The AMD XC2S200-6FGG595C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional design flexibility with 200,000 system gates, 5,292 logic cells, and 284 user I/O pins. This versatile programmable logic device serves as a cost-effective ASIC replacement solution for engineers seeking unlimited reprogrammability, advanced clock management, and comprehensive I/O standard support in embedded systems and industrial applications.
Key Features of the XC2S200-6FGG595C FPGA
High-Density Logic Architecture
The XC2S200-6FGG595C incorporates a powerful logic architecture optimized for complex digital designs:
- 200,000 System Gates – Provides substantial logic capacity for demanding applications
- 5,292 Logic Cells – Enables efficient implementation of sophisticated algorithms
- 1,176 Configurable Logic Blocks (CLBs) – Arranged in a 28×42 array for optimal routing
- 284 Maximum User I/O Pins – Offers extensive connectivity options for peripheral interfaces
- Speed Grade -6 – Higher performance variant with enhanced timing characteristics
Advanced Memory Resources
The XC2S200-6FGG595C features a hierarchical memory architecture combining distributed and block RAM:
| Memory Type |
Capacity |
Configuration |
| Block RAM |
56 Kbits |
14 blocks × 4,096 bits |
| Distributed RAM |
75,264 bits |
16 bits per LUT |
| Total RAM |
131,264 bits |
Dual-port capable |
The block RAM supports fully synchronous dual-port operation with independent control signals for each port, enabling simultaneous read/write operations and built-in bus-width conversion capabilities.
XC2S200-6FGG595C Technical Specifications
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Process Technology |
0.18 μm CMOS |
| Maximum System Frequency |
Up to 200 MHz |
| Operating Temperature |
0°C to +85°C (Commercial) |
Package Information
The XC2S200-6FGG595C utilizes a Fine-pitch Ball Grid Array (FBGA) package designed for high-density PCB mounting:
- Package Type: FGG (Fine-pitch BGA, Pb-free)
- Ball Pitch: 1.0 mm
- Mounting: Surface Mount (SMD/SMT)
- RoHS Compliance: Pb-free packaging options available
Supported I/O Standards and Interface Compatibility
Versatile I/O Standard Support
The XC2S200-6FGG595C supports 16 high-performance interface standards, making it ideal for diverse connectivity requirements:
Single-Ended Standards
- LVTTL (2-24 mA drive strength)
- LVCMOS2 (2.5V)
- PCI (3.3V/5V, 33 MHz/66 MHz compliant)
- AGP-2X
Differential and High-Speed Standards
- GTL / GTL+ (Gunning Transceiver Logic)
- HSTL Class I, III, IV (High-Speed Transceiver Logic)
- SSTL2 / SSTL3 Class I and II (Stub Series Terminated Logic)
- CTT (Center Tap Terminated)
I/O Banking Architecture
The device features an 8-bank I/O architecture allowing mixed voltage operation across different sections of the chip. Each bank supports independent VCCO and VREF configurations for maximum design flexibility.
Clock Management and Distribution
Delay-Locked Loop (DLL) Technology
The XC2S200-6FGG595C incorporates four fully digital Delay-Locked Loops (DLLs) providing advanced clock management capabilities:
- Zero Propagation Delay – Eliminates clock distribution skew across the device
- Clock Multiplication – Supports 2× clock doubling for internal logic
- Clock Division – Divides source clock by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Quadrature Phase Generation – Provides 0°, 90°, 180°, and 270° phase outputs
- Board-Level Clock Mirroring – Enables multi-device synchronization
Global Clock Distribution
Four dedicated primary global clock networks ensure low-skew clock distribution to all CLB, IOB, and block RAM clock pins throughout the device.
Configuration Modes and Programming
Flexible Configuration Options
The XC2S200-6FGG595C supports multiple configuration modes for versatile system integration:
| Mode |
Data Width |
Clock Source |
Application |
| Master Serial |
1-bit |
Internal (CCLK out) |
PROM-based systems |
| Slave Serial |
1-bit |
External (CCLK in) |
Daisy-chain configurations |
| Slave Parallel |
8-bit |
External |
High-speed processor loading |
| Boundary Scan |
1-bit |
TCK |
JTAG programming/debug |
Configuration File Size
The XC2S200 requires approximately 1,335,840 bits (167 KB) of configuration data, which can be stored in serial PROMs, parallel flash, or loaded dynamically from a microprocessor.
Development Tools and Design Support
Xilinx ISE Development Environment
The XC2S200-6FGG595C is fully supported by the Xilinx ISE development system, featuring:
- Automatic mapping, placement, and routing
- Timing-driven optimization
- Comprehensive simulation support
- In-circuit debugging capabilities
- EDIF netlist compatibility
For engineers working with programmable logic devices, exploring the complete range of Xilinx FPGA solutions provides access to extensive development resources, reference designs, and technical documentation.
Design Resources
- Over 400 library primitives and macros
- HDL synthesis tool support (VHDL/Verilog)
- Static timing analysis
- Post-layout simulation with back-annotation
Application Areas for XC2S200-6FGG595C
Industrial and Commercial Applications
The XC2S200-6FGG595C Spartan-II FPGA serves diverse market segments:
Telecommunications
- Base station controllers
- Network switching equipment
- Protocol conversion bridges
Industrial Automation
- Motor control systems
- PLC implementations
- Sensor interface processing
Consumer Electronics
- Video processing pipelines
- Audio codec implementations
- Display controllers
Embedded Systems
- Microcontroller peripheral expansion
- Custom protocol interfaces
- Real-time signal processing
Advantages Over Mask-Programmed ASICs
Cost and Time-to-Market Benefits
| Advantage |
XC2S200-6FGG595C |
Traditional ASIC |
| Initial Cost |
Low |
High NRE |
| Development Time |
Weeks |
Months |
| Design Modifications |
In-field upgradeable |
Hardware replacement required |
| Volume Production |
Cost-effective |
Economical only at high volumes |
| Risk |
Minimal |
Inherent design risk |
The unlimited reprogrammability of the XC2S200-6FGG595C eliminates the initial cost and lengthy development cycles associated with mask-programmed ASICs while enabling field upgrades without hardware replacement.
Ordering Information
Part Number Nomenclature
XC2S200-6FGG595C decodes as follows:
- XC2S200 – Spartan-II device with 200K system gates
- -6 – Speed grade (higher performance)
- FGG – Fine-pitch BGA package (Pb-free)
- 595 – Pin count
- C – Commercial temperature range (0°C to +85°C)
Related Part Numbers
Engineers may also consider these related Spartan-II variants based on their specific requirements for gate density, I/O count, and package preferences.
Summary
The AMD XC2S200-6FGG595C Spartan-II FPGA delivers an optimal combination of logic density, memory resources, and I/O flexibility for cost-sensitive applications requiring high-performance programmable logic. With 200,000 system gates, 56 Kbits of block RAM, comprehensive I/O standard support, and advanced clock management features, this device enables rapid development cycles and field-upgradeable designs across telecommunications, industrial, and embedded system applications.
