The AMD XC2S200-6FGG554C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional flexibility and processing power for industrial automation, telecommunications, and embedded system applications. Engineers worldwide choose this FPGA for its optimal balance of performance, cost-effectiveness, and reliable operation.

Key Features of the XC2S200-6FGG554C FPGA

The XC2S200-6FGG554C combines advanced programmable architecture with robust industrial-grade construction. This Xilinx FPGA device offers second-generation ASIC replacement technology, enabling rapid prototyping and flexible design modifications without costly hardware changes.

XC2S200-6FGG554C Technical Specifications

Spartan-II Architecture and Design Benefits

Configurable Logic Block Structure

The XC2S200-6FGG554C utilizes a sophisticated CLB architecture arranged in a 28 × 42 matrix, providing 1,176 configurable logic blocks. Each CLB contains four logic cells (LCs) with independent look-up tables (LUTs), flip-flops, and dedicated carry logic for arithmetic operations.

Dual-Port Block RAM Memory

This FPGA integrates 14 dedicated block RAM modules, delivering 56 Kbits of synchronous dual-ported memory. Each 4,096-bit RAM block supports configurable port widths from 1 to 16 bits, enabling flexible memory configurations for buffering, FIFO implementation, and data storage applications.

SelectRAM Distributed Memory

Beyond block RAM, the XC2S200-6FGG554C provides 75,264 bits of distributed RAM using LUT-based memory. This hierarchical memory approach allows designers to implement small, fast memory structures directly within the logic fabric for optimal performance.

Advanced Clock Management with DLL

Delay-Locked Loop Technology

Four integrated Delay-Locked Loops (DLLs) positioned at each die corner provide precise clock management. These DLLs eliminate clock distribution delays, multiply or divide clock frequencies, and ensure synchronized timing across the entire FPGA fabric.

Clock Distribution Network

The global clock routing architecture includes four primary global clock networks driven by dedicated global buffers. This network delivers low-skew clock signals to all CLB, IOB, and block RAM clock pins throughout the device.

XC2S200-6FGG554C Package Information

Fine-Pitch Ball Grid Array Design

The BGA package configuration offers excellent signal integrity and thermal performance for high-density PCB designs. The Pb-free (lead-free) packaging option (indicated by the “G” in the part number) ensures RoHS compliance for environmentally conscious manufacturing.

Surface Mount Technology

Designed for surface mount assembly, this FPGA integrates seamlessly into modern manufacturing processes. The fine-pitch ball grid array enables high I/O density while maintaining reliable solder joint quality.

Application Areas for XC2S200-6FGG554C

Industrial Control Systems

The XC2S200-6FGG554C excels in industrial automation applications, including motor controllers, programmable logic controllers (PLCs), and sensor interface modules. Its reprogrammability enables field upgrades without hardware modifications.

Telecommunications Equipment

Network switches, protocol converters, and communication interfaces benefit from the high-speed I/O capabilities and flexible logic resources of this Spartan-II FPGA.

Digital Signal Processing

With dedicated carry chains and abundant logic cells, the XC2S200-6FGG554C efficiently implements DSP algorithms for filtering, modulation, and signal analysis applications.

Embedded Systems Development

Prototype and production systems leverage this FPGA for custom peripheral development, microcontroller coprocessing, and specialized interface implementations.

Why Choose the XC2S200-6FGG554C Over ASICs

Cost-Effective Development

Unlike mask-programmed ASICs requiring expensive tooling and long production cycles, the XC2S200-6FGG554C offers immediate availability with zero NRE (non-recurring engineering) costs. Design iterations happen in hours rather than months.

Field Programmability

The unlimited reprogrammability of this FPGA allows design upgrades, bug fixes, and feature additions throughout the product lifecycle—capabilities impossible with fixed-function ASICs.

Reduced Time-to-Market

Engineers can develop, test, and deploy designs rapidly using established Xilinx development tools. This accelerated development cycle provides competitive advantages in fast-moving markets.

Development Tools and Software Support

ISE Design Suite Compatibility

The XC2S200-6FGG554C is fully supported by Xilinx ISE Design Suite, providing comprehensive synthesis, implementation, and verification capabilities. The integrated development environment includes simulation tools, timing analysis, and device programming utilities.

Third-Party EDA Tool Support

Industry-standard EDA tools from Mentor Graphics, Cadence, and Synopsys provide additional design entry and verification options for teams with established tool preferences.

Ordering Information and Part Number Breakdown

XC2S200-6FGG554C part number interpretation:

• XC2S200: Spartan-II device with 200K system gates
• -6: Speed grade (fastest commercial grade)
• FGG: Fine-pitch BGA package with Pb-free option
• 554: Pin count designation
• C: Commercial temperature range (0°C to +85°C)

Conclusion

The AMD XC2S200-6FGG554C Spartan-II FPGA delivers proven performance for demanding applications requiring programmable logic flexibility. With 200,000 system gates, 5,292 logic cells, and comprehensive memory resources, this device addresses diverse design requirements from industrial control to telecommunications. Its cost-effective architecture, robust construction, and extensive development tool support make it an excellent choice for both prototype development and volume production.