The AMD XC2S200-6FGG550C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, delivering exceptional programmable logic capabilities for demanding industrial and commercial applications. This versatile Xilinx FPGA solution combines 200,000 system gates with advanced features, making it an ideal choice for engineers seeking cost-effective, reliable digital design implementation.
Key Specifications of the XC2S200-6FGG550C FPGA
The AMD XC2S200-6FGG550C offers an impressive array of technical specifications that cater to diverse electronic design requirements. Understanding these core parameters helps engineers select the right FPGA for their specific application needs.
System Gate Capacity and Logic Resources
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| Configurable Logic Blocks (CLBs) |
1,176 |
| Maximum Frequency |
263 MHz |
| Speed Grade |
-6 (Fastest) |
The XC2S200-6FGG550C provides substantial programmable logic resources with its 200K system gates architecture. Each Configurable Logic Block contains four Logic Cells (LCs), which serve as the fundamental building blocks for implementing custom digital designs. The -6 speed grade designation indicates this is the fastest variant in the Spartan-II family, offering optimal performance for timing-critical applications.
Memory Architecture and Block RAM Specifications
| Memory Type |
Capacity |
| Block RAM |
56 Kbits (14 blocks) |
| Distributed RAM |
75,264 bits |
| Block RAM Configuration |
Dual-port 4,096-bit RAM per block |
The XC2S200-6FGG550C features a robust memory architecture with 56K bits of dedicated Block RAM organized into 14 independent blocks. Each block RAM cell is a fully synchronous dual-ported memory with independent control signals for each port, enabling simultaneous read and write operations. The distributed RAM capability provides additional 75,264 bits for implementing smaller, faster memory structures within the CLB fabric.
Package Information and Pin Configuration
FGG550C Fine-Pitch Ball Grid Array Package
The XC2S200-6FGG550C utilizes a Fine-Pitch Ball Grid Array (FBGA) package configuration, providing excellent thermal performance and reliable electrical connections for high-density PCB designs.
| Package Parameter |
Value |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Total Pins |
550 |
| User I/O Pins |
284 (Maximum) |
| Ball Pitch |
1.0 mm |
| Operating Voltage (Core) |
2.5V |
I/O Banking and VCCO Configuration
The XC2S200-6FGG550C supports eight independent VCCO supply banks, enabling designers to interface with multiple voltage standards simultaneously. This flexible I/O banking architecture allows seamless integration with various logic families and memory interfaces on the same device.
Advanced Features of the AMD Spartan-II FPGA
Delay-Locked Loop (DLL) Technology
The XC2S200-6FGG550C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:
- Clock de-skewing and distribution
- Clock multiplication and division
- Phase shifting capabilities
- Clock mirroring for external synchronization
The DLL technology ensures precise clock management across the entire FPGA fabric, enabling system performance up to 200 MHz for complex digital designs.
Configurable I/O Standards Support
The XC2S200-6FGG550C supports 16 selectable I/O standards, providing exceptional interface flexibility:
- LVTTL (3.3V Low-Voltage TTL)
- LVCMOS (1.8V, 2.5V, 3.3V)
- PCI (33 MHz, 66 MHz)
- GTL and GTL+
- HSTL Class I, II, III, IV
- SSTL2 and SSTL3
- CTT (Center Tap Terminated)
- AGP-2X
This comprehensive I/O standard support makes the XC2S200-6FGG550C compatible with modern memory interfaces, processor buses, and high-speed communication protocols.
Application Areas for the XC2S200-6FGG550C
The versatile XC2S200-6FGG550C Spartan-II FPGA serves numerous industries and applications where programmable logic solutions offer distinct advantages over traditional ASIC implementations.
Industrial Automation and Control Systems
The robust operating characteristics and extensive I/O capabilities make this FPGA ideal for industrial control applications, including:
- Programmable Logic Controllers (PLCs)
- Motor drive systems
- Process automation equipment
- Factory automation interfaces
Telecommunications and Networking Equipment
High-speed data processing requirements in telecommunications equipment benefit from the XC2S200-6FGG550C’s performance characteristics:
- Network switches and routers
- Protocol converters
- Base station controllers
- Fiber optic communication systems
Consumer Electronics and Embedded Systems
Cost-effective implementation combined with rich features suits consumer electronics applications:
- Video processing systems
- Audio equipment
- Gaming peripherals
- Smart home devices
Digital Signal Processing Applications
The dedicated Block RAM and high logic density support DSP implementations:
- Digital filters
- FFT processors
- Data compression systems
- Image processing pipelines
Design Considerations and Development Tools
Xilinx ISE Design Suite Compatibility
The XC2S200-6FGG550C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can utilize:
- Schematic capture and HDL design entry
- Synthesis optimization tools
- Place and route algorithms
- Timing analysis and simulation
- In-system programming and debugging
Configuration Options
The Spartan-II architecture supports multiple configuration modes:
| Configuration Mode |
Description |
| Master Serial |
FPGA generates CCLK, reads from serial PROM |
| Slave Serial |
External master provides CCLK and data |
| Master Parallel |
FPGA reads from parallel PROM |
| Boundary Scan (JTAG) |
IEEE 1149.1 compliant programming |
Electrical Specifications and Operating Conditions
Power Supply Requirements
| Supply Rail |
Voltage |
Description |
| VCCINT |
2.5V ± 5% |
Internal core logic supply |
| VCCO |
1.8V – 3.3V |
Output driver supply (bank-specific) |
| VREF |
Standard-dependent |
Input reference voltage |
Operating Temperature Range
| Grade |
Temperature Range |
| Commercial (C) |
0°C to +85°C |
| Industrial (I) |
-40°C to +100°C |
The XC2S200-6FGG550C commercial grade operates reliably within standard commercial temperature specifications, while industrial variants extend operational capability for harsh environment deployments.
Comparison with Alternative FPGA Solutions
The XC2S200-6FGG550C offers distinct advantages when compared to mask-programmed ASICs and other programmable solutions:
Benefits Over Traditional ASIC Implementation
- Eliminated NRE Costs: No expensive mask development required
- Rapid Time-to-Market: Immediate design iteration capability
- Field Upgradability: In-system reprogramming enables feature updates
- Risk Mitigation: Eliminates silicon re-spin risks
- Inventory Flexibility: Single device covers multiple product variants
Spartan-II Family Positioning
Within the Spartan-II product line, the XC2S200 occupies the highest density tier, offering maximum logic resources for complex designs while maintaining cost-effectiveness for volume production.
Technical Documentation and Support Resources
Engineers working with the XC2S200-6FGG550C have access to comprehensive documentation:
- Complete datasheet with electrical specifications
- User guide with implementation guidelines
- Application notes for common design patterns
- PCB layout recommendations
- Configuration and programming guides
Ordering Information and Part Numbering
The XC2S200-6FGG550C part number decodes as follows:
| Code Segment |
Meaning |
| XC2S |
Spartan-II Family |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade (Fastest) |
| FGG |
Fine-Pitch Ball Grid Array |
| 550 |
Pin Count |
| C |
Commercial Temperature Grade |
Conclusion: Why Choose the XC2S200-6FGG550C FPGA
The AMD XC2S200-6FGG550C Spartan-II FPGA delivers an exceptional balance of performance, features, and cost-effectiveness for programmable logic applications. With its 200,000 system gates, 56K bits of Block RAM, four DLLs, and comprehensive I/O standard support, this FPGA provides engineers with a reliable foundation for implementing sophisticated digital designs across telecommunications, industrial, consumer, and embedded system applications.
The proven 0.18µm technology, combined with extensive development tool support and Xilinx’s comprehensive technical documentation, ensures successful project implementation from prototype through high-volume production.