features

Four integrated Delay-Locked Loops (DLLs), positioned at each corner of the die, provide advanced clock management capabilities including:

• Clock Deskewing: Eliminates clock distribution delays for improved timing performance
• Frequency Multiplication/Division: Supports 2× multiplication and various division ratios (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×)
• Phase Shifting: Enables precise clock phase adjustments (0°, 90°, 180°, 270°)
• Clock Mirroring: Allows board-level clock deskewing across multiple FPGAs

Global Clock Distribution

Primary global nets driven by dedicated global buffers ensure minimal clock skew across the entire device. This architecture is critical for meeting setup and hold time requirements in high-speed synchronous designs.

XC2S200-6FGG608C Package Information

FGG608 Package Specifications

The FGG608 package represents a fine-pitch Ball Grid Array (BGA) configuration optimized for high-density PCB designs. The “G” designation indicates Pb-free (lead-free) packaging, complying with RoHS environmental directives.

Pin Assignment Guidelines

The FGG608 package provides optimal signal integrity for high-speed designs through controlled impedance ball patterns and dedicated power/ground distribution. Engineers should follow these best practices for successful implementation:

• Separate analog and digital power planes where applicable
• Implement proper decoupling capacitor placement near power pins
• Follow recommended PCB layer stack-up for BGA routing

Speed Grade and Performance

Understanding the -6 Speed Grade

The -6 speed grade represents the fastest available timing option for the XC2S200 device, offering maximum clock frequencies and minimum propagation delays. This speed grade is exclusively available in the Commercial temperature range (0°C to +85°C).

Performance Metrics

Configuration Modes and Options

Supported Configuration Methods

The XC2S200-6FGG608C supports multiple configuration modes for maximum design flexibility:

Configuration Bits

The XC2S200-6FGG608C requires approximately 1,335,840 configuration bits for complete device programming. Configuration data can be stored in external PROMs, flash memory, or loaded dynamically from system processors.

Industrial and Commercial Applications

Target Application Areas

The XC2S200-6FGG608C FPGA excels in numerous application domains:

• Digital Signal Processing (DSP): Efficient implementation of filters, transforms, and signal conditioning algorithms
• Communications Systems: Protocol conversion, data encryption, and network interface controllers
• Industrial Control: Motor controllers, process automation, and sensor interfaces
• Consumer Electronics: Video processing, audio systems, and display controllers
• Medical Devices: Patient monitoring, diagnostic equipment, and imaging systems
• Automotive Systems: Infotainment, telematics, and advanced driver assistance systems (ADAS)

ASIC Replacement Benefits

The XC2S200-6FGG608C provides a superior alternative to mask-programmed ASICs, offering:

• Elimination of NRE Costs: No initial tooling or mask charges
• Reduced Development Time: Immediate prototype availability
• Field Upgradability: In-system reprogramming without hardware changes
• Lower Risk: Design modifications possible at any project stage

Design Development Tools and Resources

Software Support

The XC2S200-6FGG608C is fully supported by Xilinx ISE Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and verification. Key tool features include:

• HDL Support: VHDL and Verilog design entry
• Schematic Capture: Graphical design entry option
• Timing Analysis: Static timing analysis for performance validation
• Simulation: Behavioral and timing simulation capabilities
• Bitstream Generation: Configuration file creation

For more detailed information about Xilinx FPGA development tools, reference designs, and technical support resources, engineers can access comprehensive documentation through authorized distribution channels.

IP Core Availability

A wide range of pre-verified IP cores accelerate design development, including:

• Arithmetic functions (multipliers, dividers, DSP blocks)
• Memory controllers (SDRAM, DDR, SRAM interfaces)
• Communication interfaces (UART, SPI, I2C, Ethernet MAC)
• Bus interfaces (PCI, Wishbone, AMBA)

Ordering Information and Part Number Decoder

Part Number Structure

XC2S200-6FGG608C decodes as follows:

Temperature Range Options

Quality and Reliability Standards

The XC2S200-6FGG608C meets stringent quality standards ensuring reliable operation in demanding applications:

• Manufacturing Process: ISO 9001 certified facilities
• Environmental Compliance: RoHS compliant (Pb-free)
• Reliability Testing: JEDEC standard qualification
• Moisture Sensitivity Level: MSL specifications per J-STD-020

Conclusion: Why Choose the XC2S200-6FGG608C

The AMD XC2S200-6FGG608C Spartan-II FPGA delivers an outstanding combination of logic density, memory resources, I/O flexibility, and performance in a single, cost-effective package. The -6 speed grade ensures maximum system performance, while the Pb-free FGG608 package meets modern environmental requirements.

For engineers seeking a proven, reliable programmable logic solution with comprehensive tool support and extensive IP availability, the XC2S200-6FGG608C remains an excellent choice for new designs and legacy system maintenance. Its superior alternative to mask-programmed ASICs eliminates initial development costs while providing flexibility for field upgrades throughout the product lifecycle.