The AMD XC2S200-6FGG578C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional programmable logic capabilities for demanding digital design applications. This 200,000 system gate FPGA combines advanced architecture with cost-effective implementation, making it an ideal solution for telecommunications, industrial automation, automotive systems, and embedded applications.

XC2S200-6FGG578C Key Features and Benefits

The XC2S200-6FGG578C offers engineers a powerful combination of logic density, memory resources, and I/O flexibility. This Xilinx FPGA device provides a superior alternative to mask-programmed ASICs, eliminating initial costs, lengthy development cycles, and the inherent risks associated with conventional application-specific integrated circuits.

Core Architecture Specifications

The XC2S200-6FGG578C is built on AMD’s proven Spartan-II architecture, featuring:

Speed Grade and Performance Characteristics

The “-6” speed grade designation indicates this device operates at the highest performance tier within the Spartan-II family. The XC2S200-6FGG578C supports system performance up to 200 MHz, enabling implementation of complex digital signal processing algorithms and high-speed communication interfaces.

XC2S200-6FGG578C Package Information

FGG578 Fine-Pitch Ball Grid Array Package

The FGG578 package configuration provides optimal board-level integration with the following characteristics:

The “G” designation in the part number indicates this is a Pb-free (lead-free) package option, ensuring compliance with RoHS (Restriction of Hazardous Substances) environmental regulations.

Detailed Technical Specifications

Configurable Logic Block (CLB) Architecture

Each Configurable Logic Block in the XC2S200-6FGG578C contains two Logic Cells (LCs), with each LC featuring:

• One 4-input Look-Up Table (LUT)
• One dedicated flip-flop with enable, set, and reset
• Dedicated carry logic for high-speed arithmetic operations
• Cascade chain support for wide-input functions

The 28 x 42 CLB array provides 1,176 total CLBs, delivering substantial logic capacity for complex digital designs including state machines, counters, encoders, and custom processing units.

Block RAM Memory Resources

The XC2S200-6FGG578C includes 14 dedicated block RAM modules totaling 56K bits of on-chip memory. Key block RAM features include:

• True dual-port RAM operation with independent read/write ports
• Configurable data widths: 1, 2, 4, 8, or 16 bits
• Synchronous operation with independent clock domains
• 4,096-bit capacity per RAM block
• Support for single-port RAM, dual-port RAM, and ROM configurations

Distributed RAM Capabilities

In addition to block RAM, the XC2S200-6FGG578C provides 75,264 bits of distributed RAM implemented within the CLB fabric. Each LUT can be configured as 16 bits of RAM, offering:

• Low-latency memory access
• Single-clock-cycle read operations
• Synchronous write operations
• Flexible memory organization

Clock Management with Delay-Locked Loops

The XC2S200-6FGG578C features four Delay-Locked Loops (DLLs), one positioned at each corner of the die. DLL capabilities include:

• Zero-propagation delay clock distribution
• Clock multiplication and division
• Quadrature phase generation
• Board-level clock deskewing
• Clock mirroring for multi-device synchronization

Supported clock division ratios: 1.5, 2, 2.5, 3, 4, 5, 8, and 16.

Input/Output Standards and Connectivity

Supported I/O Standards

The XC2S200-6FGG578C supports 16 selectable I/O standards, enabling seamless integration with various system components:

• LVTTL (Low-Voltage TTL)
• LVCMOS (Low-Voltage CMOS)
• PCI (Peripheral Component Interconnect)
• GTL (Gunning Transceiver Logic)
• GTL+
• HSTL (High-Speed Transceiver Logic)
• SSTL (Stub Series Terminated Logic)
• AGP (Accelerated Graphics Port)

I/O Bank Organization

The device I/O pins are organized into banks, allowing different voltage levels and standards to coexist on the same device. This flexibility simplifies system design when interfacing with multiple voltage domains.

Power Supply Requirements

Core and I/O Voltage Specifications

The 2.5V core voltage ensures low power consumption while maintaining high-speed operation, making the XC2S200-6FGG578C suitable for power-sensitive applications.

Configuration Options

In-System Programming

The XC2S200-6FGG578C supports multiple configuration modes:

• Master Serial Mode
• Slave Serial Mode
• Master SelectMAP (parallel) Mode
• Slave SelectMAP Mode
• Boundary-Scan (JTAG) Mode

IEEE 1149.1 Boundary Scan Support

Full compliance with IEEE 1149.1 boundary scan standard enables:

• Board-level testing and debugging
• In-system programming via JTAG
• Device interconnect testing
• Internal signal observation

Application Areas for XC2S200-6FGG578C

Telecommunications Equipment

The high logic density and memory resources make the XC2S200-6FGG578C ideal for:

• Network routers and switches
• Protocol converters
• Baseband processing
• Channel coding and decoding

Industrial Automation

Key industrial applications include:

• Motor control systems
• PLC (Programmable Logic Controller) implementations
• Sensor interface and signal conditioning
• Real-time data acquisition

Automotive Electronics

The commercial temperature rating supports:

• Infotainment systems
• Driver assistance processing
• Body electronics control
• Instrument cluster displays

Consumer Electronics

Cost-effective implementation for:

• Video processing systems
• Audio processing equipment
• Display controllers
• Gaming peripherals

Development Tools and Software Support

Design Software Compatibility

The XC2S200-6FGG578C is fully supported by AMD’s ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities.

Supported design entry methods include:

• Schematic capture
• HDL design (VHDL and Verilog)
• IP core integration
• Mixed design methodologies

Simulation and Verification

Complete simulation support through industry-standard tools enables:

• Functional simulation
• Timing simulation
• Power analysis
• Static timing analysis

Ordering Information and Part Number Breakdown

XC2S200-6FGG578C Part Number Decoder

Quality and Reliability Standards

The XC2S200-6FGG578C meets stringent quality standards including:

• ISO 9001 manufacturing certification
• RoHS compliance for environmental responsibility
• JEDEC moisture sensitivity level ratings
• Comprehensive reliability testing per JEDEC standards

Migration and Upgrade Path

For designs requiring additional resources, consider these Spartan family upgrade options:

Conclusion

The AMD XC2S200-6FGG578C delivers an exceptional balance of performance, logic density, and cost-effectiveness for programmable logic applications. With 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and comprehensive I/O flexibility in a lead-free FGG578 package, this Spartan-II FPGA provides engineers with a reliable, field-upgradeable solution that eliminates the risks and costs associated with traditional ASIC development.

Whether implementing complex digital signal processing algorithms, high-speed communication interfaces, or sophisticated control systems, the XC2S200-6FGG578C offers the programmability, performance, and flexibility required for successful product development and rapid time-to-market.