The AMD XC2S200-6FGG582C is a powerful field-programmable gate array (FPGA) from the proven Spartan-II family, engineered to deliver exceptional performance and reliability for demanding industrial, commercial, and embedded applications. This advanced programmable logic device combines cost-effective implementation with robust functionality, making it an ideal choice for engineers seeking reliable FPGA solutions with unlimited reprogrammability.
Key Features of the XC2S200-6FGG582C FPGA
The XC2S200-6FGG582C offers a comprehensive feature set that makes it suitable for a wide range of digital design applications:
High-Capacity Logic Architecture
The XC2S200-6FGG582C features 200,000 system gates with 5,292 logic cells organized in a 28 x 42 CLB (Configurable Logic Block) array totaling 1,176 CLBs. This substantial logic capacity enables complex digital designs while maintaining cost-effectiveness compared to traditional ASIC solutions.
Advanced Memory Resources
This Xilinx FPGA integrates hierarchical SelectRAM memory architecture:
- 75,264 bits of distributed RAM for flexible local storage
- 56 Kbits of dedicated block RAM organized in 14 memory blocks
- Configurable 4K-bit block RAM modules with dual-port capability
- 16 bits per LUT distributed RAM configuration
Superior I/O Capabilities
The XC2S200-6FGG582C provides extensive I/O flexibility with up to 284 user I/O pins supporting 16 high-performance interface standards including:
- LVTTL and LVCMOS (1.5V, 2.5V, 3.3V)
- PCI-compliant interfaces
- GTL and GTL+ protocols
- HSTL and SSTL standards
- Hot-swap Compact PCI friendly operation
Technical Specifications Table
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (14 blocks) |
| DLLs |
4 |
| Speed Grade |
-6 (Commercial) |
| Package Type |
FGG582 (Fine-Pitch BGA) |
| Core Voltage |
2.5V |
| I/O Voltage |
1.5V, 2.5V, or 3.3V |
| Process Technology |
0.18 µm CMOS |
| Operating Temperature |
0°C to +85°C (Commercial) |
| RoHS Compliance |
Pb-free (indicated by “G” in part number) |
Package Information and Pinout Details
The XC2S200-6FGG582C utilizes a 582-ball Fine-Pitch Ball Grid Array (FBGA) package, providing excellent thermal performance and signal integrity for high-speed applications. The “G” designation in the part number indicates Pb-free (RoHS compliant) packaging options, ensuring compliance with environmental regulations.
Part Number Breakdown
- XC2S200: Device type (Spartan-II, 200K gates)
- -6: Speed grade (highest performance, Commercial only)
- FG: Fine-pitch BGA package type
- G: Pb-free packaging option
- 582: Pin count
- C: Commercial temperature range (0°C to +85°C)
Clock Management and Distribution
The XC2S200-6FGG582C incorporates four dedicated Delay-Locked Loops (DLLs), one at each corner of the die, providing advanced clock control capabilities:
- Clock deskewing for zero propagation delay
- Clock multiplication and division
- Coarse and fine phase shifting
- Four primary low-skew global clock distribution nets
- Board-level clock deskewing support
Spartan-II FPGA Architecture Overview
Configurable Logic Blocks (CLBs)
Each CLB contains four logic cells (LCs) with:
- Four-input look-up tables (LUTs)
- Dedicated carry logic for high-speed arithmetic
- Efficient multiplier support
- Cascade chains for wide-input functions
- Abundant registers/latches with enable, set, and reset
Input/Output Blocks (IOBs)
The IOBs provide programmable I/O with:
- Selectable drive strength and slew rate control
- Built-in pull-up and pull-down resistors
- Zero hold time for simplified system timing
- IEEE 1149.1 compatible boundary scan logic (JTAG)
- Full readback capability for design verification
Applications for the XC2S200-6FGG582C
The XC2S200-6FGG582C excels in numerous application areas:
Industrial Automation and Control
- PLC (Programmable Logic Controller) implementations
- Motor control systems
- Process automation equipment
- Sensor interface and data acquisition
Telecommunications Equipment
- Protocol converters and bridges
- Network interface cards
- SDH/SONET equipment
- Base station controllers
Consumer Electronics
- Digital video processing
- Audio equipment
- Gaming hardware
- Display controllers
Embedded Systems
- ASIC prototyping and replacement
- Custom peripheral interfaces
- Co-processor implementations
- Real-time signal processing
Development Tools and Software Support
The XC2S200-6FGG582C is fully supported by Xilinx ISE development tools, providing:
- Automatic mapping, placement, and routing
- Comprehensive simulation and verification
- In-system programming via JTAG interface
- Unlimited design iterations and field upgrades
Advantages Over Mask-Programmed ASICs
The Spartan-II XC2S200-6FGG582C offers significant benefits compared to traditional ASIC solutions:
- No NRE Costs: Eliminates expensive mask tooling charges
- Rapid Development: Reduces time-to-market with fast design iterations
- Field Upgradability: Enables design improvements without hardware changes
- Risk Reduction: Allows design modifications throughout product lifecycle
- Lower Inventory Risk: Single programmable device replaces multiple ASIC variants
DC Electrical Characteristics
Recommended Operating Conditions
| Parameter |
Min |
Typ |
Max |
Unit |
| VCCINT (Core Supply) |
2.375 |
2.5 |
2.625 |
V |
| VCCO (Output Supply) |
1.4 |
– |
3.6 |
V |
| Junction Temperature |
0 |
– |
85 |
°C |
Power Consumption
The XC2S200-6FGG582C features a low-power segmented routing architecture that minimizes dynamic power consumption while maintaining high performance. The 0.18 µm CMOS process technology ensures efficient operation across all operating conditions.
Ordering Information and Availability
The XC2S200-6FGG582C is available through authorized AMD/Xilinx distributors worldwide. When ordering, ensure the complete part number is specified to receive the correct speed grade, package type, and temperature range for your application requirements.
Related Part Numbers in the XC2S200 Family
- XC2S200-5FG456C (Speed grade -5, 456-pin FBGA)
- XC2S200-6PQ208C (Speed grade -6, 208-pin PQFP)
- XC2S200-5FGG256C (Speed grade -5, 256-pin FBGA, Pb-free)
Quality and Reliability
AMD maintains rigorous quality standards for all Spartan-II devices:
- 100% tested before shipment
- Comprehensive reliability testing programs
- Extended product lifecycle support
- ISO 9001 certified manufacturing facilities
Conclusion
The AMD XC2S200-6FGG582C represents an excellent balance of performance, features, and cost-effectiveness in the FPGA market. With its robust Spartan-II architecture, comprehensive I/O standards support, integrated memory resources, and proven reliability, this device provides engineers with a versatile platform for implementing complex digital designs across diverse application domains.
Whether developing prototypes or production systems, the XC2S200-6FGG582C delivers the flexibility, performance, and value needed for successful FPGA implementations backed by comprehensive documentation, development tools, and global support infrastructure.
