Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG566C FPGA | Spartan-II 200K Gate Programmable Logic Device

Product Details

The AMD XC2S200-6FGG566C is a high-performance Field Programmable Gate Array (FPGA) from the Spartan-II family, delivering 200,000 system gates in a compact Fine-Pitch Ball Grid Array package. This programmable logic device offers exceptional flexibility for industrial automation, telecommunications, and embedded system applications requiring reliable, cost-effective FPGA solutions.


XC2S200-6FGG566C Key Features and Specifications

Logic Capacity and Architecture

The XC2S200-6FGG566C delivers substantial processing power through its advanced programmable architecture:

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Speed Grade -6 (Commercial)

Memory Resources

This AMD Spartan-II FPGA integrates generous on-chip memory for high-bandwidth applications:

  • Distributed RAM: 75,264 bits (SelectRAM technology)
  • Block RAM: 56 Kbits (14 dedicated memory blocks)
  • Memory Configuration: 4 Kbit per block with dual-port capability

Clock Management System

The XC2S200-6FGG566C features advanced clock distribution for precise timing control:

  • Delay-Locked Loops (DLLs): 4 dedicated DLLs
  • Global Clock Networks: 4 primary low-skew clock distribution nets
  • Maximum Frequency: 263 MHz operation

XC2S200-6FGG566C Package Information

BGA Package Specifications

Attribute Value
Package Type Fine-Pitch BGA (FBGA)
Lead-Free Option Yes (Pb-free compliant)
Mounting Style Surface Mount (SMD)
RoHS Status Compliant

Technical Advantages of the XC2S200-6FGG566C

High-Performance Digital Processing

The XC2S200-6FGG566C incorporates the Virtex-derived architecture, delivering enterprise-grade performance at a competitive price point. Key processing advantages include:

  • Dedicated Carry Logic: Enables high-speed arithmetic operations
  • Efficient Multiplier Support: Optimized for DSP applications
  • Cascade Chain Architecture: Supports wide-input logic functions
  • Abundant Registers: Features enable, set, and reset controls

Flexible I/O Standards

This Xilinx FPGA supports 16 high-performance interface standards, making it versatile for diverse system integration requirements:

  • Voltage Compatibility: 1.5V, 2.5V, and 3.3V I/O support
  • Core Voltage: 2.5V operation
  • PCI Compliance: Fully compliant with PCI specifications
  • Hot-Swap Ready: Compact PCI friendly design
  • Zero Hold Time: Simplifies system timing requirements

Configuration and Programming

The XC2S200-6FGG566C offers unlimited reprogrammability with multiple configuration options:

  • JTAG boundary scan (IEEE 1149.1 compliant)
  • Serial and parallel configuration modes
  • Full readback capability for verification
  • In-system programmability support

XC2S200-6FGG566C Application Areas

Industrial and Commercial Uses

The XC2S200-6FGG566C excels in numerous embedded applications:

Telecommunications Equipment

  • Base station controllers
  • Network switching fabric
  • Protocol conversion modules
  • Signal processing units

Industrial Automation

  • Motor control systems
  • PLC co-processors
  • Machine vision interfaces
  • Sensor data acquisition

Embedded Computing

  • Custom peripheral controllers
  • Hardware acceleration modules
  • Interface bridging solutions
  • Legacy system upgrades

Why Choose the AMD XC2S200-6FGG566C?

Cost-Effective ASIC Replacement

The XC2S200-6FGG566C provides a superior alternative to mask-programmed ASICs. Engineers benefit from:

  1. Eliminated NRE Costs: No initial tooling investment required
  2. Reduced Development Cycles: Skip lengthy ASIC fabrication timelines
  3. Field Upgradability: Modify designs post-deployment without hardware changes
  4. Risk Mitigation: Test and validate designs before mass production

Manufacturing Excellence

Built on proven 0.18-micron CMOS technology, the XC2S200-6FGG566C delivers:

  • Mature, reliable fabrication process
  • Consistent performance across temperature ranges
  • Long-term availability for production designs
  • Commercial temperature range: 0°C to +85°C

XC2S200-6FGG566C Development Support

Software Tools

AMD provides comprehensive development support through the ISE Design Suite, offering:

  • Schematic and HDL-based design entry
  • Automatic mapping and placement
  • Optimized routing algorithms
  • Timing analysis and simulation tools

Documentation Resources

Complete technical documentation available includes:

  • DS001 Spartan-II Family Data Sheet
  • Application notes and reference designs
  • Configuration guides
  • Package drawings and footprints

XC2S200-6FGG566C Ordering Information

Part Number Breakdown

Element Description
XC2S200 Device type (Spartan-II, 200K gates)
-6 Speed grade (Commercial)
FGG Fine-pitch BGA, Pb-free
566 Pin count
C Commercial temperature range

Summary

The AMD XC2S200-6FGG566C represents an optimal balance of performance, flexibility, and value for engineers requiring a reliable FPGA solution. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities, this Spartan-II device addresses demanding applications across telecommunications, industrial, and embedded markets. Its unlimited reprogrammability and field-upgrade capabilities make it an intelligent choice for both prototyping and volume production.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.