The AMD XC2S200-6FGG597C is a premium field-programmable gate array (FPGA) from the renowned Spartan-II family. This commercial-grade programmable logic device delivers exceptional performance, flexibility, and cost-effectiveness for demanding digital design applications. Engineers worldwide trust the XC2S200-6FGG597C for telecommunications, industrial automation, embedded systems, and consumer electronics projects.

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XC2S200-6FGG597C Key Features and Benefits

The XC2S200-6FGG597C combines cutting-edge FPGA architecture with robust design capabilities. This device serves as a superior alternative to mask-programmed ASICs, eliminating lengthy development cycles and reducing project risk.

Core Architecture Highlights

The XC2S200-6FGG597C utilizes proven Spartan-II architecture with an impressive array of programmable resources. The device features Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide precise clock management. Two columns of block RAM deliver high-bandwidth on-chip memory for data-intensive applications.

Why Choose the XC2S200-6FGG597C?

• In-System Reprogrammability: Update designs in the field without hardware replacement
• Reduced Time-to-Market: Avoid conventional ASIC development timelines
• Cost-Effective Solution: Eliminate NRE costs associated with custom silicon
• Design Flexibility: Modify functionality throughout the product lifecycle
• Proven Reliability: Built on mature 0.18µm CMOS process technology

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XC2S200-6FGG597C Technical Specifications

Logic Resource Summary

XC2S200-6FGG597C Electrical Characteristics

Package Information

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XC2S200-6FGG597C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG597C contains 1,176 CLBs arranged in a 28×42 array. Each CLB provides programmable logic functions and routing resources. The regular architecture ensures predictable timing and simplified place-and-route operations.

Input/Output Block Features

The XC2S200-6FGG597C IOBs support multiple I/O standards for seamless system integration:

• LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
• GTL and GTL+ for high-speed applications
• HSTL and SSTL for memory interfaces
• PCI 3.3V compliance for bus applications
• Programmable slew rate control
• Programmable pull-up and pull-down resistors

Memory Architecture

The XC2S200-6FGG597C provides hierarchical memory options:

Distributed RAM: 75,264 bits of LUT-based RAM deliver fast, local storage for registers and small buffers.

Block RAM: 56K bits organized in dedicated 4K-bit blocks support true dual-port operation. Block RAM enables efficient implementation of FIFOs, buffers, and lookup tables.

Clock Management with DLLs

Four Delay-Locked Loops provide advanced clock management:

• Clock deskew for reduced clock-to-output delay
• Frequency synthesis (2×, 4×, and divide ratios)
• Phase shifting for fine timing adjustment
• Low jitter clock distribution

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XC2S200-6FGG597C Configuration Options

The XC2S200-6FGG597C supports multiple configuration modes for flexible system integration.

Configuration Modes Table

Configuration Data Size

The XC2S200-6FGG597C requires 1,335,840 configuration bits. Compatible configuration PROMs include XC18V04 and larger devices.

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XC2S200-6FGG597C Application Areas

Telecommunications and Networking

The XC2S200-6FGG597C excels in telecom applications requiring high-speed data processing. Common implementations include protocol converters, encryption engines, and packet processing systems.

Industrial Automation and Control

Industrial engineers select the XC2S200-6FGG597C for motor control, sensor interfaces, and factory automation equipment. The commercial temperature range ensures reliable operation in controlled industrial environments.

Consumer Electronics

The XC2S200-6FGG597C enables rapid product development for consumer markets. Display controllers, audio processing, and gaming peripherals benefit from the device’s flexibility and performance.

Embedded Systems Development

Embedded system designers leverage the XC2S200-6FGG597C for custom peripheral interfaces, hardware accelerators, and co-processing solutions. Learn more about Xilinx FPGA applications and development resources.

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XC2S200-6FGG597C Development Tools

Design Software Support

The XC2S200-6FGG597C is fully supported by Xilinx ISE Design Suite. This comprehensive toolchain provides:

• Design entry (schematic and HDL)
• Logic synthesis optimization
• Automatic place-and-route
• Static timing analysis
• Simulation and verification

HDL Language Support

Engineers can implement designs using VHDL, Verilog, or mixed-language approaches. The synthesis tools optimize designs for the Spartan-II architecture automatically.

IP Core Availability

Pre-verified IP cores accelerate development for common functions:

• Soft processor cores (MicroBlaze)
• Memory controllers
• Communication interfaces (UART, SPI, I2C)
• DSP functions (FIR filters, FFT)
• Bus interfaces (Wishbone, AMBA)

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XC2S200-6FGG597C Ordering Information

Part Number Decoder

Available Package Options

The Spartan-II XC2S200 device family offers multiple package configurations to suit various PCB design requirements. The FGG package series provides lead-free (Pb-free) options compliant with RoHS directives.

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XC2S200-6FGG597C PCB Design Considerations

Power Supply Recommendations

Proper power supply design ensures reliable XC2S200-6FGG597C operation:

• Use dedicated 2.5V supply for VCCINT (core logic)
• Provide separate VCCO rails for each I/O bank
• Include adequate decoupling capacitors (100nF ceramic per power pin)
• Implement bulk capacitance (47µF to 100µF) near power entry

Signal Integrity Guidelines

High-speed designs require attention to signal integrity:

• Match trace impedances to I/O standard requirements
• Implement proper termination strategies for high-speed signals
• Minimize stub lengths on critical signal paths
• Use controlled impedance routing for differential pairs

Thermal Management

The XC2S200-6FGG597C dissipates moderate power depending on design utilization. The FBGA package provides excellent thermal conductivity through the ball array. Standard PCB designs with 4-layer or 6-layer stackups typically provide adequate thermal dissipation.

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XC2S200-6FGG597C Comparison with Similar Devices

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XC2S200-6FGG597C Quality and Reliability

Manufacturing Standards

AMD (formerly Xilinx) manufactures the XC2S200-6FGG597C using stringent quality control processes. The 0.18µm CMOS fabrication process delivers consistent performance and reliability across production lots.

Environmental Compliance

• RoHS Compliance: Pb-free package options available
• REACH: Compliant with EU chemical regulations
• Moisture Sensitivity: MSL-3 rating (storage and handling requirements apply)

Qualification Testing

The XC2S200-6FGG597C undergoes comprehensive qualification testing including:

• Temperature cycling
• Humidity testing
• ESD qualification
• Latch-up testing
• Life testing (HTOL)

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Conclusion: XC2S200-6FGG597C for Your Next Project

The AMD XC2S200-6FGG597C Spartan-II FPGA delivers proven performance for cost-sensitive applications requiring significant logic resources. With 200,000 system gates, comprehensive I/O support, and flexible configuration options, this device addresses diverse design challenges across telecommunications, industrial, and embedded markets.

The mature Spartan-II architecture ensures design stability and long-term availability. Engineers benefit from extensive documentation, proven development tools, and a broad ecosystem of IP cores and reference designs.

Contact your authorized AMD/Xilinx distributor for current pricing, availability, and technical support for the XC2S200-6FGG597C FPGA.