The XC2S200-6FGG547C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional flexibility, reliability, and cost-effectiveness for embedded systems, telecommunications, and industrial applications. As a Xilinx FPGA solution, the XC2S200-6FGG547C provides engineers with a superior alternative to traditional ASICs while eliminating lengthy development cycles and high initial costs.

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XC2S200-6FGG547C Overview and Key Features

The XC2S200-6FGG547C represents the flagship device in the Spartan-II FPGA lineup, offering the highest gate density within this proven family. Built on cost-effective 0.18-micron CMOS process technology, this device combines excellent performance characteristics with remarkable power efficiency.

Primary Features of the XC2S200-6FGG547C

Engineers selecting the XC2S200-6FGG547C benefit from an impressive array of capabilities designed to accelerate time-to-market while reducing overall system costs. The device offers unlimited reprogrammability, enabling field upgrades without hardware replacement—something impossible with traditional ASICs.

Key features include:

• Second-generation ASIC replacement technology
• Densities up to 200,000 system gates
• 5,292 logic cells for complex digital implementations
• Advanced Virtex-based architecture with streamlined features
• Full PCI compliance for standard bus interfacing
• IEEE 1149.1 compatible boundary scan logic
• Hot-swap Compact PCI friendly design

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XC2S200-6FGG547C Technical Specifications

Understanding the complete technical specifications of the XC2S200-6FGG547C is essential for proper integration into your electronic designs. The following sections detail every critical parameter engineers need for successful implementation.

Logic Resources and Architecture

The XC2S200-6FGG547C incorporates a sophisticated architecture that balances density with performance. At its core, the device features a 28 × 42 Configurable Logic Block (CLB) array providing 1,176 total CLBs.

Each CLB contains four Logic Cells (LCs), with each LC featuring a 4-input function generator, carry logic, and storage element. This architecture enables implementation of complex combinatorial and sequential logic with excellent resource utilization.

Memory Architecture of the XC2S200-6FGG547C

The XC2S200-6FGG547C provides designers with a flexible hierarchical memory system through SelectRAM technology. This dual-memory architecture includes both distributed and block RAM options.

Distributed RAM

The device offers 75,264 bits of distributed RAM implemented through 16-bit Look-Up Tables (LUTs). Distributed RAM provides single-cycle synchronous write capability and can be configured as single-port, dual-port, or ROM structures. This memory type is ideal for small FIFOs, register files, and shift registers.

Block RAM

Fourteen dedicated 4-Kbit block RAM modules provide 56 Kbits of total block RAM. Each block RAM module features:

• Dual-port access capability
• Synchronous operation
• Configurable aspect ratios (4K×1, 2K×2, 1K×4, 512×8, 256×16)
• Dedicated routing for efficient CLB and inter-block connectivity

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XC2S200-6FGG547C Package Information

The XC2S200-6FGG547C utilizes a Fine-pitch Ball Grid Array (FBGA) package configuration optimized for high-density PCB mounting. This Pb-free (lead-free) package meets RoHS compliance requirements while providing excellent electrical and thermal characteristics.

Package Specifications

The “G” designation in the FGG547 package code indicates Pb-free solder ball composition, ensuring environmental compliance for applications requiring lead-free components.

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XC2S200-6FGG547C Speed Grade and Operating Conditions

The “-6” speed grade designation indicates this device is optimized for high-performance commercial applications operating in standard environmental conditions.

Speed Grade Characteristics

The XC2S200-6FGG547C with -6 speed grade delivers enhanced timing performance compared to slower speed grades within the Spartan-II family. This speed grade is exclusively available in the Commercial temperature range.

Operating Temperature Range

Power Supply Requirements

The XC2S200-6FGG547C operates with a 2.5V core voltage while supporting multiple I/O voltage standards. This split voltage architecture enables interfacing with diverse logic families while maintaining low power consumption.

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I/O Capabilities of the XC2S200-6FGG547C

Versatile I/O support is a hallmark of the XC2S200-6FGG547C, enabling seamless integration with virtually any system architecture. The device supports 16 high-performance interface standards for maximum design flexibility.

Supported I/O Standards

The XC2S200-6FGG547C I/O blocks (IOBs) support an extensive range of single-ended and differential signaling standards:

• LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
• PCI (3.3V at 33 MHz and 66 MHz)
• GTL and GTL+
• HSTL (Class I, II, III, IV)
• SSTL2 and SSTL3 (Class I, II)
• AGP (1×, 2×)

I/O Bank Structure

The device organizes I/O resources into multiple banks, each with independent VCCO supply capability. This bank structure enables simultaneous support for multiple voltage standards within a single design. VREF pins within each bank provide reference voltages for input threshold levels when using standards like HSTL and SSTL.

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Clock Management in the XC2S200-6FGG547C

Robust clock distribution is critical for high-performance FPGA designs. The XC2S200-6FGG547C incorporates four Delay-Locked Loops (DLLs) and four primary global clock distribution networks.

Delay-Locked Loop Features

Each DLL provides advanced clock management capabilities:

• Clock deskew for minimizing clock-to-output delays
• Frequency synthesis (clock multiplication and division)
• Phase shifting for precise timing control
• Board-level clock deskew (clock mirror operation)

Global Clock Networks

Four primary low-skew global clock distribution networks ensure reliable clock delivery to all CLB, IOB, and block RAM clock pins. These dedicated resources minimize clock skew across the device, enabling high-frequency system operation.

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XC2S200-6FGG547C Applications

The XC2S200-6FGG547C serves diverse application domains where flexibility, performance, and cost-effectiveness are paramount.

Industrial and Automation

Manufacturing equipment, motor controllers, and programmable automation controllers benefit from the device’s reprogrammability and robust I/O support.

Telecommunications Infrastructure

Base stations, routers, switches, and protocol converters leverage the device’s high-speed interfaces and PCI compliance.

Consumer Electronics

Set-top boxes, video processing systems, and display controllers utilize the device’s cost-effective gate density and memory resources.

Prototyping and Development

ASIC prototyping and algorithm development benefit from unlimited reprogrammability and rapid design iteration capabilities.

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Design Tools and Development Support

Developing with the XC2S200-6FGG547C requires AMD’s ISE Design Suite, which provides comprehensive synthesis, implementation, and verification capabilities. The toolchain includes:

• HDL synthesis and simulation support
• Automatic place-and-route optimization
• Timing analysis and constraint management
• Configuration file generation
• In-system debugging capabilities

The development environment supports VHDL, Verilog, and schematic-based design entry methods, accommodating diverse engineering preferences and methodologies.

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XC2S200-6FGG547C Ordering Information

When specifying the XC2S200-6FGG547C for procurement, the part number breaks down as follows:

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Why Choose the XC2S200-6FGG547C

The XC2S200-6FGG547C delivers compelling advantages for embedded system designers seeking proven programmable logic solutions:

• Cost-Effective Performance: The 0.18-micron process technology provides excellent performance at competitive price points.
• Design Flexibility: Unlimited reprogrammability enables field upgrades and design iterations without hardware changes.
• Reduced Time-to-Market: Eliminate lengthy ASIC development cycles while maintaining full customization capability.
• System Integration: Comprehensive I/O support and memory resources enable single-chip solutions for many applications.
• Long-Term Availability: The Spartan-II family’s mature status ensures stable supply chains for production requirements.

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Conclusion

The XC2S200-6FGG547C represents an excellent choice for engineers requiring a reliable, cost-effective FPGA solution with proven performance characteristics. With 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and versatile I/O capabilities, this Spartan-II device addresses demanding embedded applications while providing the flexibility inherent to programmable logic.

Whether designing telecommunications equipment, industrial controllers, or consumer electronics, the XC2S200-6FGG547C delivers the resources and performance necessary for successful product development. Its combination of mature technology, broad software support, and competitive pricing makes it a compelling choice for both new designs and legacy system maintenance.