The AMD XC2S200-6FGG562C is a versatile Field Programmable Gate Array from the proven Spartan-II family, engineered to deliver exceptional performance for demanding digital applications. This cost-effective programmable logic device combines robust functionality with design flexibility, making it an ideal solution for engineers seeking reliable FPGA capabilities in commercial and industrial environments. As a Xilinx FPGA solution now under AMD’s portfolio, the XC2S200-6FGG562C continues to serve countless applications worldwide.

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XC2S200-6FGG562C Overview and Key Features

The XC2S200-6FGG562C represents the high-capacity member of the Spartan-II FPGA family, offering substantial logic resources in a compact Fine Pitch Ball Grid Array (FBGA) package. This device utilizes advanced 0.18μm CMOS technology to achieve optimal balance between performance, power consumption, and cost efficiency.

Core Logic Architecture Specifications

The XC2S200-6FGG562C delivers impressive computational capabilities through its carefully designed architecture:

Distributed and Block RAM Resources

Memory resources play a critical role in FPGA-based designs, and the XC2S200-6FGG562C provides generous on-chip memory capacity. The device includes 75,264 bits of distributed RAM integrated within the Configurable Logic Blocks, enabling efficient implementation of small lookup tables, FIFOs, and shift registers throughout the design.

Additionally, the XC2S200-6FGG562C features 56 Kilobits of dedicated Block RAM organized in columns on opposite sides of the die. This dual-port synchronous RAM supports various data widths and depths, facilitating efficient buffering, data storage, and memory interface applications.

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XC2S200-6FGG562C Technical Architecture

Understanding the internal architecture of the XC2S200-6FGG562C helps engineers maximize design performance and resource utilization.

Configurable Logic Block Structure

Each CLB in the XC2S200-6FGG562C contains multiple slices with lookup tables (LUTs), flip-flops, and carry logic. The 28 × 42 array provides 1,176 CLBs, offering substantial logic capacity for complex digital designs. These CLBs interconnect through a hierarchical routing architecture that ensures efficient signal propagation across the device.

The CLB architecture supports both combinatorial and sequential logic implementations, with dedicated carry chains enabling high-speed arithmetic operations essential for DSP and computational applications.

Input/Output Block Capabilities

The XC2S200-6FGG562C provides up to 284 user-programmable I/O pins, each configurable for various signaling standards. The Input/Output Blocks (IOBs) surrounding the CLB array offer flexible interface options including:

• Selectable output drive strength for impedance matching
• Programmable slew rate control for EMI reduction
• Input delay elements for timing optimization
• Support for multiple I/O standards including LVTTL, LVCMOS, and GTL

Delay-Locked Loop Clock Management

Four Delay-Locked Loops (DLLs) positioned at each corner of the die provide sophisticated clock management capabilities. These DLLs enable clock deskewing, frequency synthesis, and phase shifting essential for high-performance synchronous designs.

The DLL architecture supports clock mirroring for board-level synchronization across multiple Spartan-II devices, ensuring proper timing alignment in complex multi-chip systems.

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XC2S200-6FGG562C Package Information

FGG562 Fine Pitch BGA Package Details

The XC2S200-6FGG562C utilizes a Fine Pitch Ball Grid Array package with 562 ball positions. This Pb-free (RoHS compliant) package variant, indicated by the “G” designation in the part number, meets modern environmental compliance requirements.

Key package characteristics include:

Thermal and Mechanical Considerations

Proper thermal management ensures reliable operation of the XC2S200-6FGG562C. The BGA package provides efficient heat dissipation through the ball array, though thermal vias in the PCB design further enhance heat transfer for high-utilization applications.

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XC2S200-6FGG562C Speed Grade and Performance

Understanding the -6 Speed Grade

The “-6” designation indicates the fastest speed grade available for the Spartan-II family. This speed grade offers the best timing performance, enabling higher system clock frequencies and improved throughput for demanding applications.

Speed grade -6 devices are exclusively available in the commercial temperature range (0°C to +85°C junction temperature), optimized for applications where peak performance takes priority over extended temperature operation.

Performance Benchmarks

The XC2S200-6FGG562C achieves impressive performance metrics:

• Internal register-to-register delays as low as sub-nanosecond ranges
• I/O timing optimized for high-speed external interfaces
• DLL frequency range supporting wide clock frequency synthesis
• Block RAM access times suitable for high-bandwidth applications

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XC2S200-6FGG562C Operating Conditions

Electrical Specifications

The XC2S200-6FGG562C operates with a 2.5V internal core voltage, delivering optimal performance while maintaining reasonable power consumption. I/O banks support various supply voltages for interface flexibility with different logic families.

Temperature Specifications

Operating within specified temperature ranges ensures device reliability and timing compliance:

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XC2S200-6FGG562C Application Areas

The versatile architecture of the XC2S200-6FGG562C supports numerous application domains:

Industrial Control Systems

The substantial logic capacity and reliable operation make the XC2S200-6FGG562C well-suited for programmable logic controllers, motor control systems, and industrial automation equipment requiring deterministic timing and parallel processing capabilities.

Telecommunications Equipment

Flexible I/O standards and high-speed performance enable implementation of communication protocols, data routing, and signal processing functions in networking equipment and communication infrastructure.

Consumer Electronics

Cost-effective programmability supports rapid product development cycles for consumer devices, enabling manufacturers to implement custom functionality while maintaining competitive pricing.

Prototyping and Development

The reprogrammable nature of the XC2S200-6FGG562C makes it invaluable for prototyping ASIC designs, validating system concepts, and developing embedded solutions before committing to fixed-function implementations.

Aerospace and Defense Applications

While the commercial temperature grade limits extreme environment deployment, the XC2S200-6FGG562C serves effectively in benign aerospace and defense applications requiring flexible digital logic implementation.

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XC2S200-6FGG562C Design Resources

Development Tool Support

The XC2S200-6FGG562C is supported by comprehensive design software enabling efficient implementation of digital designs:

• ISE Design Suite provides synthesis, implementation, and programming capabilities
• IP Core libraries accelerate development with pre-verified functional blocks
• Simulation tools enable verification before hardware deployment
• Constraint editors facilitate timing closure and pin assignment

Configuration Options

Multiple configuration modes provide flexibility in how the XC2S200-6FGG562C loads its programming data:

• Master Serial Mode for standalone operation with external PROM
• Slave Serial Mode for processor-controlled configuration
• Slave Parallel Mode for high-speed configuration loading
• JTAG Boundary Scan for development and production testing

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XC2S200-6FGG562C Part Number Decoder

Understanding the complete part number helps ensure correct device selection:

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Ordering Information for XC2S200-6FGG562C

When ordering the XC2S200-6FGG562C, consider the following procurement guidance:

Authorized Distribution Channels

Purchase through authorized AMD/Xilinx distributors to ensure authentic components with full manufacturer support and warranty coverage. Major distributors stock this device for immediate availability.

Quantity Pricing

Volume discounts typically apply for production quantities. Contact authorized distributors for current pricing based on order volume and delivery requirements.

Long-Term Availability

As a mature product, verify current production status and consider last-time-buy opportunities if designing for long product lifecycles.

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XC2S200-6FGG562C vs Alternative FPGA Solutions

Comparison with Other Spartan-II Devices

The XC2S200-6FGG562C represents the highest capacity Spartan-II device. For applications requiring fewer resources, lower-density family members offer cost savings while maintaining architecture compatibility.

Migration to Newer FPGA Families

For new designs requiring enhanced capabilities, consider modern FPGA families offering improved performance, lower power consumption, and advanced features while maintaining conceptual architecture familiarity.

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Technical Support and Documentation

Datasheet and Reference Materials

Comprehensive technical documentation available includes:

• DS001 Spartan-II Family Data Sheet covering all specifications
• Application Notes addressing specific design challenges
• User Guides for development tool operation
• Reference Designs demonstrating implementation techniques

Engineering Support

Technical assistance available through manufacturer support channels helps resolve design challenges and optimize implementations.

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Conclusion: XC2S200-6FGG562C FPGA Summary

The AMD XC2S200-6FGG562C delivers a powerful combination of logic capacity, performance, and cost-effectiveness for digital design applications. With 200,000 system gates, 5,292 logic cells, and comprehensive memory resources, this Spartan-II FPGA continues serving applications requiring reliable programmable logic solutions.

The -6 speed grade ensures optimal performance, while the Pb-free FGG562 package meets modern environmental compliance standards. Whether implementing industrial control systems, telecommunications equipment, or prototyping future products, the XC2S200-6FGG562C provides the foundation for successful digital design implementations.