The AMD XC2S200-6FGG561C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers 200,000 system gates with exceptional flexibility for embedded systems, industrial automation, and telecommunications applications. As a cost-effective ASIC alternative, the XC2S200-6FGG561C offers unlimited reprogrammability and field-upgradable design capabilities in a compact 561-ball Fine-Pitch BGA package.

XC2S200-6FGG561C Key Features and Benefits

The XC2S200-6FGG561C FPGA combines advanced programmable logic architecture with high-density I/O capabilities. Engineers and designers choose this Spartan-II device for its proven reliability and comprehensive feature set that supports complex digital circuit implementations.

High-Density Logic Architecture

The XC2S200-6FGG561C provides substantial logic resources for demanding applications:

Advanced Memory Architecture

The XC2S200-6FGG561C features a hierarchical SelectRAM memory system that enables efficient data storage and processing. The device incorporates 16 bits per LUT distributed RAM alongside configurable 4K-bit block RAM modules. This dual-memory architecture allows designers to implement both small, fast lookup tables and larger data buffers within a single FPGA solution.

The 14 dedicated block RAM modules provide 56 kilobits of on-chip memory organized in columns along the device edges. Each memory block supports true dual-port operation, enabling simultaneous read and write access from different clock domains.

XC2S200-6FGG561C Technical Specifications

Understanding the complete technical specifications helps engineers integrate the XC2S200-6FGG561C into their designs effectively.

Electrical Characteristics

Package Information

The FGG561 package designation indicates a 561-ball Fine-Pitch Ball Grid Array with Pb-free (lead-free) construction. The “G” character in the part number confirms RoHS compliance, making the XC2S200-6FGG561C suitable for environmentally conscious manufacturing processes.

Clock Management Features

The XC2S200-6FGG561C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:

• Clock deskewing and phase adjustment
• Clock multiplication and division
• Board-level clock mirroring capability
• Four primary low-skew global clock distribution networks

Applications for the XC2S200-6FGG561C FPGA

The versatility of the XC2S200-6FGG561C makes it suitable for diverse application domains where reconfigurable logic provides competitive advantages.

Industrial Automation and Control

The XC2S200-6FGG561C excels in industrial control systems requiring precise timing and parallel processing capabilities. Motor drive controllers, programmable logic controllers (PLCs), and process automation equipment benefit from the device’s high I/O count and deterministic response times.

Telecommunications Infrastructure

Network equipment manufacturers leverage the XC2S200-6FGG561C for implementing protocol bridges, data switching fabrics, and interface conversion circuits. The device’s fast system clock rates and block RAM resources support high-bandwidth data processing requirements.

Embedded Vision and Image Processing

The combination of logic density and memory resources enables real-time image processing algorithms. Surveillance systems, machine vision equipment, and medical imaging devices utilize the XC2S200-6FGG561C for frame buffering, filtering, and feature extraction operations.

Aerospace and Defense Systems

The Spartan-II architecture’s proven reliability makes the XC2S200-6FGG561C appropriate for avionics, radar processing, and secure communications applications where long-term availability and design stability are essential considerations.

XC2S200-6FGG561C I/O Capabilities

The XC2S200-6FGG561C supports 16 high-performance interface standards, providing exceptional connectivity flexibility for modern system designs.

Supported I/O Standards

• LVTTL (Low-Voltage TTL)
• LVCMOS (Low-Voltage CMOS)
• GTL+ (Gunning Transceiver Logic Plus)
• SSTL (Stub Series Terminated Logic)
• PCI-compliant interfaces
• Hot-swap Compact PCI compatible

I/O Block Architecture

Each Input/Output Block (IOB) contains programmable input and output buffers with dedicated registers. The IOBs support:

• Programmable slew rate control
• Programmable pull-up/pull-down resistors
• Direct and registered input paths
• 3-state output control
• Zero hold time operation for simplified system timing

Design Tools and Development Support

Engineers developing with the XC2S200-6FGG561C have access to comprehensive design tools that streamline the development process from concept to production.

ISE Design Suite

The Xilinx FPGA development ecosystem provides the ISE Design Suite, offering complete support for Spartan-II devices. This includes HDL synthesis, place-and-route optimization, timing analysis, and programming file generation.

Design Entry Methods

The XC2S200-6FGG561C supports multiple design methodologies:

• VHDL and Verilog HDL synthesis
• Schematic capture
• IP core integration
• Mixed-mode design combining multiple entry methods

Configuration Options

The device supports multiple configuration modes to accommodate different system architectures:

• Serial configuration via Platform Flash PROMs
• SelectMAP parallel programming
• JTAG boundary scan programming
• Slave serial mode for processor-controlled configuration

XC2S200-6FGG561C vs ASIC Solutions

The XC2S200-6FGG561C offers significant advantages over traditional mask-programmed ASIC approaches for many applications.

Development Advantages

When to Choose the XC2S200-6FGG561C

The XC2S200-6FGG561C provides optimal value when:

• Product requirements may change post-deployment
• Time-to-market pressure requires rapid development
• Production volumes don’t justify ASIC tooling costs
• Field upgradeability is a system requirement
• Multiple product variants share a common platform

Ordering Information for XC2S200-6FGG561C

Understanding the AMD part numbering convention helps procurement teams specify the correct device variant.

Part Number Breakdown

XC2S200-6FGG561C

• XC2S200: Spartan-II device with 200K system gates
• -6: Speed grade (highest performance, commercial only)
• FG: Fine-pitch Ball Grid Array package
• G: Pb-free (RoHS compliant) packaging
• 561: Pin count
• C: Commercial temperature range (0°C to +85°C)

Quality and Compliance

The XC2S200-6FGG561C meets stringent quality standards:

• RoHS compliant construction
• IEEE 1149.1 boundary scan compatible
• Extensive qualification testing
• Long-term product availability commitment

Conclusion

The AMD XC2S200-6FGG561C Spartan-II FPGA delivers a compelling combination of logic density, memory resources, and I/O flexibility in an industry-standard package. With 200,000 system gates, 5,292 logic cells, and support for 16 I/O standards, this device serves as an excellent choice for cost-sensitive applications requiring high-performance programmable logic.

Whether implementing industrial control systems, telecommunications equipment, or embedded vision applications, the XC2S200-6FGG561C provides the architectural foundation for successful digital designs. The device’s unlimited reprogrammability ensures long-term value through field-upgradable functionality and reduced design risk compared to fixed-function alternatives.