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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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AMD XC2S200-6FGG544C Spartan-II FPGA: Complete Technical Overview and Specifications

Product Details

The AMD XC2S200-6FGG544C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This Xilinx FPGA device delivers exceptional value for digital design applications requiring substantial logic resources, fast system performance, and versatile I/O capabilities.

Key Features of the XC2S200-6FGG544C Programmable Logic Device

The XC2S200-6FGG544C represents the largest member of the Spartan-II FPGA family, offering designers maximum gate density and comprehensive features for complex digital implementations.

System Gate Capacity and Logic Resources

This FPGA provides 200,000 system gates, making it suitable for demanding applications that require extensive logic implementation. The device contains 5,292 logic cells organized within 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 array structure.

On-Chip Memory Architecture

The XC2S200-6FGG544C incorporates a hierarchical memory system featuring 56K bits of dedicated block RAM and 75,264 bits of distributed RAM. The block RAM consists of fourteen 4,096-bit dual-port memory blocks that support independent read and write operations with configurable data widths from 1 to 16 bits.

Package and Physical Specifications

Fine-Pitch Ball Grid Array Configuration

The device utilizes a lead-free Fine-Pitch Ball Grid Array (FGG) package, which provides excellent thermal performance and reliable electrical connections. This BGA configuration supports up to 284 user I/O pins, enabling extensive connectivity for complex system designs.

Speed Grade Performance

The -6 speed grade designation indicates higher performance operation within the Spartan-II family, exclusively available in the commercial temperature range of 0°C to +85°C. This grade supports system clock rates for demanding applications requiring fast signal processing.

Detailed Technical Specifications

Core Architecture Components

The XC2S200-6FGG544C FPGA architecture includes configurable logic blocks surrounded by programmable input/output blocks at the device perimeter. Four Delay-Locked Loops (DLLs) positioned at each corner provide advanced clock management with zero propagation delay and minimal skew across the distribution network.

Input/Output Standards Support

The device supports sixteen high-performance interface standards including LVTTL, LVCMOS2, PCI (3V/5V at 33MHz/66MHz), GTL, GTL+, HSTL Class I/III/IV, SSTL2, SSTL3, CTT, and AGP-2X. This versatility enables seamless integration with diverse memory types, bus protocols, and peripheral devices.

Power Supply Requirements

The XC2S200-6FGG544C operates with a 2.5V core logic supply (VCCINT) while I/O banks support multiple voltage levels (1.5V, 2.5V, or 3.3V) depending on the selected interface standard. The device organizes I/O pins into eight independently configurable banks for flexible voltage planning.

Configuration and Programming Options

Multiple Configuration Modes

Engineers can configure this FPGA through several methods including Master Serial mode using external PROMs, Slave Serial mode for microprocessor-controlled loading, Slave Parallel mode for fastest configuration speeds, and Boundary-Scan (JTAG) mode for in-system programming. The configuration file size is 1,335,840 bits.

In-System Reprogrammability

Unlike mask-programmed ASICs, the XC2S200-6FGG544C offers unlimited reprogramming cycles with SRAM-based configuration memory. This capability enables field upgrades, design iterations, and prototype modifications without hardware replacement.

Advanced Design Features

Delay-Locked Loop Capabilities

Each DLL provides clock delay compensation, multiple phase outputs (0°, 90°, 180°, 270°), clock doubling functionality, and division ratios up to 16. These features simplify synchronous system design and enable sophisticated clock domain management across the FPGA and external components.

Dedicated Arithmetic Logic

The device includes dedicated carry logic chains for high-speed arithmetic operations, XOR gates for full-adder implementation, and AND gates optimized for multiplier construction. These resources enable efficient implementation of DSP algorithms and mathematical functions.

Boundary Scan Support

Full IEEE 1149.1 boundary scan compliance facilitates board-level testing, debugging, and production verification. The Test Access Port supports EXTEST, SAMPLE/PRELOAD, BYPASS, and configuration instructions through the four dedicated JTAG pins (TDI, TDO, TMS, TCK).

Target Applications

The XC2S200-6FGG544C FPGA suits numerous applications across multiple industries including telecommunications infrastructure, industrial automation and control systems, digital signal processing implementations, high-speed data acquisition, video and image processing pipelines, networking equipment, consumer electronics, and rapid prototyping platforms.

Development Tool Support

AMD provides comprehensive design support through the ISE development environment, offering automated mapping, placement, and routing with timing-driven optimization. The unified library contains over 400 primitives and macros for efficient design entry using schematic capture or HDL synthesis flows.

Ordering Information Summary

Parameter Value
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 total)
Block RAM 56K bits
Distributed RAM 75,264 bits
Maximum User I/O 284
Speed Grade -6 (Commercial)
Package Type Fine-Pitch BGA (Lead-Free)
Core Voltage 2.5V
Process Technology 0.18µm CMOS
Operating Temperature 0°C to +85°C

Why Choose the Spartan-II FPGA Family

The Spartan-II series provides an optimal balance between performance, features, and cost-effectiveness. These devices eliminate the non-recurring engineering costs, extended development timelines, and production risks associated with traditional ASIC development while maintaining competitive unit pricing for volume manufacturing.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.