The AMD XC2S200-6FGG534C is a powerful Field Programmable Gate Array from the proven Spartan-II family, delivering exceptional performance and flexibility for demanding digital design applications. This FPGA combines high logic density with advanced features, making it an ideal solution for engineers seeking reliable programmable logic in a compact BGA package.
Key Features of the XC2S200-6FGG534C FPGA
The XC2S200-6FGG534C offers a comprehensive feature set designed to meet the requirements of modern electronic systems. This device provides 200,000 system gates with 5,292 logic cells organized in a 28 x 42 CLB array configuration, totaling 1,176 Configurable Logic Blocks. The architecture supports up to 284 user I/O pins, enabling extensive connectivity options for complex system designs.
Technical Specifications and Performance
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| DLLs |
4 |
| Speed Grade |
-6 |
| Package |
534-Ball Fine Pitch BGA |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm |
Memory Architecture and SelectRAM Technology
The XC2S200-6FGG534C features a hierarchical memory system that includes both distributed RAM and dedicated block RAM resources. The device provides 75,264 bits of distributed RAM integrated within the logic cells, allowing designers to implement small, fast memory structures close to the logic that uses them. Additionally, 56 Kbits of configurable block RAM organized in 14 memory blocks offer flexibility for larger data storage requirements. These block RAM modules support single-port RAM, dual-port RAM, and ROM configurations.
Clock Management with Delay-Locked Loops
Four integrated Delay-Locked Loops positioned at each corner of the die provide advanced clock management capabilities. These DLLs deliver zero-propagation delay and minimal clock skew across the device, ensuring reliable high-speed operation. The DLL functionality includes clock deskewing for board-level clock distribution among multiple devices, making the XC2S200-6FGG534C suitable for complex multi-chip synchronous systems.
I/O Standards and Interface Compatibility
The XC2S200-6FGG534C supports multiple I/O standards for seamless integration with diverse system components. Supported standards include LVTTL, LVCMOS at 2.5V and 3.3V levels, PCI-compliant signaling, and GTL+. The LVTTL, LVCMOS2, and PCI interfaces feature 5V tolerance, providing backward compatibility with legacy systems. I/O voltage flexibility allows the core to operate at 2.5V while I/Os can be powered at 1.5V, 2.5V, or 3.3V depending on interface requirements.
PCI Compliance and System Integration
This FPGA offers full PCI compliance, enabling direct interfacing with PCI buses without external level translators. The hot-swap friendly design supports Compact PCI environments, and zero hold time simplifies system timing analysis. Engineers working on peripheral controller designs, bridge applications, and embedded computing systems will find these features particularly valuable.
Applications for the XC2S200-6FGG534C
The combination of high logic density, flexible memory resources, and comprehensive I/O support makes this Xilinx FPGA suitable for numerous applications across various industries.
Industrial Control Systems
The XC2S200-6FGG534C excels in industrial automation applications requiring real-time signal processing and control logic implementation. The abundant registers with enable, set, and reset capabilities support complex state machine designs, while dedicated carry logic enables high-speed arithmetic operations for motor control and sensor processing.
Communications and Networking Equipment
Fast interfaces to external RAM and efficient multiplier support make this device well-suited for telecommunications equipment, protocol converters, and network interface applications. The cascade chain for wide-input functions supports complex routing and switching logic implementations.
Consumer Electronics and Embedded Systems
As a cost-effective alternative to mask-programmed ASICs, the XC2S200-6FGG534C offers unlimited reprogrammability for consumer electronic products. This flexibility allows design upgrades in the field without hardware replacement, reducing development risk and enabling rapid product iterations.
Package Information and Environmental Compliance
The FGG534 package utilizes a Fine-pitch Ball Grid Array format with 534 balls, providing excellent signal integrity and thermal performance. The Pb-free packaging option, indicated by the “G” in the part number, ensures compliance with RoHS environmental regulations.
Operating Conditions
The -6 speed grade operates exclusively within the commercial temperature range of 0°C to +85°C. This specification ensures reliable operation across typical industrial and commercial environments while maintaining optimal performance characteristics.
Development Support and Design Tools
The XC2S200-6FGG534C is fully supported by the Xilinx ISE Design Suite, providing comprehensive tools for design entry, synthesis, simulation, and implementation. The development environment supports hierarchical design methodologies with automatic mapping, placement, and routing capabilities. IEEE 1149.1 compatible boundary scan logic facilitates board-level testing and debugging.
Configuration Options
Multiple configuration modes accommodate various system requirements. The device supports JTAG programming for in-system configuration and boundary scan testing. External PROM-based configuration enables standalone operation, while master and slave serial and parallel modes provide flexibility for multi-device configurations.
Why Choose the AMD XC2S200-6FGG534C
This FPGA delivers an excellent balance of performance, features, and cost-effectiveness for applications requiring proven, reliable programmable logic. The Spartan-II architecture has demonstrated long-term reliability across millions of deployed systems, making it a trusted choice for designs with extended product lifecycles. The combination of substantial logic resources, flexible memory options, and robust I/O capabilities positions the XC2S200-6FGG534C as a versatile solution for both new designs and legacy system support.
Engineers benefit from the device’s straightforward design flow, comprehensive documentation, and established ecosystem of IP cores and reference designs. Whether implementing custom digital logic, replacing discrete components, or prototyping complex systems, the XC2S200-6FGG534C provides the resources and flexibility needed to achieve design objectives efficiently.
