The XC2S200-6FGG604C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family. This powerful programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for digital signal processing, telecommunications, and industrial control applications. The XC2S200-6FGG604C combines advanced 0.18μm CMOS technology with a comprehensive feature set that enables engineers to implement complex digital designs efficiently.
XC2S200-6FGG604C Key Features and Capabilities
The XC2S200-6FGG604C stands out in the Xilinx FPGA portfolio with its balanced combination of logic density, memory resources, and I/O flexibility. This device offers unlimited reprogrammability, allowing design upgrades in the field without hardware replacement.
Core Logic Architecture
The XC2S200-6FGG604C features a robust configurable logic block (CLB) architecture organized in a 28 × 42 array, providing 1,176 total CLBs. Each CLB contains four logic cells (LCs), resulting in 5,292 logic cells capable of implementing complex combinational and sequential logic functions.
Speed Grade Performance
As a “-6” speed grade device, the XC2S200-6FGG604C delivers higher performance operation, supporting system clock rates up to 200 MHz. This speed grade is optimized for commercial temperature range applications (0°C to +85°C) and provides faster switching characteristics compared to the standard -5 speed grade.
XC2S200-6FGG604C Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 CLBs) |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (14 blocks × 4,096 bits) |
| Delay-Locked Loops (DLLs) |
4 |
| Process Technology |
0.18 μm CMOS |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Speed Grade |
-6 (Higher Performance) |
| Package Type |
Fine Pitch BGA (FGG604) |
| Temperature Range |
Commercial (0°C to +85°C) |
| RoHS Compliance |
Pb-free Available |
XC2S200-6FGG604C Memory Resources
The XC2S200-6FGG604C provides a hierarchical memory architecture that offers flexibility for diverse application requirements.
Block RAM Configuration
The device includes 14 dedicated block RAM modules, each providing 4,096 bits of synchronous dual-port memory. This yields a total of 56 Kbits of block RAM that can be configured in various aspect ratios:
| Width |
Depth |
Address Bus |
Data Bus |
| 1-bit |
4,096 |
ADDR[11:0] |
DATA[0] |
| 2-bit |
2,048 |
ADDR[10:0] |
DATA[1:0] |
| 4-bit |
1,024 |
ADDR[9:0] |
DATA[3:0] |
| 8-bit |
512 |
ADDR[8:0] |
DATA[7:0] |
| 16-bit |
256 |
ADDR[7:0] |
DATA[15:0] |
Distributed RAM Capabilities
Beyond block RAM, the XC2S200-6FGG604C offers 75,264 bits of distributed RAM implemented using look-up tables (LUTs). Each LUT can function as a 16 × 1-bit synchronous RAM, and two LUTs can combine to create 16 × 2-bit, 32 × 1-bit synchronous RAM, or 16 × 1-bit dual-port synchronous RAM configurations.
XC2S200-6FGG604C I/O Interface Standards
The XC2S200-6FGG604C supports 16 high-performance interface standards, enabling seamless integration with various system components and peripheral devices.
Supported I/O Standards
- LVTTL (2-24 mA drive strength)
- LVCMOS2 (2.5V CMOS)
- PCI (3V/5V, 33 MHz/66 MHz compliant)
- GTL and GTL+
- HSTL Class I, III, and IV
- SSTL2 and SSTL3 Class I and II
- CTT (Center Tap Terminated)
- AGP-2X (Accelerated Graphics Port)
I/O Banking Structure
The XC2S200-6FGG604C organizes I/O pins into eight independent banks, allowing different I/O standards to coexist within a single device when proper VCCO and VREF voltages are supplied to each bank.
XC2S200-6FGG604C Clock Management
Advanced clock management is essential for high-performance digital designs. The XC2S200-6FGG604C integrates four Delay-Locked Loops (DLLs) to provide precise clock control.
DLL Features
- Zero Propagation Delay: Eliminates clock distribution delay between input and internal flip-flops
- Clock Multiplication: Doubles the input clock frequency for higher-speed internal operation
- Clock Division: Divides input clock by factors of 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Phase Shifting: Generates four quadrature phases (0°, 90°, 180°, 270°) of the source clock
- Clock Mirroring: Enables board-level clock deskewing across multiple FPGAs
Global Clock Distribution
Four dedicated primary global clock networks provide low-skew clock distribution to all CLBs, IOBs, and block RAM cells throughout the device.
XC2S200-6FGG604C Configuration Options
The XC2S200-6FGG604C supports multiple configuration modes to accommodate different system architectures and design requirements.
Configuration Modes
| Mode |
Description |
Data Width |
CCLK Direction |
| Master Serial |
FPGA drives configuration from external PROM |
1-bit |
Output |
| Slave Serial |
External controller provides configuration data |
1-bit |
Input |
| Slave Parallel |
Fastest configuration via byte-wide interface |
8-bit |
Input |
| Boundary Scan |
JTAG-based configuration through TAP |
1-bit |
N/A |
Configuration File Size
The XC2S200-6FGG604C requires a configuration bitstream of 1,335,840 bits (approximately 163 KB), which can be stored in compatible serial PROMs or other nonvolatile memory devices.
XC2S200-6FGG604C Applications
The XC2S200-6FGG604C serves as an excellent choice for a wide range of applications requiring programmable logic with moderate to high gate counts.
Typical Application Areas
- Digital Signal Processing (DSP): Implementing FIR filters, FFT algorithms, and signal conditioning
- Telecommunications Equipment: Protocol converters, multiplexers, and network interface controllers
- Industrial Automation: Motor control, sensor interfaces, and process controllers
- Consumer Electronics: Video processing, display controllers, and audio systems
- ASIC Prototyping: Rapid design verification and functional validation
- Embedded Systems: Co-processor implementations and custom peripheral interfaces
XC2S200-6FGG604C Development Tools
The XC2S200-6FGG604C is fully supported by AMD’s comprehensive development environment.
Design Software
- ISE Design Suite: Complete FPGA development environment for synthesis, implementation, and verification
- HDL Support: VHDL and Verilog design entry with industry-standard synthesis tools
- Simulation: Integrated timing analysis and functional simulation capabilities
Programming and Debug
- Download Cable: Direct programming interface from PC to target FPGA
- Readback Capability: Configuration verification and real-time debugging through flip-flop state observation
- Boundary Scan: IEEE 1149.1 compliant JTAG interface for board-level testing
Why Choose the XC2S200-6FGG604C
The XC2S200-6FGG604C offers several compelling advantages for design engineers and system architects.
Cost-Effective ASIC Alternative
Unlike mask-programmed ASICs, the XC2S200-6FGG604C eliminates NRE (non-recurring engineering) costs and lengthy development cycles. The device’s unlimited reprogrammability enables iterative design refinement and field upgrades without hardware changes.
Proven Reliability
Built on mature 0.18 μm CMOS process technology, the XC2S200-6FGG604C delivers consistent performance and long-term availability for production applications requiring stable supply chains.
Design Flexibility
The combination of abundant logic resources, flexible memory architecture, comprehensive I/O standard support, and advanced clock management makes the XC2S200-6FGG604C suitable for diverse applications ranging from simple glue logic replacement to complex system-on-chip implementations.
XC2S200-6FGG604C Ordering Information
When ordering the XC2S200-6FGG604C, ensure proper device designation to receive the correct speed grade, package, and temperature range variant.
Part Number Breakdown
- XC2S200: Spartan-II device with 200K system gates
- -6: Higher performance speed grade
- FGG604: Fine pitch BGA package with 604 balls
- C: Commercial temperature range (0°C to +85°C)
Conclusion
The XC2S200-6FGG604C represents an excellent balance of performance, features, and value within the Spartan-II FPGA family. With its 200,000 system gates, 5,292 logic cells, 56 Kbits of block RAM, and comprehensive I/O flexibility, this device empowers engineers to implement sophisticated digital designs while maintaining cost efficiency. Whether you’re developing telecommunications equipment, industrial controls, or embedded systems, the XC2S200-6FGG604C delivers the programmable logic capabilities needed to bring your designs to life.
For more information about compatible FPGA solutions and comprehensive technical support, explore our complete range of programmable logic devices and development resources.
