Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG550C Spartan-II FPGA: Complete Technical Specifications and Features

Product Details

The AMD XC2S200-6FGG550C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional programmable logic capabilities for demanding industrial and commercial applications. This versatile Xilinx FPGA solution combines 200,000 system gates with advanced features, making it an ideal choice for engineers seeking cost-effective, reliable digital design implementation.


Key Specifications of the XC2S200-6FGG550C FPGA

The AMD XC2S200-6FGG550C offers an impressive array of technical specifications that cater to diverse electronic design requirements. Understanding these core parameters helps engineers select the right FPGA for their specific application needs.

System Gate Capacity and Logic Resources

Parameter Specification
System Gates 200,000
Logic Cells 5,292
Configurable Logic Blocks (CLBs) 1,176
Maximum Frequency 263 MHz
Speed Grade -6 (Fastest)

The XC2S200-6FGG550C provides substantial programmable logic resources with its 200K system gates architecture. Each Configurable Logic Block contains four Logic Cells (LCs), which serve as the fundamental building blocks for implementing custom digital designs. The -6 speed grade designation indicates this is the fastest variant in the Spartan-II family, offering optimal performance for timing-critical applications.

Memory Architecture and Block RAM Specifications

Memory Type Capacity
Block RAM 56 Kbits (14 blocks)
Distributed RAM 75,264 bits
Block RAM Configuration Dual-port 4,096-bit RAM per block

The XC2S200-6FGG550C features a robust memory architecture with 56K bits of dedicated Block RAM organized into 14 independent blocks. Each block RAM cell is a fully synchronous dual-ported memory with independent control signals for each port, enabling simultaneous read and write operations. The distributed RAM capability provides additional 75,264 bits for implementing smaller, faster memory structures within the CLB fabric.


Package Information and Pin Configuration

FGG550C Fine-Pitch Ball Grid Array Package

The XC2S200-6FGG550C utilizes a Fine-Pitch Ball Grid Array (FBGA) package configuration, providing excellent thermal performance and reliable electrical connections for high-density PCB designs.

Package Parameter Value
Package Type Fine-Pitch BGA (FBGA)
Total Pins 550
User I/O Pins 284 (Maximum)
Ball Pitch 1.0 mm
Operating Voltage (Core) 2.5V

I/O Banking and VCCO Configuration

The XC2S200-6FGG550C supports eight independent VCCO supply banks, enabling designers to interface with multiple voltage standards simultaneously. This flexible I/O banking architecture allows seamless integration with various logic families and memory interfaces on the same device.


Advanced Features of the AMD Spartan-II FPGA

Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG550C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:

  • Clock de-skewing and distribution
  • Clock multiplication and division
  • Phase shifting capabilities
  • Clock mirroring for external synchronization

The DLL technology ensures precise clock management across the entire FPGA fabric, enabling system performance up to 200 MHz for complex digital designs.

Configurable I/O Standards Support

The XC2S200-6FGG550C supports 16 selectable I/O standards, providing exceptional interface flexibility:

  • LVTTL (3.3V Low-Voltage TTL)
  • LVCMOS (1.8V, 2.5V, 3.3V)
  • PCI (33 MHz, 66 MHz)
  • GTL and GTL+
  • HSTL Class I, II, III, IV
  • SSTL2 and SSTL3
  • CTT (Center Tap Terminated)
  • AGP-2X

This comprehensive I/O standard support makes the XC2S200-6FGG550C compatible with modern memory interfaces, processor buses, and high-speed communication protocols.


Application Areas for the XC2S200-6FGG550C

The versatile XC2S200-6FGG550C Spartan-II FPGA serves numerous industries and applications where programmable logic solutions offer distinct advantages over traditional ASIC implementations.

Industrial Automation and Control Systems

The robust operating characteristics and extensive I/O capabilities make this FPGA ideal for industrial control applications, including:

  • Programmable Logic Controllers (PLCs)
  • Motor drive systems
  • Process automation equipment
  • Factory automation interfaces

Telecommunications and Networking Equipment

High-speed data processing requirements in telecommunications equipment benefit from the XC2S200-6FGG550C’s performance characteristics:

  • Network switches and routers
  • Protocol converters
  • Base station controllers
  • Fiber optic communication systems

Consumer Electronics and Embedded Systems

Cost-effective implementation combined with rich features suits consumer electronics applications:

  • Video processing systems
  • Audio equipment
  • Gaming peripherals
  • Smart home devices

Digital Signal Processing Applications

The dedicated Block RAM and high logic density support DSP implementations:

  • Digital filters
  • FFT processors
  • Data compression systems
  • Image processing pipelines

Design Considerations and Development Tools

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG550C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can utilize:

  • Schematic capture and HDL design entry
  • Synthesis optimization tools
  • Place and route algorithms
  • Timing analysis and simulation
  • In-system programming and debugging

Configuration Options

The Spartan-II architecture supports multiple configuration modes:

Configuration Mode Description
Master Serial FPGA generates CCLK, reads from serial PROM
Slave Serial External master provides CCLK and data
Master Parallel FPGA reads from parallel PROM
Boundary Scan (JTAG) IEEE 1149.1 compliant programming

Electrical Specifications and Operating Conditions

Power Supply Requirements

Supply Rail Voltage Description
VCCINT 2.5V ± 5% Internal core logic supply
VCCO 1.8V – 3.3V Output driver supply (bank-specific)
VREF Standard-dependent Input reference voltage

Operating Temperature Range

Grade Temperature Range
Commercial (C) 0°C to +85°C
Industrial (I) -40°C to +100°C

The XC2S200-6FGG550C commercial grade operates reliably within standard commercial temperature specifications, while industrial variants extend operational capability for harsh environment deployments.


Comparison with Alternative FPGA Solutions

The XC2S200-6FGG550C offers distinct advantages when compared to mask-programmed ASICs and other programmable solutions:

Benefits Over Traditional ASIC Implementation

  • Eliminated NRE Costs: No expensive mask development required
  • Rapid Time-to-Market: Immediate design iteration capability
  • Field Upgradability: In-system reprogramming enables feature updates
  • Risk Mitigation: Eliminates silicon re-spin risks
  • Inventory Flexibility: Single device covers multiple product variants

Spartan-II Family Positioning

Within the Spartan-II product line, the XC2S200 occupies the highest density tier, offering maximum logic resources for complex designs while maintaining cost-effectiveness for volume production.


Technical Documentation and Support Resources

Engineers working with the XC2S200-6FGG550C have access to comprehensive documentation:

  • Complete datasheet with electrical specifications
  • User guide with implementation guidelines
  • Application notes for common design patterns
  • PCB layout recommendations
  • Configuration and programming guides

Ordering Information and Part Numbering

The XC2S200-6FGG550C part number decodes as follows:

Code Segment Meaning
XC2S Spartan-II Family
200 200,000 System Gates
-6 Speed Grade (Fastest)
FGG Fine-Pitch Ball Grid Array
550 Pin Count
C Commercial Temperature Grade

Conclusion: Why Choose the XC2S200-6FGG550C FPGA

The AMD XC2S200-6FGG550C Spartan-II FPGA delivers an exceptional balance of performance, features, and cost-effectiveness for programmable logic applications. With its 200,000 system gates, 56K bits of Block RAM, four DLLs, and comprehensive I/O standard support, this FPGA provides engineers with a reliable foundation for implementing sophisticated digital designs across telecommunications, industrial, consumer, and embedded system applications.

The proven 0.18µm technology, combined with extensive development tool support and Xilinx’s comprehensive technical documentation, ensures successful project implementation from prototype through high-volume production.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.