The AMD XC2S200-6FGG540C is a high-performance field-programmable gate array from the renowned Spartan-II FPGA family. This programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, and embedded system applications.
Key Features of the XC2S200-6FGG540C FPGA
The XC2S200-6FGG540C combines advanced programmable logic architecture with cost-effective implementation. This Xilinx FPGA offers engineers a superior alternative to mask-programmed ASICs, eliminating lengthy development cycles and reducing project risks.
Core Architecture Specifications
The XC2S200-6FGG540C features a robust internal architecture built on proven 0.18μm CMOS technology. The device operates at a 2.5V core voltage, ensuring reliable performance across demanding applications.
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum Frequency |
263 MHz |
| Process Technology |
0.18μm |
| Core Voltage |
2.5V |
Memory Resources
The XC2S200-6FGG540C provides generous on-chip memory resources for data buffering and storage applications.
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks) |
| Total Block RAM Blocks |
14 |
Each block RAM cell functions as a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The dual-port architecture supports configurable data widths, enabling flexible memory implementations.
Package and I/O Configuration
The FGG540 package variant features a fine-pitch ball grid array configuration optimized for high-density PCB designs.
| I/O Specification |
Value |
| Maximum User I/Os |
284 |
| I/O Banks |
4 |
| Package Type |
FGG (Fine-Pitch BGA) |
| Pin Count |
540 |
Supported I/O Standards
The XC2S200-6FGG540C supports multiple industry-standard signaling protocols, providing maximum design flexibility.
Compatible Interface Standards
The device supports 16 different I/O standards including LVTTL, LVCMOS2, and PCI interfaces. The LVTTL, LVCMOS2, and PCI standards offer 5V tolerance, enabling seamless integration with legacy systems.
| Standard |
5V Tolerant |
| LVTTL |
Yes |
| LVCMOS2 |
Yes |
| PCI33_5 |
Yes |
| GTL |
No |
| SSTL |
No |
Advanced Clocking Features
Delay-Locked Loops (DLLs)
The XC2S200-6FGG540C incorporates four Delay-Locked Loops positioned at each corner of the die. These DLLs provide precise clock management capabilities essential for high-speed digital designs.
The DLL architecture enables clock deskewing across multiple Spartan-II devices on a single board. By driving DLL output off-chip and back, engineers can achieve synchronized board-level clocking with minimal skew.
Speed Grade Information
The “-6” speed grade designation indicates the fastest performance tier within the Spartan-II family. This speed grade is exclusively available in the commercial temperature range (0°C to +85°C), delivering optimal timing characteristics for high-performance applications.
| Speed Grade |
Temperature Range |
Availability |
| -6 |
Commercial (0°C to +85°C) |
Standard |
| -5 |
Commercial/Industrial |
Standard |
| -4 |
Commercial/Industrial |
Limited |
Configuration Options
Flexible Programming Modes
The XC2S200-6FGG540C supports multiple configuration modes for maximum deployment flexibility.
| Configuration Mode |
Description |
| Master Serial |
External serial PROM |
| Slave Serial |
Daisy-chain capable |
| Slave Parallel |
High-speed loading |
| Boundary Scan |
JTAG interface |
The device stores configuration data in internal static memory cells, enabling unlimited reprogramming cycles throughout the product lifecycle. This programmability permits field upgrades without hardware replacement.
Configurable Logic Block Architecture
CLB Structure and Functionality
Each Configurable Logic Block in the XC2S200-6FGG540C contains four Logic Cells (LCs) as primary building blocks. Every Logic Cell comprises a 4-input function generator, storage element, and dedicated carry logic.
The function generators can implement any arbitrarily defined Boolean function of four inputs. Additionally, two LUTs within a slice combine to create 16 x 2-bit or 32 x 1-bit synchronous RAM structures.
Logic Cell Capabilities
| Feature |
Specification |
| Function Inputs |
4 per LUT |
| Storage Elements |
D-type flip-flops or latches |
| Carry Logic |
Dedicated per LC |
| Feedthrough Paths |
4 per CLB |
Block RAM Architecture
Dual-Port Memory Configuration
The 14 block RAM modules in the XC2S200-6FGG540C are organized in two columns along the vertical edges of the die. Each 4096-bit block supports independent port configurations.
| Port Width |
Depth |
Address Bus |
Data Bus |
| 1-bit |
4096 |
ADDR[11:0] |
DATA[0] |
| 2-bit |
2048 |
ADDR[10:0] |
DATA[1:0] |
| 4-bit |
1024 |
ADDR[9:0] |
DATA[3:0] |
| 8-bit |
512 |
ADDR[8:0] |
DATA[7:0] |
| 16-bit |
256 |
ADDR[7:0] |
DATA[15:0] |
Application Areas
Industrial and Commercial Uses
The XC2S200-6FGG540C excels in numerous application domains requiring programmable logic solutions.
| Application Sector |
Typical Uses |
| Telecommunications |
Protocol conversion, signal processing |
| Industrial Control |
Motor drives, PLC replacement |
| Consumer Electronics |
Video processing, audio systems |
| Automotive |
ADAS, infotainment systems |
| Aerospace |
Flight control, avionics |
Development Tool Support
Design Software Compatibility
The XC2S200-6FGG540C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities.
| Tool Category |
Available Resources |
| Design Entry |
VHDL, Verilog support |
| Synthesis |
ISE integrated tools |
| Implementation |
Place and route optimization |
| Verification |
Simulation and timing analysis |
Ordering Information
Part Number Breakdown
The XC2S200-6FGG540C part number follows standard AMD/Xilinx nomenclature conventions.
| Code Segment |
Meaning |
| XC2S |
Spartan-II family |
| 200 |
200K system gates |
| -6 |
Speed grade (fastest) |
| FGG |
Fine-pitch BGA, Pb-free |
| 540 |
Pin count |
| C |
Commercial temperature |
The “G” designation indicates RoHS-compliant, Pb-free packaging meeting environmental and safety standards.
Advantages Over Traditional ASICs
Cost and Development Benefits
The XC2S200-6FGG540C eliminates common ASIC development challenges through its reprogrammable architecture.
| Factor |
ASIC |
XC2S200-6FGG540C |
| Initial Cost |
High NRE |
No NRE |
| Development Time |
6-12 months |
Days to weeks |
| Field Upgrades |
Impossible |
Unlimited |
| Design Risk |
High |
Minimal |
Electrical Characteristics
Power Supply Requirements
| Supply |
Voltage |
Purpose |
| VCCINT |
2.5V |
Core logic |
| VCCO |
1.5V to 3.3V |
I/O banks |
| VREF |
Variable |
Reference voltage |
Quality and Compliance
Environmental Standards
The XC2S200-6FGG540C meets stringent quality and environmental standards for global deployment.
| Standard |
Compliance Status |
| RoHS |
Compliant (Pb-free) |
| REACH |
Compliant |
| WEEE |
Compliant |
Technical Documentation
Engineers working with the XC2S200-6FGG540C should reference the official Spartan-II FPGA Family Data Sheet (DS001) for complete electrical specifications, timing parameters, and pinout information.