Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG531C Spartan-II FPGA: Complete Technical Overview and Specifications

Product Details

The AMD XC2S200-6FGG531C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, and embedded system applications.

XC2S200-6FGG531C Key Features and Benefits

The XC2S200-6FGG531C combines advanced programmable logic architecture with cost-effective implementation. Engineers and designers choose this FPGA for its versatility and reliable performance across demanding applications.

High-Density Logic Resources

The XC2S200-6FGG531C offers substantial programmable resources for complex digital designs:

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284

Advanced Memory Architecture

This Spartan-II FPGA features a hierarchical memory system optimized for high-speed data processing:

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56K bits (56,000 bits)
SelectRAM Configuration 16 bits per LUT
Block RAM Modules Configurable 4K bit blocks

XC2S200-6FGG531C Technical Specifications

Package Information for the FGG531 BGA Package

The XC2S200-6FGG531C utilizes a Fine-pitch Ball Grid Array (FBGA) package with 531 balls, providing excellent thermal performance and high pin density for complex PCB designs.

Package Parameter Specification
Package Type FGG531 (Fine-pitch BGA)
Pin Count 531 balls
Package Technology Pb-free (RoHS Compliant)
Mounting Type Surface Mount

Speed Grade and Operating Conditions

The -6 speed grade designation indicates optimized performance characteristics for high-speed digital applications:

Operating Parameter Value
Speed Grade -6 (Fastest)
Maximum Frequency Up to 200 MHz system performance
Core Voltage 2.5V (2.375V to 2.625V range)
I/O Voltage Support 1.5V, 2.5V, 3.3V
Temperature Range Commercial (0°C to 85°C)
Process Technology 0.18 micron CMOS

XC2S200-6FGG531C Architecture Overview

Configurable Logic Block Structure

The XC2S200-6FGG531C architecture builds upon the proven Virtex FPGA technology with streamlined features optimized for cost-sensitive applications. Each Configurable Logic Block (CLB) contains:

  • Four logic cells with 4-input look-up tables (LUTs)
  • Dedicated carry logic for high-speed arithmetic operations
  • Cascade chain support for wide-input functions
  • Abundant registers and latches with enable, set, and reset controls

Clock Distribution and Management

Advanced clock management ensures synchronized operation across complex designs:

Clock Feature Specification
Delay-Locked Loops (DLLs) 4 dedicated DLLs
Global Clock Networks 4 primary low-skew distribution nets
Clock Positioning One DLL at each die corner

Input/Output Block Capabilities

The XC2S200-6FGG531C supports 16 selectable I/O standards for maximum design flexibility:

  • LVTTL and LVCMOS (1.5V, 2.5V, 3.3V)
  • PCI compliant (fully compatible)
  • GTL and GTL+ signaling
  • SSTL and HSTL interfaces
  • 5V tolerant inputs (LVTTL, LVCMOS2, PCI)

XC2S200-6FGG531C Application Areas

Telecommunications and Networking

The high gate count and fast I/O capabilities make the XC2S200-6FGG531C ideal for:

  • Network routers and switches
  • Base station equipment
  • Protocol conversion systems
  • Data encryption and security modules

Industrial Automation

Engineers deploy this FPGA in industrial environments for:

  • Motor control systems
  • PLC implementations
  • Sensor interface processing
  • Real-time control applications

Consumer Electronics

The cost-effective design enables deployment in:

  • Digital video processing
  • Audio equipment
  • Gaming systems
  • Display controllers

Automotive Electronics

Automotive applications benefit from the device’s reliability:

  • Advanced Driver Assistance Systems (ADAS)
  • Infotainment system processing
  • Vehicle communication interfaces
  • Diagnostic equipment

XC2S200-6FGG531C Development and Design Support

Software Development Tools

Designers work with the XC2S200-6FGG531C using industry-standard development tools:

  • Xilinx ISE Design Suite (legacy support)
  • Comprehensive IP core library
  • Simulation and verification tools
  • In-system programming capabilities

Configuration Options

The FPGA supports multiple configuration modes:

  • Serial and parallel configuration interfaces
  • In-system reconfiguration capability
  • Full readback for verification and observability
  • IEEE 1149.1 compatible boundary scan (JTAG)

Why Choose the XC2S200-6FGG531C FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG531C serves as a superior alternative to mask-programmed ASICs. Key advantages include:

  • Eliminates initial NRE (Non-Recurring Engineering) costs
  • Shortens product development cycles
  • Reduces time-to-market significantly
  • Enables field upgrades without hardware replacement
  • Unlimited reprogrammability

Proven Reliability

Built on mature 0.18 micron CMOS process technology, this FPGA delivers:

  • Consistent manufacturing quality
  • Long-term availability
  • Established design methodologies
  • Extensive application documentation

XC2S200-6FGG531C Ordering Information

Part Number Decoder

The XC2S200-6FGG531C part number breaks down as follows:

Code Element Meaning
XC2S200 Spartan-II device, 200K gates
-6 Speed grade (fastest commercial)
FGG Fine-pitch BGA, Pb-free
531 Pin count
C Commercial temperature range

Related Spartan-II Family Devices

For applications requiring different resource levels, consider exploring the complete Xilinx FPGA family portfolio, which includes devices ranging from 15,000 to 200,000 system gates.

XC2S200-6FGG531C Summary Specifications Table

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
Total CLBs 1,176
CLB Array 28 x 42
Block RAM 56K bits
Distributed RAM 75,264 bits
Maximum User I/O 284
DLLs 4
I/O Standards 16 selectable
Core Voltage 2.5V
Speed Grade -6
Package FGG531 (531-ball FBGA)
Temperature Range 0°C to 85°C (Commercial)
Process Technology 0.18 micron CMOS
RoHS Status Compliant (Pb-free)

Conclusion

The AMD XC2S200-6FGG531C represents an excellent balance of performance, features, and cost-effectiveness in the FPGA market. With 200,000 system gates, comprehensive memory resources, and robust I/O capabilities, this Spartan-II device meets the demands of modern digital design across telecommunications, industrial, automotive, and consumer applications. The -6 speed grade ensures optimal performance for high-speed digital processing, while the Pb-free FGG531 package supports environmentally responsible manufacturing practices.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.