Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG540C Spartan-II FPGA: Complete Technical Specifications and Features

Product Details

The AMD XC2S200-6FGG540C is a high-performance field-programmable gate array from the renowned Spartan-II FPGA family. This programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, and embedded system applications.

Key Features of the XC2S200-6FGG540C FPGA

The XC2S200-6FGG540C combines advanced programmable logic architecture with cost-effective implementation. This Xilinx FPGA offers engineers a superior alternative to mask-programmed ASICs, eliminating lengthy development cycles and reducing project risks.

Core Architecture Specifications

The XC2S200-6FGG540C features a robust internal architecture built on proven 0.18μm CMOS technology. The device operates at a 2.5V core voltage, ensuring reliable performance across demanding applications.

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum Frequency 263 MHz
Process Technology 0.18μm
Core Voltage 2.5V

Memory Resources

The XC2S200-6FGG540C provides generous on-chip memory resources for data buffering and storage applications.

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56K bits (14 blocks)
Total Block RAM Blocks 14

Each block RAM cell functions as a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The dual-port architecture supports configurable data widths, enabling flexible memory implementations.

Package and I/O Configuration

The FGG540 package variant features a fine-pitch ball grid array configuration optimized for high-density PCB designs.

I/O Specification Value
Maximum User I/Os 284
I/O Banks 4
Package Type FGG (Fine-Pitch BGA)
Pin Count 540

Supported I/O Standards

The XC2S200-6FGG540C supports multiple industry-standard signaling protocols, providing maximum design flexibility.

Compatible Interface Standards

The device supports 16 different I/O standards including LVTTL, LVCMOS2, and PCI interfaces. The LVTTL, LVCMOS2, and PCI standards offer 5V tolerance, enabling seamless integration with legacy systems.

Standard 5V Tolerant
LVTTL Yes
LVCMOS2 Yes
PCI33_5 Yes
GTL No
SSTL No

Advanced Clocking Features

Delay-Locked Loops (DLLs)

The XC2S200-6FGG540C incorporates four Delay-Locked Loops positioned at each corner of the die. These DLLs provide precise clock management capabilities essential for high-speed digital designs.

The DLL architecture enables clock deskewing across multiple Spartan-II devices on a single board. By driving DLL output off-chip and back, engineers can achieve synchronized board-level clocking with minimal skew.

Speed Grade Information

The “-6” speed grade designation indicates the fastest performance tier within the Spartan-II family. This speed grade is exclusively available in the commercial temperature range (0°C to +85°C), delivering optimal timing characteristics for high-performance applications.

Speed Grade Temperature Range Availability
-6 Commercial (0°C to +85°C) Standard
-5 Commercial/Industrial Standard
-4 Commercial/Industrial Limited

Configuration Options

Flexible Programming Modes

The XC2S200-6FGG540C supports multiple configuration modes for maximum deployment flexibility.

Configuration Mode Description
Master Serial External serial PROM
Slave Serial Daisy-chain capable
Slave Parallel High-speed loading
Boundary Scan JTAG interface

The device stores configuration data in internal static memory cells, enabling unlimited reprogramming cycles throughout the product lifecycle. This programmability permits field upgrades without hardware replacement.

Configurable Logic Block Architecture

CLB Structure and Functionality

Each Configurable Logic Block in the XC2S200-6FGG540C contains four Logic Cells (LCs) as primary building blocks. Every Logic Cell comprises a 4-input function generator, storage element, and dedicated carry logic.

The function generators can implement any arbitrarily defined Boolean function of four inputs. Additionally, two LUTs within a slice combine to create 16 x 2-bit or 32 x 1-bit synchronous RAM structures.

Logic Cell Capabilities

Feature Specification
Function Inputs 4 per LUT
Storage Elements D-type flip-flops or latches
Carry Logic Dedicated per LC
Feedthrough Paths 4 per CLB

Block RAM Architecture

Dual-Port Memory Configuration

The 14 block RAM modules in the XC2S200-6FGG540C are organized in two columns along the vertical edges of the die. Each 4096-bit block supports independent port configurations.

Port Width Depth Address Bus Data Bus
1-bit 4096 ADDR[11:0] DATA[0]
2-bit 2048 ADDR[10:0] DATA[1:0]
4-bit 1024 ADDR[9:0] DATA[3:0]
8-bit 512 ADDR[8:0] DATA[7:0]
16-bit 256 ADDR[7:0] DATA[15:0]

Application Areas

Industrial and Commercial Uses

The XC2S200-6FGG540C excels in numerous application domains requiring programmable logic solutions.

Application Sector Typical Uses
Telecommunications Protocol conversion, signal processing
Industrial Control Motor drives, PLC replacement
Consumer Electronics Video processing, audio systems
Automotive ADAS, infotainment systems
Aerospace Flight control, avionics

Development Tool Support

Design Software Compatibility

The XC2S200-6FGG540C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities.

Tool Category Available Resources
Design Entry VHDL, Verilog support
Synthesis ISE integrated tools
Implementation Place and route optimization
Verification Simulation and timing analysis

Ordering Information

Part Number Breakdown

The XC2S200-6FGG540C part number follows standard AMD/Xilinx nomenclature conventions.

Code Segment Meaning
XC2S Spartan-II family
200 200K system gates
-6 Speed grade (fastest)
FGG Fine-pitch BGA, Pb-free
540 Pin count
C Commercial temperature

The “G” designation indicates RoHS-compliant, Pb-free packaging meeting environmental and safety standards.

Advantages Over Traditional ASICs

Cost and Development Benefits

The XC2S200-6FGG540C eliminates common ASIC development challenges through its reprogrammable architecture.

Factor ASIC XC2S200-6FGG540C
Initial Cost High NRE No NRE
Development Time 6-12 months Days to weeks
Field Upgrades Impossible Unlimited
Design Risk High Minimal

Electrical Characteristics

Power Supply Requirements

Supply Voltage Purpose
VCCINT 2.5V Core logic
VCCO 1.5V to 3.3V I/O banks
VREF Variable Reference voltage

Quality and Compliance

Environmental Standards

The XC2S200-6FGG540C meets stringent quality and environmental standards for global deployment.

Standard Compliance Status
RoHS Compliant (Pb-free)
REACH Compliant
WEEE Compliant

Technical Documentation

Engineers working with the XC2S200-6FGG540C should reference the official Spartan-II FPGA Family Data Sheet (DS001) for complete electrical specifications, timing parameters, and pinout information.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.