Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG568C Spartan-II FPGA: Complete Technical Guide and Specifications

Product Details

The AMD XC2S200-6FGG568C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This versatile programmable logic device delivers exceptional value for engineers seeking cost-effective solutions for digital signal processing, telecommunications, and embedded system designs. With 200,000 system gates and industry-leading speed performance, the XC2S200-6FGG568C stands as a superior alternative to mask-programmed ASICs.


XC2S200-6FGG568C Key Features and Benefits

The XC2S200-6FGG568C combines robust logic density with flexible I/O capabilities, making it ideal for complex digital designs. This Xilinx FPGA offers unlimited in-system reprogrammability, eliminating the initial costs and lengthy development cycles associated with conventional ASICs.

High Logic Density for Complex Designs

The XC2S200-6FGG568C provides substantial programmable resources that enable engineers to implement sophisticated digital circuits efficiently:

  • 200,000 System Gates for large-scale logic implementation
  • 5,292 Logic Cells supporting complex combinational and sequential designs
  • 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 x 42 array
  • Four Logic Cells per CLB with independent functionality

Advanced Memory Architecture

This Spartan-II FPGA integrates a hierarchical memory system designed for high-throughput data processing:

  • 75,264 Bits of Distributed RAM using LUT-based memory
  • 56 Kilobits of Dedicated Block RAM across 14 memory blocks
  • Dual-Port Block RAM with independent read/write ports
  • Configurable Port Widths from 1-bit to 16-bit data buses

XC2S200-6FGG568C Technical Specifications

Parameter Specification
Part Number XC2S200-6FGG568C
Device Family AMD Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42 (1,176 CLBs)
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56 Kbits (14 blocks)
Maximum Frequency 263 MHz
Core Voltage 2.5V
I/O Voltage 3.3V compatible
Process Technology 0.18 µm CMOS
Speed Grade -6 (Fastest)
Package Type Fine-Pitch Ball Grid Array (FBGA)
Operating Temperature 0°C to +85°C (Commercial)
RoHS Compliance Pb-Free Package

XC2S200-6FGG568C Speed Grade Performance

The “-6” speed grade designation indicates the fastest performance tier available in the Spartan-II family. This speed grade is exclusively available for commercial temperature range applications (0°C to +85°C).

Clock Management with Delay-Locked Loops

The XC2S200-6FGG568C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide essential clock management capabilities:

  • Clock Deskewing eliminates clock distribution delays
  • Clock Mirroring enables board-level clock synchronization
  • Frequency Synthesis for generating multiple clock domains
  • Phase Shifting with fine-grained delay control

XC2S200-6FGG568C I/O Capabilities and Standards

Flexible I/O Configuration

The input/output architecture of the XC2S200-6FGG568C supports diverse interface requirements through its configurable IOBs (Input/Output Blocks). Each IOB contains:

  • Dedicated Input Path with optional delay element
  • Registered Output Path for synchronous interfacing
  • Three-State Control for bidirectional communication
  • Pull-up and Pull-down Resistors for unused pin management

Supported I/O Standards

The XC2S200-6FGG568C supports multiple single-ended I/O standards including LVTTL, LVCMOS (3.3V, 2.5V), PCI 3.3V, and GTL+. This broad compatibility ensures seamless integration with various system components and legacy designs.


XC2S200-6FGG568C Package Information

The FGG568 package utilizes Fine-Pitch Ball Grid Array (FBGA) technology with Pb-free (lead-free) solder balls, ensuring RoHS compliance. The “G” character in the part number indicates the environmentally friendly Pb-free packaging option.

Package Advantages

  • Compact Form Factor optimizes PCB real estate
  • Superior Thermal Performance through efficient heat dissipation
  • Reliable BGA Connections for high-density applications
  • Automated Assembly Compatible for volume manufacturing

XC2S200-6FGG568C Applications

The versatility of the XC2S200-6FGG568C makes it suitable for numerous application domains where programmable logic provides advantages over fixed-function alternatives.

Industrial and Commercial Applications

  • Digital Signal Processing (DSP) implementations
  • Telecommunications Equipment and networking hardware
  • Consumer Electronics including display controllers
  • Industrial Control Systems and automation
  • Prototyping and Development platforms
  • Video and Image Processing pipelines

Design Flexibility Benefits

Unlike mask-programmed ASICs, the XC2S200-6FGG568C enables field upgrades without hardware replacement. This programmability significantly reduces development risk and time-to-market while providing a clear path for product improvements and bug fixes after deployment.


XC2S200-6FGG568C Development and Programming

Software Tool Support

The XC2S200-6FGG568C is fully supported by the Xilinx ISE (Integrated Software Environment) design suite. ISE provides comprehensive tools for design entry, synthesis, implementation, and configuration file generation.

Configuration Modes

The device supports multiple configuration modes to accommodate various system architectures:

  • Slave Serial Mode for processor-controlled configuration
  • Master Serial Mode using external PROM
  • JTAG Boundary Scan (IEEE 1149.1) for programming and testing
  • In-System Reconfiguration for runtime updates

Why Choose the XC2S200-6FGG568C Spartan-II FPGA

The AMD XC2S200-6FGG568C represents an optimal balance of performance, capacity, and cost-effectiveness within the Spartan-II family. Engineers benefit from proven 0.18-micron technology reliability combined with the fastest speed grade available.

Key Advantages Summary

  • Cost-Effective solution compared to custom ASICs
  • Fastest Speed Grade (-6) for performance-critical applications
  • Pb-Free Package ensures environmental compliance
  • Proven Architecture with extensive design resources
  • In-System Programmability enables field updates
  • Mature Ecosystem with comprehensive documentation

The XC2S200-6FGG568C continues to serve as a reliable choice for designs requiring a proven, well-documented FPGA platform with strong vendor support and widespread availability in the electronic components market.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.