Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG583C Spartan-II FPGA: High-Performance Programmable Logic Device

Product Details

The AMD XC2S200-6FGG583C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional performance and flexibility for demanding embedded and industrial applications. This advanced programmable logic device combines cost-effective implementation with robust system-level features, making it an ideal solution for engineers seeking reliable FPGA technology.

XC2S200-6FGG583C Key Features and Specifications

The AMD XC2S200-6FGG583C offers an impressive array of technical specifications designed to meet the needs of modern electronic design applications.

Logic Capacity and System Gates

Specification Value
Logic Cells 5,292
System Gates 200,000
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284

Memory Architecture Specifications

Memory Type Capacity
Distributed RAM 75,264 bits
Total Block RAM 56K bits
Block RAM Blocks 14

Electrical and Operating Characteristics

Parameter Specification
Core Supply Voltage 2.5V
Maximum Clock Frequency 263 MHz
Process Technology 0.18 µm CMOS
Speed Grade -6
Package Type FGG583 (Fine Pitch BGA)
Pin Count 583
Operating Temperature Commercial (0°C to 85°C)
RoHS Compliance Pb-free (indicated by “G” in part number)

Spartan-II FPGA Architecture Overview

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG583C features a sophisticated CLB architecture that forms the core of its programmable logic capabilities. Each CLB contains four Logic Cells (LCs), with each LC comprising a 4-input function generator implemented as a Look-Up Table (LUT), dedicated storage element, and fast carry logic for arithmetic operations.

The function generators can implement any 4-input Boolean function, while the storage elements can be configured as either edge-triggered D-type flip-flops or level-sensitive latches. This flexibility enables efficient implementation of complex sequential and combinational logic designs.

SelectRAM Hierarchical Memory System

The XC2S200-6FGG583C incorporates AMD’s innovative SelectRAM technology, providing two distinct memory options:

Distributed RAM

  • 16 bits per LUT configuration
  • 75,264 total distributed RAM bits
  • Ideal for small, fast memory structures
  • Can be configured as 16×1-bit synchronous RAM per LUT
  • Two LUTs can combine for 16×2-bit or 32×1-bit configurations
  • Supports 16-bit shift register mode for high-speed data capture

Block RAM

  • 14 dedicated block RAM modules
  • 56K bits total block RAM capacity
  • Organized in two columns along vertical edges
  • Each block is four CLBs high
  • Dual-port and single-port configurations
  • Fast interfaces to external RAM
  • Ideal for large memory structures, FIFOs, and buffers

Delay-Locked Loop (DLL) Clock Management

The XC2S200-6FGG583C includes four fully digital Delay-Locked Loop circuits positioned at each corner of the die, providing advanced clock management capabilities:

  • Zero propagation delay clock distribution
  • Low clock skew between output signals
  • Clock frequency synthesis and multiplication
  • Board-level clock deskew functionality
  • Eliminates clock distribution delays
  • Supports system clock rates up to 200 MHz

Global Clock Distribution Network

The device features four primary low-skew global clock distribution nets that ensure precise timing across the entire FPGA fabric. These dedicated routing resources minimize clock skew and maximize system performance for timing-critical applications.

XC2S200-6FGG583C I/O Standards and Capabilities

Supported Interface Standards

The XC2S200-6FGG583C supports 16 high-performance I/O standards, enabling seamless integration with diverse system components:

  • LVTTL (Low Voltage TTL)
  • LVCMOS (1.5V, 2.5V, 3.3V)
  • PCI (3.3V compliant)
  • GTL and GTL+
  • HSTL (Classes I, III, IV)
  • SSTL (2 and 3)
  • CTT
  • AGP

Advanced I/O Features

  • 5V tolerant inputs on select standards (LVTTL, LVCMOS2, PCI)
  • Hot swap CompactPCI friendly operation
  • Zero hold time for simplified system timing
  • Flexible voltage banking with VCCO at 1.5V, 2.5V, or 3.3V
  • Programmable slew rate control
  • Integrated pull-up and pull-down resistors

Design and Development Resources

IEEE 1149.1 Boundary Scan Support

The XC2S200-6FGG583C includes full IEEE 1149.1 (JTAG) compatible boundary scan logic, enabling:

  • In-system programming and configuration
  • Board-level testing and debugging
  • Internal signal capture via EXTEST
  • Design verification and observability
  • Full readback capability

Configuration Options

The device supports multiple configuration modes for flexible system integration:

  • Master Serial mode
  • Slave Parallel mode
  • Slave Serial mode
  • Boundary-Scan (JTAG) mode
  • Serial PROM configuration
  • Non-volatile storage alternatives (Flash, hard drives)

Development Tool Support

The XC2S200-6FGG583C is fully supported by comprehensive development tools including:

  • AMD Vivado Design Suite
  • ISE Design Tools (legacy support)
  • Automatic mapping, placement, and routing
  • Hierarchical design entry
  • Timing analysis and optimization

XC2S200-6FGG583C Applications

The versatile XC2S200-6FGG583C FPGA is ideal for numerous applications across multiple industries:

Industrial Applications

  • Programmable Logic Controllers (PLCs)
  • Motor control systems
  • Industrial automation equipment
  • Process control instrumentation

Communication Systems

  • Protocol conversion
  • Data routing and switching
  • Telecommunications equipment
  • Network interface controllers

Consumer Electronics

  • Video processing
  • Audio signal processing
  • Display controllers
  • Gaming systems

Embedded Systems

  • Digital Signal Processing (DSP)
  • Custom peripheral interfaces
  • System-on-Chip prototyping
  • ASIC replacement solutions

Why Choose the XC2S200-6FGG583C FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG583C represents a superior alternative to mask-programmed ASICs, offering significant advantages:

  • Eliminates high initial NRE (Non-Recurring Engineering) costs
  • Reduces lengthy development cycles
  • Removes inherent risk of fixed-function devices
  • Enables field upgrades without hardware replacement
  • Supports unlimited reprogramming cycles

Proven Reliability

Built on AMD’s cost-effective 0.18 micron process technology, the Spartan-II family delivers proven reliability backed by comprehensive documentation and global support infrastructure.

Streamlined Virtex-Based Architecture

The XC2S200-6FGG583C incorporates streamlined features based on the proven Xilinx FPGA Virtex architecture, providing a familiar design environment for engineers while delivering optimized cost-performance balance.

XC2S200-6FGG583C Ordering Information

Part Number Breakdown

Code Description
XC2S200 Spartan-II 200K system gates device
-6 Speed grade (Commercial temperature only)
FG Fine Pitch Ball Grid Array package
G Pb-free (RoHS compliant) packaging
583 Pin count
C Commercial temperature range (0°C to 85°C)

Package Information

The FGG583 package provides optimal balance between I/O density and board-level integration, featuring:

  • Fine pitch BGA configuration
  • 583 solder balls
  • Compact footprint for space-constrained designs
  • Enhanced thermal performance
  • Reliable solder joint connections

Technical Documentation

Comprehensive technical resources are available for the XC2S200-6FGG583C:

  • DS001 Spartan-II FPGA Family Data Sheet (4 modules)
  • Module 1: Introduction and Ordering Information
  • Module 2: Functional Description
  • Module 3: DC and Switching Characteristics
  • Module 4: Pinout Tables

Summary

The AMD XC2S200-6FGG583C Spartan-II FPGA delivers an exceptional combination of performance, flexibility, and value for demanding programmable logic applications. With 200,000 system gates, 5,292 logic cells, extensive memory resources, and comprehensive I/O support, this device enables engineers to implement complex designs while maintaining cost efficiency and time-to-market advantages over traditional ASIC solutions.

Whether you’re designing industrial control systems, communication equipment, or embedded applications, the XC2S200-6FGG583C provides the programmable logic foundation for success.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.