Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG565C Spartan-II FPGA: Complete Technical Guide & Specifications

Product Details

The AMD XC2S200-6FGG565C is a high-performance field-programmable gate array from the renowned Spartan-II FPGA family. This 200K system gate FPGA delivers exceptional logic density, flexible I/O capabilities, and cost-effective programmability for demanding embedded applications.

XC2S200-6FGG565C Key Features and Benefits

The XC2S200-6FGG565C combines powerful logic resources with advanced on-chip memory architecture, making it an ideal solution for telecommunications, industrial automation, automotive systems, and consumer electronics applications.

High-Density Logic Architecture

The XC2S200-6FGG565C features a robust CLB (Configurable Logic Block) architecture built on proven 0.18-micron CMOS technology. The device provides:

  • 200,000 system gates for complex digital designs
  • 5,292 logic cells enabling sophisticated logic implementations
  • 1,176 total CLBs arranged in a 28 × 42 array configuration
  • 284 maximum user I/O pins plus four dedicated global clock inputs
  • 2.5V core voltage operation for reduced power consumption

Advanced Memory Resources

The XC2S200-6FGG565C integrates comprehensive on-chip memory capabilities that eliminate external memory requirements in many applications:

  • 75,264 bits of distributed RAM using LUT-based memory implementation
  • 56 Kbits of dedicated block RAM organized in true dual-port 4K-bit blocks
  • Synchronous single-port and dual-port RAM support
  • Fast, predictable memory access timing

Clock Management with Delay-Locked Loops

Four dedicated Delay-Locked Loop (DLL) circuits positioned at each corner of the die provide:

  • Zero propagation delay clock distribution
  • Low clock skew between output signals
  • Board-level clock deskewing capability across multiple devices
  • Programmable clock multiplication and division

XC2S200-6FGG565C Technical Specifications

Parameter Specification
Device Family Spartan-II FPGA
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56 Kbits
DLLs 4
Maximum Frequency 263 MHz
Core Voltage (VCCINT) 2.5V
Process Technology 0.18 µm CMOS
Package Type Fine-Pitch BGA
Speed Grade -6
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Yes (Pb-Free)

Flexible I/O Standards and Interface Support

The XC2S200-6FGG565C supports a comprehensive range of single-ended and differential I/O standards organized into eight independent I/O banks:

Supported I/O Standards

  • LVTTL – Low-Voltage TTL (5V tolerant inputs)
  • LVCMOS2 – Low-Voltage CMOS 2.5V (5V tolerant inputs)
  • PCI – Peripheral Component Interconnect (5V tolerant)
  • GTL – Gunning Transceiver Logic
  • GTL+ – Enhanced Gunning Transceiver Logic
  • HSTL – High-Speed Transceiver Logic
  • SSTL – Stub Series Terminated Logic

Each I/O bank features independent VCCO voltage control, allowing mixed-voltage interfacing within a single design. VREF-based input threshold standards enable high-speed differential signaling applications.

XC2S200-6FGG565C Configuration Options

The XC2S200-6FGG565C offers multiple configuration modes for maximum design flexibility:

Master Serial Mode

The FPGA generates its own configuration clock (CCLK) with frequencies ranging from 4 MHz to 60 MHz using the ConfigRate option. Connect to compatible serial PROMs for standalone operation.

Slave Serial Mode

An external clock source drives the configuration process, enabling daisy-chain configurations and system-controlled programming.

JTAG Boundary Scan

Full IEEE 1149.1 boundary scan support enables:

  • In-system device programming
  • Board-level testing and debugging
  • Internal signal observation via EXTEST mode

Applications for the Spartan-II XC2S200-6FGG565C

The XC2S200-6FGG565C FPGA excels in diverse application domains:

Telecommunications and Networking

  • Protocol bridging and conversion
  • Data packet processing
  • Interface controllers
  • Network switching fabric

Industrial Automation

  • Motor control systems
  • Programmable logic controllers
  • Sensor interface processing
  • Real-time data acquisition

Consumer Electronics

  • Video and image processing
  • Audio signal processing
  • Display controllers
  • Peripheral interfaces

Embedded Systems

  • Co-processor functions
  • Custom peripheral controllers
  • Hardware acceleration
  • System-on-chip integration

Design Tool Compatibility

The XC2S200-6FGG565C is fully supported by industry-standard FPGA development environments. The ISE Design Suite provides comprehensive synthesis, implementation, and programming capabilities for efficient design workflows.

Why Choose the AMD Spartan-II FPGA Family

The Spartan-II architecture offers significant advantages over mask-programmed ASICs:

  • No NRE costs – Eliminate expensive mask development
  • Rapid time-to-market – Reduce development cycles from months to weeks
  • Field upgradability – Reprogram devices without hardware replacement
  • Unlimited reprogramming – SRAM-based configuration supports infinite updates
  • Risk reduction – Modify designs late in development without penalties

For comprehensive Xilinx FPGA solutions including development boards, evaluation kits, and technical support resources, explore our complete product portfolio.

Ordering Information and Part Marking

The XC2S200-6FGG565C follows Xilinx/AMD standard naming conventions:

  • XC2S200 – Device type (Spartan-II, 200K gates)
  • -6 – Speed grade (highest performance, commercial temperature only)
  • FG – Fine-pitch BGA package
  • G – Pb-free (RoHS compliant) packaging
  • 565 – Pin count
  • C – Commercial temperature range (0°C to +85°C)

Summary

The AMD XC2S200-6FGG565C Spartan-II FPGA delivers an optimal balance of logic density, memory resources, and I/O flexibility for cost-sensitive, high-volume applications. With 200,000 system gates, 5,292 logic cells, comprehensive block and distributed RAM, and four DLLs for precision clock management, this device provides the programmable logic foundation for next-generation embedded systems.

The lead-free, RoHS-compliant packaging ensures environmental compliance while the commercial temperature rating supports deployment across diverse operating environments. Combined with in-system reprogrammability and comprehensive development tool support, the XC2S200-6FGG565C represents an ideal solution for designers seeking ASIC-equivalent performance with FPGA flexibility.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.