The AMD XC2S200-6FGG575C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional performance for demanding digital logic applications. This 575-pin fine-pitch BGA device combines 200,000 system gates with advanced programmable capabilities, making it the ideal choice for engineers seeking reliable, cost-effective programmable logic solutions for industrial, telecommunications, and embedded system designs.
Key Features of the XC2S200-6FGG575C FPGA
The XC2S200-6FGG575C offers an impressive array of features that set it apart from conventional ASICs and competing programmable devices:
High-Density Logic Architecture
- 200,000 System Gates: Provides substantial logic resources for implementing complex digital designs
- 5,292 Logic Cells: Offers flexibility for sophisticated signal processing and control applications
- 1,176 Configurable Logic Blocks (CLBs): Arranged in a 28 × 42 array for maximum design flexibility
- 284 Maximum User I/Os: Extensive input/output connectivity for interfacing with external systems
Advanced Memory Subsystem
The XC2S200-6FGG575C incorporates a robust dual-memory architecture:
- 56 Kbits Block RAM: Fourteen 4-Kbit dual-port RAM blocks for high-speed data buffering
- 75,264 Bits Distributed RAM: Fine-grained memory resources distributed throughout the CLB array
- Configurable Port Widths: Block RAM supports 1, 2, 4, 8, or 16-bit data widths per port
Clock Management with Delay-Locked Loops (DLLs)
The device features four dedicated DLL circuits positioned at each die corner, providing:
- Zero propagation delay clock distribution
- Low clock skew across the entire device
- Board-level clock deskewing capability
- System clock frequencies up to 200 MHz
XC2S200-6FGG575C Technical Specifications
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG575C |
| Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits (14 blocks) |
| DLLs |
4 |
| Process Technology |
0.18 µm |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Fastest) |
| Package |
575-Ball Fine-Pitch BGA (Pb-Free) |
| Temperature Range |
Commercial (0°C to 85°C) |
| Maximum Frequency |
263 MHz |
Understanding the XC2S200-6FGG575C Part Number
The part number follows AMD/Xilinx naming conventions:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (-6 is the fastest commercial option)
- FGG: Fine-pitch Ball Grid Array, Pb-free (RoHS compliant)
- 575: 575-ball package configuration
- C: Commercial temperature range (0°C to 85°C)
Spartan-II FPGA Architecture Overview
The XC2S200-6FGG575C is built on the proven Spartan-II architecture, featuring:
Configurable Logic Blocks (CLBs)
Each CLB contains four logic cells organized as two slices. Every slice includes:
- Two 4-input function generators (LUTs)
- Two storage elements (flip-flops or latches)
- Dedicated carry logic for arithmetic operations
- Multiplexer resources for wide function implementation
Input/Output Blocks (IOBs)
The IOBs surrounding the CLB array support:
- 16 Selectable I/O Standards: Including LVTTL, LVCMOS, GTL+, SSTL, HSTL, and PCI
- Programmable Drive Strength: 2 mA to 24 mA output current
- Input Delay Elements: For precise timing control
- DDR Support: Double data rate register capabilities
VersaRing Routing Architecture
The XC2S200-6FGG575C features VersaRing routing between the CLB array and IOBs, enabling:
- Simplified pin-swapping during design iterations
- Pin-locking for fixed PCB layouts
- Reduced time-to-market for hardware development
Applications for the XC2S200-6FGG575C
This versatile Xilinx FPGA is suitable for diverse applications:
Telecommunications Infrastructure
- Base station controllers
- Channel interface cards
- Protocol converters
- Digital up/down converters
Industrial Automation
- Motor control systems
- PLC implementations
- Sensor interface modules
- Real-time data acquisition
Embedded Systems
- Microcontroller peripherals
- Custom coprocessors
- Bus bridges and protocol translators
- Hardware accelerators
Consumer Electronics
- Video processing pipelines
- Audio DSP implementations
- Display controllers
- Interface adapters
XC2S200-6FGG575C Configuration Options
The device supports multiple configuration modes:
Master Serial Mode
- FPGA generates configuration clock (CCLK)
- Interfaces directly with Xilinx serial PROMs
- Single-device or daisy-chain configurations
Slave Serial Mode
- External device provides CCLK
- Ideal for processor-controlled configuration
- Supports daisy-chaining multiple FPGAs
Slave Parallel Mode
- 8-bit parallel data interface
- Higher configuration speeds
- SelectMAP protocol support
JTAG/Boundary Scan Mode
- IEEE 1149.1 compliant
- In-system programming capability
- Chain configuration support
Development Tools and Software Support
Design implementation for the XC2S200-6FGG575C is supported by:
Xilinx ISE Design Suite
- Complete synthesis, implementation, and verification flow
- Constraint-driven place and route
- Static timing analysis
- Bitstream generation
Third-Party EDA Tools
- Synopsys Synplify synthesis
- Mentor Graphics ModelSim simulation
- Various HDL editors and analyzers
Why Choose the XC2S200-6FGG575C Over ASICs?
The XC2S200-6FGG575C provides significant advantages over mask-programmed ASICs:
Reduced Development Risk
- No NRE (non-recurring engineering) costs
- Immediate design verification on actual hardware
- Simple design modifications without new masks
Faster Time-to-Market
- Prototype in days, not months
- Field-upgradable designs
- Parallel PCB and logic development
Design Flexibility
- In-system reprogrammability
- Algorithm updates without hardware changes
- Multi-version support from single hardware platform
Ordering Information for XC2S200-6FGG575C
When sourcing the XC2S200-6FGG575C, consider:
Package Options
- FGG575: Pb-free fine-pitch BGA (RoHS compliant)
- The “G” designation indicates lead-free packaging
Speed Grades Available
- -6: Fastest speed grade (commercial temperature only)
- -5: Standard speed grade (commercial and industrial)
Temperature Ranges
- C: Commercial (0°C to +85°C)
- I: Industrial (-40°C to +100°C) — available in -5 speed grade
XC2S200-6FGG575C Design Considerations
Power Supply Requirements
- VCCINT: 2.5V core supply (±5% tolerance)
- VCCO: Bank-specific I/O voltage (1.5V to 3.3V depending on standard)
- Proper decoupling with 0.1 µF and bulk capacitors
PCB Layout Guidelines
- Maintain recommended BGA escape routing
- Follow thermal pad guidelines for heat dissipation
- Implement proper ground planes for signal integrity
Configuration Storage
- Compatible with Xilinx XC18V series serial PROMs
- Platform Flash memories for larger configurations
- External processors for dynamic reconfiguration
Conclusion: XC2S200-6FGG575C Performance Summary
The AMD XC2S200-6FGG575C delivers an optimal balance of performance, flexibility, and cost-effectiveness for medium-density FPGA applications. With 200,000 system gates, comprehensive memory resources, advanced clock management, and support for 16 I/O standards, this Spartan-II device remains a reliable choice for legacy designs and cost-sensitive applications requiring proven programmable logic technology.
Whether implementing digital signal processing algorithms, custom interfaces, or embedded control systems, the XC2S200-6FGG575C provides the resources and performance needed for successful design implementation.
