The AMD XC2S200-6FGG579C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This powerful programmable logic device delivers exceptional value for engineers and designers seeking reliable, cost-effective solutions for digital circuit implementation. As a Xilinx FPGA device now under AMD’s portfolio, the XC2S200-6FGG579C combines robust architecture with advanced configurability.

Key Features of the AMD XC2S200-6FGG579C FPGA

The XC2S200-6FGG579C stands out as a superior alternative to traditional mask-programmed ASICs. This FPGA eliminates the high initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC design. The device’s unlimited reprogrammability enables field upgrades without hardware replacement.

Core Specifications Overview

Spartan-II Architecture and Design Benefits

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG579C features a sophisticated CLB architecture that serves as the foundation for implementing complex digital designs. Each CLB contains four Logic Cells (LCs), organized in two identical slices, providing exceptional flexibility for logic implementation.

Each Logic Cell includes:

• 4-input Look-Up Table (LUT) function generator
• Dedicated carry logic for high-speed arithmetic
• Edge-triggered D-type flip-flop or level-sensitive latch
• Synchronous set and reset capabilities

SelectRAM Hierarchical Memory System

The Spartan-II XC2S200-6FGG579C incorporates a powerful hierarchical memory architecture that maximizes design flexibility:

Distributed RAM Features:

• 16 bits per LUT configuration
• Total capacity of 75,264 distributed RAM bits
• Ideal for shallow memory structures within CLBs

Block RAM Capabilities:

• 14 dedicated block RAM modules
• 4,096 bits per block (configurable)
• 56K total block RAM bits
• Dual-port synchronous operation
• Independent read/write control for each port
• Built-in bus-width conversion

Advanced Clock Management with DLL Technology

Delay-Locked Loop (DLL) Specifications

The XC2S200-6FGG579C includes four fully digital Delay-Locked Loops that provide sophisticated clock management capabilities:

• Zero propagation delay clock distribution
• Low clock skew across the entire device
• Clock doubling functionality
• Clock division by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
• Four quadrature phase outputs
• Board-level clock deskewing via clock mirror mode

Versatile I/O Standards and Interface Support

Supported I/O Standards

The XC2S200-6FGG579C provides comprehensive support for industry-standard interfaces:

I/O Banking Architecture

The FPGA features eight I/O banks for optimal signal routing and voltage compatibility. This banking structure enables designers to implement multiple I/O standards within a single device while maintaining signal integrity.

Configuration Options and Programming Modes

Multiple Configuration Methods

The XC2S200-6FGG579C supports flexible configuration through several modes:

• Master Serial Mode: FPGA controls configuration via internal CCLK
• Slave Serial Mode: External device controls configuration timing
• Slave Parallel Mode: High-speed byte-wide programming
• Boundary-Scan Mode: IEEE 1149.1 JTAG configuration

Configuration File Requirements

Boundary Scan and Testing Capabilities

IEEE 1149.1 Compliance

The XC2S200-6FGG579C implements full IEEE 1149.1 boundary-scan support with dedicated TAP pins:

Supported Instructions:

• EXTEST
• SAMPLE/PRELOAD
• BYPASS
• IDCODE
• USERCODE
• CFG_IN/CFG_OUT
• INTEST

Speed Grade -6 Performance Characteristics

The -6 speed grade designation indicates higher performance operation, making the XC2S200-6FGG579C suitable for demanding applications requiring maximum clock frequencies. This speed grade is available exclusively in the commercial temperature range.

Operating Conditions

FGG579 Package Specifications

Pb-Free BGA Package Benefits

The FGG579 package designation indicates:

• F: Fine-pitch Ball Grid Array
• G: Pb-free (RoHS compliant)
• G: Lead-free ball composition
• 579: Total pin count

This package provides excellent thermal characteristics and reliable solder connections for high-density PCB designs.

Target Applications for XC2S200-6FGG579C

The XC2S200-6FGG579C excels in numerous application domains:

Industrial and Commercial Applications

• Digital signal processing systems
• Communications infrastructure equipment
• Network routers and switches
• Video and image processing
• Industrial automation controllers
• Medical instrumentation
• Test and measurement equipment

Design Development Benefits

• Rapid prototyping with unlimited reprogramming
• Field-upgradeable designs
• Reduced time-to-market
• Lower development costs compared to ASICs
• In-system debugging capabilities

Development Tool Support

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG579C is fully supported by the Xilinx ISE development environment, providing:

• Fully automatic mapping, placement, and routing
• Timing-driven implementation
• Comprehensive simulation support
• Static timing analysis
• In-circuit debugging with readback

Why Choose the AMD XC2S200-6FGG579C

The XC2S200-6FGG579C offers compelling advantages for your next FPGA design project:

1. Cost-Effective Performance: Delivers 200,000 system gates at competitive pricing
2. Design Flexibility: Unlimited reprogramming enables iterative development
3. Robust Memory: 56K block RAM plus 75K distributed RAM bits
4. Advanced Clocking: Four DLLs provide precise clock management
5. Comprehensive I/O: Support for 16 industry-standard interfaces
6. Environmental Compliance: Pb-free packaging meets RoHS requirements
7. Proven Architecture: Based on the reliable Virtex FPGA technology foundation

Ordering Information

Part Number Breakdown: XC2S200-6FGG579C

• XC2S200: Device type (Spartan-II, 200K gates)
• -6: Speed grade (Higher performance)
• FGG: Fine-pitch BGA, Pb-free package
• 579: Pin count
• C: Commercial temperature range (0°C to +85°C)