The AMD XC2S200-6FGG535C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance for demanding digital design applications, featuring 200,000 system gates, 5,292 logic cells, and the enhanced -6 speed grade for maximum performance. Housed in the FGG535 Fine Pitch Ball Grid Array package, this FPGA offers superior signal integrity and extensive I/O capabilities for complex system designs.
Originally developed by Xilinx (now part of AMD), the Spartan-II family represents a cost-effective solution for high-volume applications requiring reliable programmable logic. The XC2S200-6FGG535C combines advanced 0.18µm CMOS technology with a comprehensive feature set, making it an ideal choice for engineers seeking a proven FPGA solution. For more information about the complete Xilinx FPGA product portfolio, explore our comprehensive resources.
XC2S200-6FGG535C Key Technical Specifications
Core FPGA Architecture and Logic Resources
The XC2S200-6FGG535C features a robust architecture optimized for high-performance digital designs:
- System Gates: 200,000 gates for complex logic implementations
- Logic Cells: 5,292 cells providing flexible programmable logic
- CLB Array: 28 x 42 Configurable Logic Block matrix (1,176 total CLBs)
- Speed Grade: -6 (enhanced performance, commercial temperature range)
- Maximum Frequency: Up to 263 MHz system performance
- Process Technology: Advanced 0.18µm CMOS
On-Chip Memory Resources
Comprehensive memory architecture for data storage and processing:
- Block RAM: 56 Kbits of dedicated dual-port block RAM
- Distributed RAM: 75,264 bits available for distributed memory
- RAM Blocks: 14 dedicated 4Kbit RAM blocks
- Memory Architecture: SelectRAM hierarchical memory with configurable aspect ratios
FGG535 Package and I/O Configuration
The FGG535 Ball Grid Array package offers excellent electrical performance:
- Package Type: 535-Ball Fine Pitch BGA (FGG535)
- Maximum User I/O: Up to 284 user-configurable I/O pins
- I/O Standards: 16 selectable I/O standards supported
- I/O Banks: 8 independent I/O banks for flexible voltage configuration
- Pb-Free Option: RoHS compliant lead-free packaging available
Electrical Characteristics and Power Requirements
Power Supply Specifications
- Core Voltage (VCCINT): 5V nominal (2.375V – 2.625V range)
- I/O Voltage (VCCO): 5V, 2.5V, or 3.3V (bank-selectable)
- Operating Temperature: 0°C to +85°C (Commercial grade)
Supported I/O Interface Standards
The XC2S200-6FGG535C supports a comprehensive range of I/O standards:
- LVTTL (2-24 mA drive strength)
- LVCMOS (2.5V)
- PCI 3.3V/5V (33 MHz/66 MHz compliant)
- GTL and GTL+ for high-speed buses
- HSTL Class I, III, IV for memory interfaces
- SSTL2 and SSTL3 Class I/II for DDR interfaces
- CTT (Center-Tap Terminated)
- AGP-2X for graphics applications
Advanced Spartan-II FPGA Features
Clock Management and Distribution
- Delay-Locked Loops (DLLs): 4 integrated DLLs for advanced clock control
- Global Clock Networks: 4 primary low-skew global clock distribution nets
- Clock Multiplication: 2X clock doubling capability
- Clock Division: Divide by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Phase Control: Four quadrature phases (0°, 90°, 180°, 270°)
Configuration Options
- Master Serial Mode: FPGA controls configuration from serial PROM
- Slave Serial Mode: External controller drives configuration
- Slave Parallel Mode: High-speed 8-bit parallel configuration
- JTAG/Boundary Scan: IEEE 1149.1 compliant for testing and configuration
- Configuration Size: 1,335,840 bits
Target Applications for XC2S200-6FGG535C
Industrial and Control Systems
- Industrial automation and process control
- Motor control and drive systems
- Programmable logic controllers (PLC) implementation
- Test and measurement equipment
Communications and Networking
- Network switching and routing
- Protocol bridging and conversion
- Telecommunications infrastructure
- Wireless base station equipment
Consumer Electronics and Computing
- Digital signal processing (DSP)
- Video and image processing
- Interface bridging and glue logic
- Embedded system co-processing
Key Benefits of AMD XC2S200-6FGG535C FPGA
High-Performance Architecture
- Enhanced Speed Grade: The -6 speed grade delivers superior timing performance for demanding applications
- Low-Power Design: Segmented routing architecture minimizes power consumption
- Fast Interconnect: Predictable routing ensures consistent timing across design iterations
Design Flexibility
- Unlimited Reprogrammability: SRAM-based configuration allows unlimited design iterations
- In-Field Updates: Design upgrades without hardware replacement
- ASIC Replacement: Eliminates NRE costs and lengthy ASIC development cycles
System Integration
- PCI Compliant: Fully compliant with PCI Local Bus specifications
- Hot-Swap Ready: CompactPCI hot-swap friendly design
- Zero Hold Time: Simplified system timing analysis
XC2S200-6FGG535C Technical Specifications Summary
| Parameter |
Specification |
| Device Family |
AMD Xilinx Spartan-II |
| Part Number |
XC2S200-6FGG535C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 CLBs) |
| Block RAM |
56 Kbits (14 blocks x 4Kbits) |
| Distributed RAM |
75,264 bits |
| Maximum User I/O |
284 |
| Package Type |
FGG535 (535-Ball Fine Pitch BGA) |
| Speed Grade |
-6 (Enhanced) |
| Core Voltage |
2.5V |
| I/O Voltage |
1.5V / 2.5V / 3.3V |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Process Technology |
0.18µm CMOS |
| DLLs |
4 |
| Global Clock Networks |
4 |
| I/O Standards Supported |
16 |
| Configuration Size |
1,335,840 bits |
| RoHS Compliant |
Yes (Pb-free option) |
Ordering Information and Part Number Decoder
Part Number Structure
XC2S200-6FGG535C decodes as follows:
- XC2S200: Spartan-II 200K gate device
- -6: Enhanced speed grade (higher performance)
- FGG: Fine Pitch BGA, Pb-free
- 535: 535-ball package
- C: Commercial temperature range (0°C to +85°C)
Development Tools and Design Support
Xilinx ISE Design Suite
The XC2S200-6FGG535C is fully supported by the Xilinx ISE development system, providing:
- Comprehensive HDL synthesis and simulation
- Automatic mapping, placement, and routing
- Timing-driven design implementation
- In-circuit debugging and verification
- Library of 400+ primitives and macros
Related Spartan-II FPGA Products
The AMD Spartan-II family includes devices ranging from 15K to 200K system gates. Related products in the XC2S200 series include:
- XC2S200-5FG456C: Standard speed grade in 456-ball BGA
- XC2S200-6PQ208C: Enhanced speed grade in 208-pin PQFP
- XC2S200-5FG256C: Standard speed grade in compact 256-ball BGA
- XC2S150-6FG456C: 150K gate variant for smaller designs
Conclusion
The AMD XC2S200-6FGG535C represents an excellent choice for engineers requiring a high-performance, cost-effective FPGA solution. With its 200,000 system gates, enhanced -6 speed grade, and comprehensive I/O capabilities, this Spartan-II device delivers the performance and flexibility needed for demanding applications in industrial, communications, and consumer electronics markets. The proven 0.18µm technology, combined with extensive development tool support, ensures reliable implementation of complex digital designs.
