The AMD XC2S200-6FGG581C is a powerful field-programmable gate array from the renowned Spartan-II FPGA family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for demanding digital signal processing and embedded control applications.
XC2S200-6FGG581C Key Specifications and Features
The XC2S200-6FGG581C combines robust architecture with versatile I/O capabilities in a 581-pin Fine-pitch Ball Grid Array (FBGA) package. This high-density package configuration provides maximum user I/O access for complex system designs requiring extensive external connectivity.
Core Architecture Specifications
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 total CLBs) |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (14 blocks) |
| Maximum User I/O |
284 |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Commercial) |
| Package |
FGG581 (581-pin FBGA) |
| Process Technology |
0.18µm CMOS |
Advanced Memory Architecture
The XC2S200-6FGG581C features a sophisticated dual-memory architecture that enhances design flexibility. The SelectRAM hierarchical memory system includes 16 bits per LUT distributed RAM for efficient local storage and fourteen dedicated 4K-bit block RAM modules configured as fully synchronous dual-port memory with independent control signals for each port.
Block RAM supports configurable aspect ratios from 4096×1 to 256×16, enabling optimal memory organization for diverse application requirements. This flexibility makes the XC2S200-6FGG581C particularly suitable for data buffering, FIFO implementations, and lookup table operations.
Spartan-II FPGA Configurable Logic Block Architecture
Each configurable logic block in the XC2S200-6FGG581C contains four logic cells organized into two slices. Every logic cell includes a 4-input look-up table capable of implementing any Boolean function of four variables, a carry-and-control multiplexer for arithmetic operations, and a dedicated D-type flip-flop with clock enable and synchronous/asynchronous set/reset capabilities.
Fast Carry Logic and Arithmetic Performance
The XC2S200-6FGG581C incorporates dedicated fast carry logic chains that span the entire height of the CLB array. This architecture enables high-speed arithmetic operations essential for digital signal processing applications, including multiplication, accumulation, and complex filter implementations.
XC2S200-6FGG581C Clock Management and DLL Technology
The device features four Delay-Locked Loops positioned at each corner of the die, providing comprehensive clock management capabilities. These DLLs eliminate clock distribution skew, multiply and divide clock frequencies, and enable precise phase shifting for timing-critical applications.
Global Clock Distribution Network
The XC2S200-6FGG581C provides four primary low-skew global clock distribution networks plus 24 secondary local clock nets. This hierarchical clocking architecture ensures timing integrity across complex designs while minimizing power consumption through localized clock distribution.
Versatile I/O Standards and SelectIO Technology
The XC2S200-6FGG581C supports multiple I/O standards through its advanced SelectIO interface technology. Engineers can configure individual I/O pins to comply with various voltage and signaling requirements within the same device.
Supported I/O Standards
The device supports industry-standard interfaces including LVTTL, LVCMOS (2.5V and 3.3V), PCI (33MHz and 66MHz at 3.3V), GTL and GTL+, HSTL (Class I, III, and IV), SSTL2 (Class I and II), SSTL3 (Class I and II), AGP-2X, and CTT standards. LVTTL, LVCMOS2, and PCI modes provide 5V tolerance for legacy system compatibility.
I/O Banking Configuration
The XC2S200-6FGG581C organizes I/O resources into eight independent banks, with each bank having dedicated VCCO power pins. This banking architecture allows different I/O standards to coexist on the same device while maintaining proper voltage isolation and signal integrity.
XC2S200-6FGG581C Industrial Applications
The robust architecture and comprehensive feature set make the XC2S200-6FGG581C suitable for diverse industrial and commercial applications.
Communications and Networking Equipment
The high gate count and flexible I/O configuration make this Xilinx FPGA ideal for implementing network routers, switches, and protocol converters. The device’s block RAM resources enable efficient packet buffering, while the DLL-based clock management supports multiple data rate interfaces.
Industrial Automation and Control Systems
For industrial control applications, the XC2S200-6FGG581C provides the real-time processing capability required for motor control, process automation, and programmable logic controller implementations. The fast carry logic chains enable precise timing calculations essential for closed-loop control systems.
Digital Signal Processing Applications
The combination of high logic density, abundant distributed RAM, and block RAM makes the XC2S200-6FGG581C well-suited for DSP implementations including FIR and IIR filters, FFT processors, and audio/video processing systems. The device supports clock frequencies up to 263MHz for compute-intensive operations.
Medical and Diagnostic Equipment
The device’s reliability and reconfigurability make it appropriate for medical imaging systems, patient monitoring equipment, and diagnostic instruments where design flexibility and consistent performance are essential requirements.
Automotive Electronics Systems
The XC2S200-6FGG581C supports automotive applications including advanced driver-assistance systems, infotainment platforms, and vehicle control modules requiring reprogrammable logic with robust I/O interfacing capabilities.
Configuration and Programming Options
The XC2S200-6FGG581C supports multiple configuration modes for maximum design flexibility. Available options include Master Serial mode using dedicated configuration PROMs, Slave Serial mode for daisy-chain configurations, SelectMAP parallel mode for fastest configuration times, and JTAG boundary-scan for both configuration and debugging.
In-System Programmability
The device features unlimited reprogrammability with SRAM-based configuration memory. This architecture enables field upgrades without hardware modification, significantly reducing development cycles and extending product lifecycles compared to mask-programmed ASIC alternatives.
XC2S200-6FGG581C Development Tools and Design Resources
Engineers developing with the XC2S200-6FGG581C have access to comprehensive design resources. The Xilinx ISE Design Suite provides synthesis, implementation, and simulation capabilities specifically optimized for Spartan-II architecture. Available documentation includes the complete Spartan-II FPGA Family Data Sheet (DS001), user guides, configuration manuals, and application notes covering best practices for power management, timing closure, and PCB layout.
Ordering Information and Part Number Breakdown
The XC2S200-6FGG581C part number designation follows AMD/Xilinx naming conventions where XC2S200 identifies the Spartan-II 200K device, -6 indicates the commercial speed grade optimized for high-performance applications, FGG indicates the lead-free Fine-pitch Ball Grid Array package variant, and 581C specifies the 581-pin commercial temperature range (0°C to 85°C) configuration.
Why Choose the XC2S200-6FGG581C FPGA
The XC2S200-6FGG581C represents a cost-effective solution for applications requiring programmable logic with proven reliability. Its Spartan-II architecture provides an ideal balance between performance and power efficiency, while the extensive I/O capabilities and memory resources support complex system implementations without external memory expansion. The device’s reprogrammability enables rapid prototyping and in-field updates, reducing time-to-market and supporting product evolution throughout the design lifecycle.
