The AMD XC2S200-6FGG584C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This advanced programmable logic device delivers exceptional versatility for embedded systems, industrial automation, telecommunications, and digital signal processing applications. As a cost-effective ASIC replacement solution, the XC2S200-6FGG584C offers unlimited reprogrammability with proven reliability.

Key Features of the XC2S200-6FGG584C FPGA

The XC2S200-6FGG584C incorporates the Virtex-derived architecture that made the Spartan-II family an industry standard for programmable logic solutions. This Xilinx FPGA delivers outstanding performance across demanding applications.

Core Architecture Specifications

XC2S200-6FGG584C Package Information

The FGG584 package designation indicates a Fine-pitch Ball Grid Array (FBGA) with 584 balls. This Pb-free package option (indicated by the “G” in FGG) ensures RoHS compliance while maintaining excellent thermal performance.

Package Characteristics:

• Package Type: 584-Ball Fine-pitch BGA (FBGA)
• Ball Pitch: 1.0 mm
• Lead-Free (Pb-Free): Yes
• RoHS Compliant: Yes
• Mounting Style: Surface Mount (SMD/SMT)

Speed Grade and Temperature Range

The “-6” speed grade designation indicates the device operates at the highest speed tier available for commercial applications:

• Speed Grade: -6 (highest performance tier)
• Operating Temperature: Commercial (0°C to +85°C)
• Junction Temperature: -40°C to +100°C (TJ)

Technical Specifications of the AMD XC2S200-6FGG584C

Memory Architecture

The XC2S200-6FGG584C features a sophisticated hierarchical memory system:

SelectRAM Distributed Memory:

• 16 bits per Look-Up Table (LUT)
• Total Distributed RAM: 75,264 bits
• Synchronous single-port and dual-port modes

Dedicated Block RAM:

• 14 Block RAM modules
• 4K bits per block (configurable)
• Total Block RAM: 56 Kbits
• Supports synchronous dual-port operation

Clock Management System

The XC2S200-6FGG584C includes four dedicated Delay-Locked Loops (DLLs) positioned at each corner of the die:

• Four primary low-skew global clock distribution networks
• Clock multiplication and division capabilities
• Phase shifting for precise timing control
• Clock mirroring for board-level synchronization
• Support for frequencies up to 200 MHz

I/O Capabilities and Interface Standards

Supported I/O Standards:

• LVTTL (3.3V Low-Voltage TTL)
• LVCMOS (1.5V, 2.5V, 3.3V)
• PCI 3.3V (32/64-bit, 33 MHz compliant)
• GTL and GTL+
• HSTL (Class I, II, III, IV)
• SSTL2 and SSTL3

Power Supply Requirements:

Configuration and Programming

The XC2S200-6FGG584C supports multiple configuration modes:

• Serial Configuration: Master/Slave serial modes
• Parallel Configuration: Slave parallel (SelectMAP) mode
• JTAG Boundary Scan: IEEE 1149.1 compliant
• Full Readback: Verification and observability support

Applications for the XC2S200-6FGG584C FPGA

Industrial Automation Systems

The XC2S200-6FGG584C excels in industrial control applications requiring:

• Motor control and drive systems
• PLC replacement solutions
• Sensor interface and data acquisition
• Real-time process control

Telecommunications Equipment

This Spartan-II FPGA supports demanding telecommunications applications:

• Protocol processing and conversion
• Channel coding and decoding
• Base station infrastructure
• Network switching equipment

Embedded Systems Development

The XC2S200-6FGG584C provides ideal solutions for:

• Custom peripheral controllers
• Hardware acceleration modules
• Interface bridging applications
• Rapid prototyping platforms

Digital Signal Processing

With dedicated carry logic and efficient multiplier support:

• Digital filter implementation
• Signal conditioning circuits
• Data compression algorithms
• Image processing applications

XC2S200-6FGG584C Design Resources

Development Tool Compatibility

The XC2S200-6FGG584C is fully supported by:

• Xilinx ISE Design Suite (synthesis, implementation, and programming)
• IBIS Models for signal integrity simulation
• BSDL Files for boundary scan testing
• Reference designs and application notes

PCB Design Considerations

Recommended Layout Guidelines:

• Controlled impedance routing for high-speed signals
• Proper power supply decoupling (0.1µF per VCCO bank)
• Multiple ground planes for signal integrity
• Thermal relief patterns for BGA soldering

Ordering Information for AMD XC2S200-6FGG584C

Part Number Breakdown:

Why Choose the XC2S200-6FGG584C FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG584C eliminates the high initial costs and lengthy development cycles associated with traditional ASICs while providing:

• Zero NRE (Non-Recurring Engineering) costs
• Unlimited reprogrammability
• Field-upgradeable designs
• Faster time-to-market

Proven Reliability

Built on mature 0.18µm CMOS technology, the XC2S200-6FGG584C delivers:

• Production-proven silicon
• Extensive qualification data
• Long-term supply availability
• Robust ESD protection

Comprehensive Support Ecosystem

AMD (formerly Xilinx) provides extensive support including:

• Complete datasheet documentation (DS001)
• Application notes and reference designs
• Technical support services
• Global distribution network

Summary: AMD XC2S200-6FGG584C Specifications

The AMD XC2S200-6FGG584C represents an excellent choice for engineers requiring a reliable, cost-effective FPGA solution with substantial logic capacity. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O support in a lead-free 584-ball FBGA package, this Spartan-II family member delivers the performance and flexibility needed for demanding embedded, industrial, and telecommunications applications.

For design engineers seeking proven programmable logic solutions with excellent price-performance characteristics, the XC2S200-6FGG584C continues to provide outstanding value backed by comprehensive development tools and worldwide technical support.