The AMD XC2S200-6FGG574C is a high-performance field-programmable gate array (FPGA) from the renowned Spartan-II family. This versatile programmable logic device delivers exceptional processing capabilities with 200,000 system gates, making it an ideal solution for complex digital design applications. Engineers and developers worldwide rely on the XC2S200-6FGG574C for telecommunications, industrial automation, consumer electronics, and embedded system designs.

XC2S200-6FGG574C Key Features and Benefits

The AMD XC2S200-6FGG574C stands out in the FPGA market due to its robust architecture and cost-effective performance. This device combines flexible programmability with reliable operation, offering significant advantages over traditional mask-programmed ASICs.

Superior Alternative to ASICs

Unlike conventional ASICs, the XC2S200-6FGG574C eliminates lengthy development cycles and reduces initial costs. Furthermore, its field-programmable nature allows design upgrades without hardware replacement. This flexibility accelerates time-to-market while minimizing development risks.

High-Density Logic Resources

With 5,292 logic cells arranged in a 28 × 42 configurable logic block (CLB) array, this FPGA provides substantial resources for implementing sophisticated digital designs. The device contains 1,176 total CLBs, enabling complex signal processing and control system implementations.

XC2S200-6FGG574C Technical Specifications

Spartan-II FPGA Architecture Overview

The XC2S200-6FGG574C utilizes the proven Spartan-II architecture, which consists of a regular, flexible arrangement of programmable elements. Understanding this architecture helps engineers maximize device utilization.

Configurable Logic Blocks (CLBs)

CLBs form the core computational fabric of the XC2S200-6FGG574C. Each CLB contains multiple slices with look-up tables (LUTs), flip-flops, and carry logic. Consequently, designers can implement combinational logic, sequential circuits, and arithmetic functions efficiently.

Input/Output Blocks (IOBs)

A perimeter of programmable IOBs surrounds the CLB array. These blocks support 16 different I/O standards, including LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL. As a result, the XC2S200-6FGG574C interfaces seamlessly with various system components.

Dedicated Block RAM

The integrated 56 Kbits of block RAM can be configured as single-port RAM, dual-port RAM, or ROM. Additionally, the distributed RAM architecture provides 75,264 bits for local storage needs. This dual-memory approach offers flexibility for diverse application requirements.

Delay-Locked Loops (DLLs)

Four DLLs, positioned at each corner of the die, enable precise clock management. These DLLs provide clock deskew, frequency synthesis, and phase shifting capabilities. Therefore, designers achieve optimal timing performance across the entire device.

XC2S200-6FGG574C Package Information

The FGG574 package offers a compact yet accessible ball grid array format. This 574-pin fine-pitch BGA provides excellent thermal performance and signal integrity.

Package Characteristics

• Package Style: Fine-Pitch Ball Grid Array (FBGA)
• Total Pins: 574
• Ball Pitch: 1.0 mm
• Lead-Free: Yes (Pb-free compliant, indicated by “G” in part number)
• Mounting: Surface mount technology (SMT)

Pin Configuration Benefits

The high pin count accommodates all 284 user I/O pins plus dedicated power, ground, and configuration pins. Moreover, the BGA format ensures reliable solder joints and supports automated assembly processes.

Application Areas for XC2S200-6FGG574C

The versatility of the XC2S200-6FGG574C makes it suitable for numerous applications across various industries.

Telecommunications

• Base station equipment
• Network switches and routers
• Protocol conversion systems
• Data encryption modules

Industrial Automation

• Motor control systems
• PLC coprocessors
• Machine vision preprocessing
• Sensor interface aggregation

Consumer Electronics

• Set-top boxes
• Digital displays
• Audio/video processing
• Gaming peripherals

Embedded Systems

• Custom processor interfaces
• Peripheral controllers
• Bridge applications
• Prototype development platforms

For more Xilinx FPGA solutions and product availability, explore our comprehensive catalog.

Development Tools and Software Support

The XC2S200-6FGG574C is fully supported by industry-standard development tools.

Design Entry Options

Engineers can use VHDL, Verilog, or schematic capture for design entry. The Xilinx ISE Design Suite provides complete synthesis, implementation, and verification capabilities. Additionally, third-party synthesis tools from Synopsys and Mentor Graphics maintain full compatibility.

Configuration Options

Multiple configuration modes accommodate different system architectures. The device supports Master Serial, Slave Serial, and Master SelectMAP modes. Configuration data can be stored in compatible PROMs or delivered from system processors.

Debugging and Verification

Built-in JTAG boundary scan (IEEE 1149.1) enables in-system debugging. This feature simplifies board-level testing and accelerates the debugging process significantly.

XC2S200-6FGG574C Speed Grade Explanation

The “-6” speed grade designation indicates the fastest variant in the Spartan-II XC2S200 lineup.

Speed Grade Comparison

Timing Considerations

The -6 speed grade delivers the lowest propagation delays and fastest setup times. However, this speed grade is exclusively available in the commercial temperature range (0°C to +85°C).

Ordering Information and Part Number Breakdown

Understanding the AMD XC2S200-6FGG574C part number helps ensure correct product selection.

Part Number Structure

XC2S200 - 6 - FGG - 574 - C
   │      │    │     │    │
   │      │    │     │    └── Temperature: C = Commercial
   │      │    │     └─────── Pin Count: 574
   │      │    └───────────── Package: FGG = Fine-pitch BGA (Pb-free)
   │      └────────────────── Speed Grade: 6 = Fastest
   └───────────────────────── Device: XC2S200 (200K gates)

Related Part Numbers

• XC2S200-5FGG574C (Speed grade -5, Commercial)
• XC2S200-5FGG574I (Speed grade -5, Industrial)

Quality and Compliance Standards

The XC2S200-6FGG574C meets stringent quality and environmental standards.

Environmental Compliance

• RoHS: Fully compliant with Restriction of Hazardous Substances directive
• Lead-Free: Pb-free package with green compound
• REACH: Compliant with EU chemical regulations

Quality Certifications

AMD maintains ISO 9001 certification for all manufacturing facilities. Consequently, every XC2S200-6FGG574C device undergoes rigorous testing before shipment.

Storage and Handling Guidelines

Proper storage ensures long-term device reliability.

Moisture Sensitivity

As a BGA package device, the XC2S200-6FGG574C has specific moisture sensitivity requirements. Store devices in moisture barrier bags with desiccant until ready for use. Follow IPC/JEDEC J-STD-020 guidelines for floor life management.

ESD Protection

Handle all FPGA devices with appropriate ESD precautions. Use grounded workstations, wrist straps, and ionizers during assembly and handling operations.

Summary: Why Choose the XC2S200-6FGG574C

The AMD XC2S200-6FGG574C combines proven Spartan-II architecture with high-speed performance and extensive I/O capabilities. Its key advantages include:

• 200,000 system gates for complex designs
• 5,292 logic cells in flexible CLB architecture
• 284 user I/O pins supporting 16 interface standards
• 131 Kbits total RAM (block + distributed)
• 263 MHz maximum frequency with -6 speed grade
• Field-programmable design eliminates ASIC risks
• Pb-free package meets environmental regulations

Whether you’re developing telecommunications equipment, industrial controls, or embedded systems, the XC2S200-6FGG574C provides the performance, flexibility, and reliability your application demands.