The AMD XC2S200-6FGG539C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional processing capabilities with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, consumer electronics, and embedded system applications. As a cost-effective alternative to traditional ASICs, the XC2S200-6FGG539C offers design flexibility with in-field programmability and rapid prototyping capabilities.
Key Features of the AMD XC2S200-6FGG539C Spartan-II FPGA
The XC2S200-6FGG539C stands out in the Xilinx FPGA product lineup with its comprehensive feature set designed for demanding digital design applications. This device combines high logic density with advanced clock management and versatile I/O capabilities.
Core Architecture and Logic Resources
The XC2S200-6FGG539C utilizes a sophisticated configurable logic block (CLB) architecture that provides exceptional design flexibility:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K |
| Speed Grade |
-6 (Highest Performance) |
| Package Type |
539-Pin Fine-Pitch BGA |
Advanced Memory Architecture
The Spartan-II XC2S200-6FGG539C features a dual-memory architecture that provides designers with flexible storage options for various application requirements.
Block RAM Specifications
- Total Block RAM Capacity: 56 Kilobits
- Number of RAM Blocks: 14 dedicated memory blocks
- Configuration: Dual-port synchronous RAM with independent control signals
- Port Aspect Ratios: Configurable from 1×4096 to 16×256
- Memory Organization: Two columns along vertical edges of the die
Distributed RAM Capabilities
- Total Distributed RAM: 75,264 bits
- Implementation: LUT-based RAM within CLBs
- Advantage: Shallow memory structures with fast access times
Clock Management with Delay-Locked Loops (DLLs)
The XC2S200-6FGG539C incorporates four fully digital Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These advanced clock management resources provide:
- Zero propagation delay between input and internal clocks
- Clock multiplication (2× frequency doubling)
- Clock division (up to 16× reduction)
- Phase shifting for precise timing control
- Duty cycle correction for signal integrity
- Board-level clock deskewing across multiple devices
XC2S200-6FGG539C Package and Pin Configuration
539-Pin Fine-Pitch Ball Grid Array (FBGA) Package
The FGG539 package offers superior electrical performance and reliable connections for high-density PCB designs:
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Total Pin Count |
539 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
Compact form factor |
| Mounting |
Surface Mount Technology (SMT) |
I/O Banking Structure
The XC2S200-6FGG539C features an eight-bank I/O structure created by dividing each edge of the FPGA into two separate banks. This architecture enables:
- Multiple I/O voltage support within a single device
- VCCO flexibility for different output standards per bank
- VREF compatibility for input threshold requirements
Supported I/O Standards and Voltage Compatibility
The Spartan-II XC2S200-6FGG539C supports 16 different I/O signaling standards, providing extensive interface compatibility:
Single-Ended Standards
- LVTTL (3.3V Low-Voltage TTL)
- LVCMOS2 (2.5V Low-Voltage CMOS)
- LVCMOS18 (1.8V Low-Voltage CMOS)
- PCI (3.3V PCI Local Bus)
Differential Standards
- LVDS (Low-Voltage Differential Signaling)
- LVPECL (Low-Voltage Positive ECL)
High-Speed Interface Standards
- GTL (Gunning Transceiver Logic)
- GTL+ (Enhanced GTL)
- HSTL (High-Speed Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
Operating Specifications and Environmental Ratings
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.8V to 3.3V (bank-dependent) |
| Maximum Operating Frequency |
Up to 200 MHz system performance |
| Technology Node |
0.18µm CMOS process |
Temperature Ratings
| Grade |
Temperature Range |
| Commercial (C) |
0°C to +85°C |
| Industrial (I) |
-40°C to +100°C |
Note: The -6 speed grade is exclusively available in the Commercial temperature range for optimal high-speed performance.
XC2S200-6FGG539C Part Number Decoder
Understanding the AMD part numbering convention helps identify exact device specifications:
| Code Element |
Meaning |
| XC2S |
Xilinx Spartan-II Family |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade (Fastest) |
| FG |
Fine-Pitch BGA Package |
| G |
Pb-Free (RoHS Compliant) |
| 539 |
539-Pin Configuration |
| C |
Commercial Temperature Grade |
Development Tools and Design Software
The XC2S200-6FGG539C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, and implementation capabilities:
- HDL Support: VHDL and Verilog design entry
- Schematic Capture: Graphical design methodology
- IP Core Integration: Pre-verified intellectual property blocks
- Timing Analysis: Static timing verification
- Power Analysis: Power consumption estimation tools
Application Areas for the Spartan-II XC2S200-6FGG539C
The versatility of the XC2S200-6FGG539C makes it suitable for numerous high-volume applications:
Telecommunications
- Digital signal processing
- Protocol conversion
- Channel encoding/decoding
- Base station equipment
Industrial Automation
- Motor control systems
- PLC implementations
- Sensor interfaces
- Process controllers
Consumer Electronics
- Video processing
- Audio systems
- Display controllers
- Gaming devices
Automotive Systems
- Advanced driver assistance systems (ADAS)
- Infotainment controllers
- Vehicle networking
- Sensor fusion
Embedded Systems
- Custom processor implementations
- Co-processor acceleration
- Interface bridging
- System integration
Advantages Over Traditional ASICs
The AMD XC2S200-6FGG539C provides significant benefits compared to mask-programmed ASICs:
- Eliminated NRE Costs: No non-recurring engineering expenses
- Rapid Time-to-Market: Immediate design implementation without fabrication delays
- In-Field Upgradability: Design modifications without hardware replacement
- Reduced Risk: Prototype validation before volume production
- Design Flexibility: Reconfigurable logic for evolving requirements
Configuration and Programming Options
The Spartan-II XC2S200-6FGG539C supports multiple configuration modes for flexible system integration:
- Master Serial Mode: Self-configuration from external PROM
- Slave Serial Mode: External controller-managed configuration
- Slave Parallel Mode: High-speed parallel data loading
- Boundary Scan (JTAG): IEEE 1149.1 compliant programming
Ordering Information and Availability
When ordering the XC2S200-6FGG539C, specify the complete part number to ensure correct device selection. Pb-free packaging options (indicated by the “G” suffix) comply with RoHS environmental regulations.
Technical Documentation and Support Resources
Comprehensive technical documentation for the XC2S200-6FGG539C includes:
- Complete datasheet (DS001) with electrical specifications
- User guides for design implementation
- Application notes for specific use cases
- Reference designs for rapid development
- Development board compatibility guides
Conclusion
The AMD XC2S200-6FGG539C Spartan-II FPGA delivers an optimal combination of performance, features, and cost-effectiveness for high-volume programmable logic applications. With 200,000 system gates, 5,292 logic cells, 56K block RAM, and four DLLs in a compact 539-pin BGA package, this device provides the resources necessary for implementing complex digital systems. The -6 speed grade ensures maximum performance for timing-critical designs, while the comprehensive I/O standard support enables seamless integration with diverse system interfaces.
