The AMD XC2S200-6FGG536C is a high-performance field programmable gate array from the renowned Spartan-II FPGA family. This programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, making it an ideal choice for engineers and designers seeking reliable, cost-effective FPGA solutions for complex embedded applications.

Key Features of the XC2S200-6FGG536C FPGA

The XC2S200-6FGG536C stands out in the programmable logic market with its impressive specifications and versatile architecture. This device belongs to the Spartan-II family, which combines the powerful features of the Virtex FPGA architecture with cost-effective 0.18-micron CMOS process technology.

Logic Resources and System Gates

The XC2S200-6FGG536C provides substantial logic resources for implementing complex digital designs. With 5,292 logic cells and approximately 200,000 system gates, this FPGA can handle demanding signal processing and control applications. The device features a 28 x 42 CLB (Configurable Logic Block) array, totaling 1,176 CLBs that deliver flexible logic implementation options.

Memory Architecture and Block RAM

Memory capabilities represent a critical advantage of the XC2S200-6FGG536C. The device incorporates 56K bits of block RAM organized across 14 dedicated memory blocks, enabling high-speed data buffering and local storage. Additionally, the distributed RAM architecture provides 75,264 bits of memory integrated within the CLB structure, supporting efficient implementation of lookup tables and small memory arrays.

XC2S200-6FGG536C Technical Specifications

Understanding the complete technical specifications helps engineers make informed design decisions when selecting this Xilinx FPGA for their projects.

Core Specifications Table

Speed Grade -6 Performance Characteristics

The -6 speed grade designation indicates this is a higher-performance variant within the Spartan-II family. This speed grade delivers faster signal propagation and improved timing characteristics compared to the standard -5 grade devices. Engineers selecting the XC2S200-6FGG536C benefit from optimized clock frequencies and reduced path delays for time-critical applications.

Package Information: FGG536 Fine-Pitch Ball Grid Array

The XC2S200-6FGG536C utilizes the FGG536 package format, representing a Fine-Pitch Ball Grid Array configuration with 536 balls. The “G” designation indicates Pb-free (lead-free) packaging, ensuring compliance with RoHS environmental directives.

Package Advantages

The FGG536 package offers several advantages for PCB designers and system integrators. The fine-pitch BGA format provides excellent thermal dissipation characteristics, ensuring reliable operation under demanding conditions. The ball grid array arrangement enables efficient routing and reduces parasitic inductance compared to peripheral lead packages.

Pin Configuration and I/O Capabilities

With up to 284 user-configurable I/O pins, the XC2S200-6FGG536C provides extensive connectivity options for interfacing with external peripherals, memory devices, and communication interfaces. The I/O structure supports 16 different interface standards, including LVTTL, LVCMOS, PCI, GTL+, and SSTL, enabling seamless integration into diverse system architectures.

Architecture and Functional Blocks

The XC2S200-6FGG536C architecture incorporates several sophisticated functional blocks that enable high-performance digital designs.

Configurable Logic Blocks (CLBs)

Each CLB contains four logic cells organized in two slices, with each slice featuring two 4-input lookup tables (LUTs), two flip-flops, and dedicated carry logic. This structure supports efficient implementation of combinational logic, sequential circuits, and arithmetic functions. The dedicated carry chain enables high-speed adders, counters, and comparators essential for DSP applications.

Delay-Locked Loops (DLLs)

The XC2S200-6FGG536C incorporates four Delay-Locked Loops positioned at each corner of the die. These DLLs provide advanced clock management capabilities, including clock multiplication, division, and phase shifting. The DLL architecture eliminates clock distribution skew and enables precise timing control across the device.

Input/Output Blocks (IOBs)

The IOB structure surrounding the CLB array provides programmable input and output buffering with support for multiple voltage standards. Each IOB supports programmable slew rate control, pull-up/pull-down resistors, and tri-state capability, enabling flexible interfacing with various external devices.

Application Areas for the XC2S200-6FGG536C

The versatility of the XC2S200-6FGG536C makes it suitable for numerous application domains where programmable logic provides advantages over fixed-function devices.

Industrial Automation and Control

Manufacturing facilities utilize this FPGA for motor control systems, process automation, and machine vision applications. The deterministic timing and parallel processing capabilities enable real-time control loops with microsecond response times.

Telecommunications and Networking

Network equipment designers implement protocol converters, packet processors, and interface bridges using the XC2S200-6FGG536C. The device supports implementation of various communication standards and provides the logic density required for multi-channel systems.

Medical and Scientific Instrumentation

Diagnostic equipment and laboratory instruments benefit from the XC2S200-6FGG536C’s combination of processing capability and I/O flexibility. Signal conditioning, data acquisition, and control sequencing functions integrate efficiently within a single device.

Automotive and Transportation Systems

Vehicle electronics applications leverage this FPGA for sensor processing, display controllers, and communication interfaces. The commercial temperature grade ensures reliable operation in typical automotive environments.

Design Development and Software Support

Developing designs for the XC2S200-6FGG536C requires appropriate software tools and development resources.

ISE Design Suite Compatibility

The Xilinx ISE Design Suite provides comprehensive support for Spartan-II devices, including the XC2S200-6FGG536C. The software environment enables HDL-based design entry using VHDL or Verilog, synthesis optimization, and place-and-route implementation. Timing analysis tools help verify that designs meet performance requirements.

Configuration and Programming Options

The XC2S200-6FGG536C supports multiple configuration modes, including Master Serial, Slave Serial, Slave Parallel, and JTAG boundary scan. In-system programmability enables field upgrades without physical device replacement, providing flexibility throughout the product lifecycle.

Why Choose the XC2S200-6FGG536C for Your Design

Selecting the XC2S200-6FGG536C offers several compelling advantages for development teams and product manufacturers.

Cost-Effective ASIC Alternative

The Spartan-II family provides a superior alternative to mask-programmed ASICs, avoiding initial NRE costs, lengthy development cycles, and the inherent risks of fixed-function devices. The programmability enables iterative design refinement and rapid prototyping.

Field Upgradability

Unlike traditional ASICs, the XC2S200-6FGG536C permits design upgrades after deployment. Bug fixes, feature enhancements, and performance optimizations can be implemented through configuration updates without hardware modifications.

Proven Technology Platform

The Spartan-II architecture represents a mature, well-documented technology platform with extensive application notes, reference designs, and community support. This foundation reduces design risk and accelerates time-to-market for new products.

Ordering Information and Part Number Breakdown

Understanding the XC2S200-6FGG536C part number structure helps ensure correct device selection:

• XC2S200: Device type indicating Spartan-II family with 200K system gates
• -6: Speed grade (higher performance variant)
• FGG: Fine-pitch Ball Grid Array with Pb-free (lead-free) packaging
• 536: Total ball count
• C: Commercial temperature range (0°C to +85°C)

Conclusion: XC2S200-6FGG536C FPGA Summary

The AMD XC2S200-6FGG536C delivers a powerful combination of logic density, memory resources, and I/O flexibility in a compact, lead-free package. With 200,000 system gates, 5,292 logic cells, and comprehensive development tool support, this Spartan-II FPGA provides an excellent platform for industrial, telecommunications, medical, and automotive applications. The -6 speed grade ensures optimal performance for demanding digital designs, while the FGG536 package format offers superior thermal and electrical characteristics for reliable system integration.