The AMD XC2S200-6FGG538C is a high-performance field-programmable gate array from the renowned Spartan-II FPGA family. This advanced programmable logic device delivers exceptional flexibility and cost-effectiveness for engineers designing complex digital systems. Whether you’re developing telecommunications equipment, industrial control systems, or embedded applications, this Xilinx FPGA provides the programmable resources needed for sophisticated implementations.
Key Features of the XC2S200-6FGG538C FPGA
The XC2S200-6FGG538C combines powerful logic capabilities with efficient resource utilization. This Spartan-II device offers an outstanding balance between performance, power consumption, and cost, making it ideal for high-volume production applications where ASIC alternatives prove too expensive or inflexible.
Logic Resources and System Gate Count
The XC2S200-6FGG538C provides 200,000 system gates with 5,292 logic cells organized in a 28 x 42 Configurable Logic Block (CLB) array. This architecture delivers 1,176 total CLBs, each containing four logic cells with 4-input lookup tables (LUTs), dedicated carry logic, and D-type flip-flops. The substantial logic density enables implementation of complex digital designs including state machines, counters, arithmetic units, and custom processing pipelines.
Memory Architecture and Block RAM
This Spartan-II FPGA features a dual-memory architecture combining distributed RAM with dedicated block RAM resources. The device includes 75,264 bits of distributed RAM within the CLB fabric and 56 kilobits of synchronous dual-port block RAM organized in 14 dedicated memory blocks. Each block RAM cell provides 4,096 bits of fully synchronous storage with independent control signals for each port, supporting configurable data widths from 1-bit to 16-bit access patterns.
Clock Management with Delay-Locked Loops
The XC2S200-6FGG538C integrates four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide advanced clock management capabilities including clock multiplication, division, phase shifting, and skew elimination. The DLL architecture enables board-level clock deskewing across multiple FPGA devices, ensuring precise timing synchronization in multi-chip systems.
XC2S200-6FGG538C Technical Specifications
Understanding the complete specifications helps engineers make informed decisions when selecting this FPGA for their designs.
Package Information and Pin Count
| Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array (FGG) |
| Total Pin Count |
538 |
| Maximum User I/O |
284 |
| Lead-Free Packaging |
Yes (indicated by “G” suffix) |
| Mounting Type |
Surface Mount (SMD/SMT) |
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Maximum Operating Frequency |
263 MHz |
| Process Technology |
0.18μm |
| Speed Grade |
-6 (Fastest) |
Operating Conditions
| Parameter |
Specification |
| Temperature Range |
Commercial (0°C to +85°C) |
| Operating Mode |
In-System Programmable |
| Configuration |
SRAM-based |
I/O Standards and Interface Support
The XC2S200-6FGG538C supports multiple I/O signaling standards, providing exceptional interface flexibility for diverse system requirements.
Supported I/O Standards
The Input/Output Blocks (IOBs) accommodate various electrical interfaces including LVTTL, LVCMOS2, PCI 3.3V, GTL, GTL+, HSTL, SSTL2, SSTL3, and CTT standards. The LVTTL, LVCMOS2, and PCI interfaces provide 5V tolerance, enabling direct connection to legacy TTL and CMOS logic systems without external level shifters.
I/O Banking Architecture
The device organizes I/O pins into multiple banks, each with independent VCCO power supply connections. This banking structure allows different portions of the device to interface with systems operating at different voltage levels simultaneously, maximizing design flexibility for mixed-voltage applications.
Applications for the AMD XC2S200-6FGG538C
This versatile FPGA serves numerous application domains where programmable logic delivers advantages over fixed-function alternatives.
Telecommunications and Networking
The XC2S200-6FGG538C excels in telecommunications infrastructure including base station equipment, network routers, switches, and protocol converters. The high logic density and fast operating frequency enable implementation of complex communication protocols, data framing, error correction, and signal processing functions.
Industrial Control and Automation
Manufacturing systems, motor controllers, and process automation equipment benefit from the device’s reliability and real-time processing capabilities. The commercial temperature rating ensures stable operation in factory environments, while the programmable architecture accommodates evolving control algorithms and interface requirements.
Consumer Electronics
Cost-sensitive consumer products leverage the Spartan-II family’s competitive pricing and proven reliability. Applications include set-top boxes, video processing equipment, gaming peripherals, and smart home devices where reconfigurable logic provides differentiation without custom ASIC development costs.
Automotive Systems
Advanced driver assistance systems (ADAS), infotainment controllers, and vehicle networking modules utilize FPGA technology for rapid prototyping and flexible implementation. The XC2S200-6FGG538C supports automotive development cycles where requirements evolve throughout the design process.
Design Tool Support and Development Resources
Comprehensive development tools streamline the design, verification, and implementation workflow for the XC2S200-6FGG538C.
ISE Design Suite Compatibility
The Xilinx ISE Design Suite provides complete support for Spartan-II FPGA development, including HDL synthesis, implementation, and device programming. The toolchain accepts VHDL and Verilog design entry, performing synthesis optimization, place-and-route, and bitstream generation for device configuration.
Configuration and Programming Options
The XC2S200-6FGG538C supports multiple configuration modes for different system architectures. Master and slave serial modes provide simple point-to-point configuration from PROMs or processors. Parallel configuration modes enable faster programming through 8-bit data interfaces. Boundary scan (JTAG) access facilitates in-system debugging and production testing.
Part Number Breakdown and Ordering Information
Understanding the AMD/Xilinx part numbering convention helps specify the correct device variant.
Part Number Structure
XC2S200-6FGG538C decodes as follows:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (fastest available for this device)
- FG: Fine-pitch Ball Grid Array package type
- G: Lead-free (RoHS compliant) packaging
- 538: Pin count
- C: Commercial temperature range
Speed Grade Considerations
The -6 speed grade represents the fastest available option for the Spartan-II 200K device, exclusively available in commercial temperature range. This speed grade delivers minimum propagation delays and supports the highest operating frequencies, making it optimal for timing-critical applications where performance margins matter most.
Migration and Compatibility Considerations
Engineers evaluating the XC2S200-6FGG538C should consider pin compatibility and upgrade paths within the Spartan-II family.
Pin Compatibility Within Package
The FGG538 package maintains consistent pinout organization across different density options, simplifying PCB design for products that may require future capacity upgrades. VREF pins for larger devices remain compatible when designing boards intended for potential migration to higher-capacity variants.
ASIC Replacement Benefits
The Spartan-II XC2S200-6FGG538C provides a superior alternative to mask-programmed ASICs by eliminating non-recurring engineering costs, reducing development cycles, and enabling field upgrades. Design modifications require only new configuration data rather than expensive mask revisions, dramatically lowering total project risk and cost.
Quality and Compliance Standards
The XC2S200-6FGG538C meets stringent quality and environmental requirements for professional applications.
Environmental Compliance
Lead-free packaging (indicated by the “G” suffix) ensures RoHS (Restriction of Hazardous Substances) compliance for environmentally responsible manufacturing. The device ships in moisture-sensitive packaging with appropriate MSL ratings for automated assembly processes.
Reliability and Qualification
AMD maintains rigorous qualification procedures for Spartan-II devices, including extensive reliability testing across temperature, voltage, and humidity conditions. These qualification standards ensure consistent performance throughout the product’s operational lifetime.
Summary
The AMD XC2S200-6FGG538C Spartan-II FPGA delivers 200,000 system gates, 5,292 logic cells, and 56Kb of block RAM in a 538-pin fine-pitch BGA package. With support for multiple I/O standards, four integrated DLLs for clock management, and operation at frequencies up to 263 MHz, this device provides the programmable logic resources required for demanding telecommunications, industrial, and embedded applications. The -6 speed grade ensures optimal performance for timing-critical designs, while lead-free packaging meets modern environmental compliance requirements.
