The AMD XC2S200-6FGG603C is a versatile Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional digital processing capabilities for cost-sensitive and high-volume applications. This programmable logic device combines robust architecture with advanced semiconductor technology, making it an ideal solution for engineers and designers seeking reliable performance in complex digital systems.
XC2S200-6FGG603C Key Features and Benefits
The XC2S200-6FGG603C stands out as a superior alternative to traditional mask-programmed ASICs. Unlike conventional ASICs, this Xilinx FPGA offers unlimited in-system reprogrammability, eliminating lengthy development cycles and reducing inherent design risks. Engineers can implement field upgrades without hardware replacement—a flexibility impossible with ASICs.
Advanced Architecture Based on Virtex Technology
Built on streamlined Virtex FPGA architecture, the XC2S200-6FGG603C leverages cost-effective 0.18-micron process technology to achieve optimal performance-to-cost ratios. The device operates on a 2.5V core voltage, ensuring compatibility with modern low-power system designs.
XC2S200-6FGG603C Technical Specifications
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG603C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (High Performance) |
| Package Type |
FGG603 (Fine-Pitch Ball Grid Array) |
| Core Voltage |
2.5V |
| Technology |
0.18μm CMOS |
| Maximum Frequency |
263 MHz |
| Temperature Range |
Commercial (0°C to +85°C) |
| Manufacturer |
AMD (formerly Xilinx) |
Spartan-II XC2S200 Memory Configuration
The XC2S200-6FGG603C features a hierarchical SelectRAM memory system designed for maximum flexibility in data-intensive applications.
Distributed RAM Specifications
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (56,000 bits) |
| RAM per LUT |
16 bits |
| Block RAM Configuration |
Configurable 4K-bit modules |
Dual-Port Block RAM Capability
The embedded block RAM supports true dual-port operation, enabling simultaneous read/write access from independent ports. This feature is essential for applications requiring high-bandwidth data buffering, FIFO implementations, and multi-processor communication interfaces.
XC2S200-6FGG603C I/O Standards and Interface Options
The device supports 16 selectable I/O standards, providing exceptional interfacing flexibility for diverse system requirements:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS) at multiple voltage levels
- PCI compliant interfaces (33 MHz and 66 MHz)
- GTL+ (Gunning Transceiver Logic Plus)
- SSTL (Stub Series Terminated Logic) for DDR memory interfaces
- HSTL (High-Speed Transceiver Logic)
- AGP (Accelerated Graphics Port) 2× support
MultiVolt I/O Technology
The XC2S200-6FGG603C incorporates MultiVolt I/O technology, allowing different I/O banks to operate at independent voltage levels. This capability simplifies mixed-voltage system integration and reduces the need for external level-shifting components.
Delay-Locked Loop (DLL) Clock Management
Four integrated Delay-Locked Loops (DLLs) positioned at each corner of the die provide advanced clock management capabilities:
| DLL Feature |
Specification |
| Number of DLLs |
4 |
| Clock Multiplication |
1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16× |
| Clock Division |
1.5, 2, 2.5, 3, 4, 5, 8, 16 |
| Phase Shift |
0°, 90°, 180°, 270° |
| Duty Cycle Correction |
Yes |
| Clock Deskew |
Yes |
XC2S200-6FGG603C Industrial Applications
The versatility of the XC2S200-6FGG603C makes it suitable for numerous industry sectors:
Telecommunications Infrastructure
- Base station signal processing
- Network routers and switches
- Protocol conversion equipment
- Channel encoding/decoding systems
Industrial Automation and Control
- Motor drive controllers
- Process control systems
- Programmable logic controllers (PLC)
- Industrial robotics interfaces
Medical Device Applications
- Patient monitoring equipment
- Diagnostic imaging systems
- Medical instrumentation
- Laboratory automation
Consumer Electronics
- Set-top boxes
- Digital video processing
- Audio signal processing
- Gaming peripherals
Automotive Systems
- Advanced Driver Assistance Systems (ADAS)
- Infotainment controllers
- Vehicle communication interfaces
- Sensor data processing
XC2S200-6FGG603C Package Information
The FGG603 package utilizes Fine-Pitch Ball Grid Array (FBGA) technology, optimizing board space while maintaining excellent thermal and electrical performance.
| Package Parameter |
Value |
| Package Type |
FBGA (Fine-Pitch Ball Grid Array) |
| Pin Count |
603 balls |
| Ball Pitch |
1.0 mm |
| Mounting |
Surface Mount (SMD) |
| Lead-Free Option |
Available (RoHS Compliant) |
| Moisture Sensitivity Level |
MSL 3 |
Design Tools and Software Support
The XC2S200-6FGG603C is fully supported by AMD’s comprehensive development environment:
- ISE Design Suite for HDL synthesis and implementation
- Vivado Design Suite compatibility for legacy support
- IP Core Library with pre-verified functional blocks
- ChipScope Pro for in-system debugging
- JTAG Boundary Scan for production testing
Ordering Information and Part Number Breakdown
XC2S200-6FGG603C part number decoding:
| Code Segment |
Meaning |
| XC2S |
Spartan-II FPGA Family |
| 200 |
200K System Gates |
| -6 |
Speed Grade (High Performance) |
| FG |
Fine-Pitch BGA Package |
| G |
Lead-Free (Pb-Free) Option |
| 603 |
603-Ball Package |
| C |
Commercial Temperature Range |
Why Choose the AMD XC2S200-6FGG603C FPGA
The XC2S200-6FGG603C delivers compelling advantages for system designers:
- Cost-Effective Performance: Second-generation ASIC replacement technology at a fraction of traditional ASIC development costs
- Rapid Time-to-Market: Eliminate months of ASIC development with instant programmability
- Field Upgradability: Implement design improvements and bug fixes without hardware changes
- Reduced Inventory Risk: Single programmable device can serve multiple product variants
- Proven Reliability: Mature 0.18μm process technology with extensive field deployment history
- Comprehensive Support: Backed by AMD’s extensive documentation, application notes, and technical support
XC2S200-6FGG603C Electrical Characteristics
| Parameter |
Min |
Typical |
Max |
Unit |
| VCCINT (Core Voltage) |
2.375 |
2.5 |
2.625 |
V |
| VCCO (I/O Voltage) |
1.14 |
— |
3.6 |
V |
| Input Capacitance |
— |
8 |
— |
pF |
| Standby Current (ICCINTQ) |
— |
— |
10 |
mA |
| Operating Current |
— |
Varies |
— |
mA |
Conclusion
The AMD XC2S200-6FGG603C represents an exceptional choice for engineers requiring a balance of performance, flexibility, and cost-effectiveness. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities, this Spartan-II FPGA addresses demanding applications across telecommunications, industrial, medical, automotive, and consumer electronics markets.
For projects requiring programmable logic solutions that combine proven reliability with modern design capabilities, the XC2S200-6FGG603C delivers the performance and features needed to accelerate product development while minimizing risk.
