Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG596C FPGA: High-Performance Spartan-II Programmable Logic Device

Product Details

The AMD XC2S200-6FGG596C is a premium Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional speed and reliability for demanding digital applications. This advanced programmable logic device features the fastest -6 speed grade available, making it the ideal solution for engineers requiring maximum performance in telecommunications, industrial automation, and embedded systems design.


XC2S200-6FGG596C Key Features and Benefits

The XC2S200-6FGG596C stands out in the competitive FPGA market due to its impressive combination of high gate density, superior speed performance, and cost-effective implementation. Unlike mask-programmed ASICs, this FPGA offers complete design flexibility with field-upgradable capabilities.

Superior Processing Power

This Spartan-II device delivers outstanding computational resources for complex digital designs:

  • 200,000 System Gates – Ample logic capacity for sophisticated applications
  • 5,292 Logic Cells – Extensive programmable resources for custom implementations
  • 1,176 Configurable Logic Blocks (CLBs) – Arranged in a 28 x 42 array architecture
  • 263 MHz Maximum Operating Frequency – Industry-leading speed for high-throughput designs

Advanced Memory Architecture

The XC2S200-6FGG596C incorporates a robust memory subsystem designed for versatile data handling:

  • 75,264 bits Distributed RAM – Fast, local storage within logic fabric
  • 56K bits Block RAM – 14 dedicated dual-port memory blocks
  • Flexible Memory Configuration – Configurable as single-port, dual-port RAM, or ROM

XC2S200-6FGG596C Technical Specifications

Understanding the complete technical profile ensures optimal integration into your design. The following specifications define the operational parameters of this high-performance Xilinx FPGA.

Electrical Characteristics

Parameter Specification
Core Voltage 2.5V
I/O Voltage 1.5V to 3.3V (Multi-standard)
Maximum User I/O 284 pins
Technology Node 0.18μm CMOS
Speed Grade -6 (Fastest Available)

Package Information

Feature Detail
Package Type Fine Pitch Ball Grid Array (FG BGA)
Pin Count 596 balls
Package Style Lead-Free (Pb-Free) RoHS Compliant
Temperature Range Commercial (0°C to 85°C)

Clock Management Resources

The XC2S200-6FGG596C includes sophisticated clock distribution capabilities:

  • 4 Delay-Locked Loops (DLLs) – One at each corner of the die
  • 4 Global Clock Networks – Low-skew clock distribution
  • Clock Mirroring Capability – For precise timing synchronization

XC2S200-6FGG596C Application Areas

The versatility of the XC2S200-6FGG596C makes it suitable for numerous high-performance applications across multiple industries.

Telecommunications Infrastructure

Network equipment manufacturers rely on this FPGA for implementing protocol processing, packet routing, and signal conditioning in routers, switches, and base stations.

Industrial Control Systems

Factory automation, process control, and motion control systems benefit from the real-time processing capabilities and abundant I/O resources of this device.

Consumer Electronics

Digital audio/video processing, gaming systems, and smart home devices leverage the cost-effective performance of the Spartan-II architecture.

Medical Instrumentation

Patient monitoring equipment, diagnostic instruments, and imaging systems utilize the reliability and flexibility of this programmable platform.

Automotive Electronics

Advanced driver assistance systems (ADAS), infotainment units, and vehicle networking applications depend on the robust performance characteristics.


Why Choose the XC2S200-6FGG596C Over ASICs?

Traditional ASIC development requires substantial upfront investment, lengthy design cycles, and carries inherent risk. The XC2S200-6FGG596C eliminates these challenges while providing comparable functionality.

Design Flexibility Advantages

  1. Zero NRE Costs – No mask charges or minimum order quantities
  2. Rapid Prototyping – From concept to working hardware in days, not months
  3. Field Upgradability – Update firmware without hardware replacement
  4. Risk Mitigation – Verify designs before volume production commitment

Cost-Effectiveness

The total cost of ownership for FPGA-based designs often proves lower than ASIC alternatives when considering development time, engineering resources, and time-to-market advantages.


XC2S200-6FGG596C Development Environment

Successful implementation of the XC2S200-6FGG596C requires appropriate development tools and resources.

Design Software Compatibility

  • ISE Design Suite – Complete synthesis, implementation, and verification platform
  • HDL Support – Full VHDL and Verilog design entry
  • IP Core Library – Pre-verified functional blocks for common applications

Configuration Options

The device supports multiple configuration methods:

  • Serial PROM loading
  • Parallel flash programming
  • JTAG boundary scan
  • Master/Slave serial modes

XC2S200-6FGG596C I/O Capabilities

The comprehensive I/O subsystem ensures seamless integration with diverse system components.

Supported I/O Standards

The multi-voltage I/O interface accommodates various signaling protocols:

  • LVTTL and LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
  • GTL and GTL+
  • HSTL Class I, II, III, IV
  • SSTL2 Class I and II
  • PCI 3.3V compliant

I/O Features

  • Programmable Drive Strength – Optimize signal integrity
  • Selectable Slew Rate – Control edge rates for EMI management
  • Integrated Pull-up/Pull-down Resistors – Simplify PCB design

Ordering Information for XC2S200-6FGG596C

When procuring this component, ensure you specify the complete part number to receive the correct device configuration.

Part Number Breakdown

  • XC2S200 – Device family (Spartan-II, 200K gates)
  • -6 – Speed grade (fastest performance tier)
  • FGG – Package type (Fine pitch BGA, Pb-free)
  • 596 – Pin count
  • C – Temperature grade (Commercial)

Quality Certifications

This device meets stringent quality and environmental standards:

  • RoHS Directive Compliant
  • ISO 9001 Manufacturing Standards
  • Moisture Sensitivity Level (MSL) Rated

Conclusion: XC2S200-6FGG596C for Your Next Design

The AMD XC2S200-6FGG596C represents an excellent balance of performance, flexibility, and value for FPGA-based designs. Whether developing telecommunications equipment, industrial controllers, or embedded systems, this Spartan-II device provides the resources and speed necessary for success.

With 200,000 system gates, 5,292 logic cells, and the fastest -6 speed grade, the XC2S200-6FGG596C delivers professional-grade capabilities without the constraints of ASIC development. The lead-free package ensures environmental compliance while the commercial temperature rating guarantees reliable operation across standard operating conditions.

Contact authorized distributors for current pricing, availability, and technical support resources for your XC2S200-6FGG596C implementation project.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.