The AMD XC2S200-6FGG598C is a high-performance field-programmable gate array (FPGA) from the renowned Spartan-II family. This versatile programmable logic device delivers exceptional value for cost-sensitive applications requiring reliable digital logic implementation. Engineers and designers worldwide trust the XC2S200-6FGG598C for telecommunications, industrial automation, and embedded system development.
Key Features of the XC2S200-6FGG598C FPGA
The AMD XC2S200-6FGG598C combines advanced CMOS technology with flexible architecture to meet demanding design requirements. This device offers an optimal balance between performance, power consumption, and cost-effectiveness.
System Gate Capacity and Logic Resources
The XC2S200-6FGG598C provides 200,000 system gates equivalent capacity, making it suitable for medium-complexity digital designs. The internal architecture includes:
- 2,352 logic cells organized in configurable logic blocks (CLBs)
- 56 x 42 CLB array providing extensive routing flexibility
- 5,292 flip-flops for sequential logic implementation
- 4-input look-up tables (LUTs) for combinational logic synthesis
Embedded Memory Specifications
On-chip memory resources enable efficient data buffering and storage without external components:
| Memory Type |
Capacity |
Configuration Options |
| Block RAM |
56 Kbits |
16-bit, 8-bit, 4-bit, 2-bit, 1-bit widths |
| Distributed RAM |
43,008 bits |
Synchronous dual-port capability |
| Total RAM |
99 Kbits |
Flexible memory mapping |
Clock Management Architecture
The XC2S200-6FGG598C integrates four Digital Clock Managers (DCMs) providing:
- Clock multiplication and division
- Phase shifting with fine resolution
- Duty cycle correction
- Spread spectrum clocking support
- Low-jitter clock distribution networks
Package and Pin Configuration
FGG598C Package Details
The XC2S200-6FGG598C utilizes a Fine-pitch Ball Grid Array (FBGA) package optimized for high-density PCB designs. Key package characteristics include:
- 598 ball positions in grid configuration
- 1.0 mm ball pitch for standard SMT assembly
- Lead-free (Pb-free) RoHS compliant construction
- Commercial temperature range (0°C to +85°C)
User I/O Availability
This package variant maximizes available input/output resources:
- Up to 284 user I/O pins available for design use
- 8 dedicated global clock inputs for timing-critical signals
- 4 primary global clock networks spanning the entire device
- Programmable I/O standards supporting multiple voltage levels
Electrical Characteristics and Performance
Speed Grade Classification
The “-6” speed grade designation indicates optimized performance specifications:
| Parameter |
Specification |
| Speed Grade |
-6 (Standard Performance) |
| Clock-to-Output Delay |
4.2 ns typical |
| Setup Time |
1.8 ns typical |
| Global Clock Frequency |
Up to 200 MHz |
Power Supply Requirements
The XC2S200-6FGG598C operates with dual voltage rails for optimal efficiency:
- Core Voltage (VCCINT): 2.5V ± 5%
- I/O Voltage (VCCO): 1.5V to 3.3V (bank-selectable)
- Auxiliary Voltage (VCCAUX): 3.3V
- Standby Power: Less than 10 mW typical
Supported I/O Standards
The device supports multiple single-ended and differential I/O standards:
- LVTTL and LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
- PCI (33 MHz compliant)
- GTL and GTL+
- SSTL3 Class I and II
- SSTL2 Class I and II
- HSTL Class I, II, III, and IV
- LVDS and LVPECL differential pairs
Application Areas for XC2S200-6FGG598C
Telecommunications Equipment
The XC2S200-6FGG598C excels in communication system implementations:
- SDH/SONET framing and mapping
- ATM cell processing
- Ethernet MAC controllers
- Protocol bridging applications
- Channel coding and decoding
Industrial Control Systems
Industrial applications benefit from the device’s reliability:
- PLC logic replacement
- Motor drive controllers
- Sensor interface processing
- Real-time control algorithms
- Safety monitoring systems
Consumer Electronics
Cost-effective consumer product integration includes:
- Video processing pipelines
- Audio codec interfaces
- Display controllers
- Peripheral connectivity
- User interface management
For comprehensive Xilinx FPGA product availability and technical support, engineers can access detailed documentation and ordering information.
Development Tools and Design Flow
Software Compatibility
The XC2S200-6FGG598C is fully supported by AMD development tools:
- Vivado Design Suite for synthesis and implementation
- ISE Design Suite legacy support
- IP Integrator for system-level design
- Simulation libraries for ModelSim and other simulators
Configuration Options
Multiple configuration modes enable flexible system integration:
| Mode |
Description |
Use Case |
| Master Serial |
Device controls external PROM |
Production systems |
| Slave Serial |
External processor controls loading |
Embedded applications |
| Master Parallel |
8-bit parallel PROM interface |
Fast configuration |
| Boundary Scan |
JTAG-based configuration |
Development and testing |
Ordering Information and Part Numbering
Part Number Breakdown: XC2S200-6FGG598C
Understanding the complete part number ensures correct device selection:
- XC2S200: Spartan-II family, 200K system gates
- -6: Speed grade (standard performance tier)
- FG: Fine-pitch BGA package type
- G598: 598-ball grid array configuration
- C: Commercial temperature grade (0°C to +85°C)
Quality and Compliance
The XC2S200-6FGG598C meets stringent quality standards:
- RoHS compliant (lead-free)
- REACH compliant
- MSL Level 3 moisture sensitivity
- ISO 9001 certified manufacturing
- Automotive grade variants available upon request
Technical Support and Documentation
Engineers designing with the XC2S200-6FGG598C can access comprehensive resources including datasheets, user guides, application notes, and reference designs through AMD’s official documentation portal. The Spartan-II family maintains long-term availability commitment for industrial and embedded applications requiring extended product lifecycles.
Summary
The AMD XC2S200-6FGG598C represents an excellent choice for designers seeking a reliable, cost-effective FPGA solution. With 200,000 system gates, robust memory resources, flexible I/O capabilities, and comprehensive development tool support, this device addresses diverse application requirements from telecommunications to industrial control. The FGG598C package provides high pin count in a compact footprint, enabling dense PCB layouts while maintaining signal integrity for demanding designs.
