The AMD XC2S200-6FGG528C is a high-performance field-programmable gate array from the renowned Spartan-II FPGA family. This versatile programmable logic device delivers exceptional digital processing capabilities with 200,000 system gates and advanced architecture designed for demanding embedded applications. As a proven Xilinx FPGA solution, the XC2S200-6FGG528C offers engineers an ideal balance of performance, flexibility, and cost-effectiveness for complex digital designs.
XC2S200-6FGG528C Overview and Key Features
The XC2S200-6FGG528C represents AMD’s commitment to delivering robust programmable logic solutions. This Spartan-II series device combines second-generation ASIC replacement technology with streamlined features derived from the Virtex FPGA architecture. The -6 speed grade designation indicates optimal performance characteristics specifically designed for commercial temperature applications.
Core Architecture Specifications
The XC2S200-6FGG528C features an impressive array of configurable logic resources:
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM Bits |
75,264 |
| Block RAM Bits |
56K |
| Process Technology |
0.18 micron |
| Core Voltage |
2.5V |
XC2S200-6FGG528C Package Information
FGG528 Fine-Pitch Ball Grid Array Package
The XC2S200-6FGG528C utilizes a 528-ball Fine-Pitch Ball Grid Array (FBGA) package configuration. This Pb-free packaging option is identified by the “G” character in the ordering code, ensuring compliance with modern environmental standards and RoHS directives. The FGG528 package provides excellent thermal performance and reliable electrical connections for high-density PCB assemblies.
Package Benefits for PCB Design
The fine-pitch BGA configuration offers several advantages for system designers. The compact footprint maximizes board space utilization while maintaining superior signal integrity. Ball grid array technology ensures consistent solder joint reliability across automated assembly processes, making it ideal for high-volume manufacturing environments.
Spartan-II FPGA Memory Architecture
SelectRAM Hierarchical Memory System
The XC2S200-6FGG528C incorporates AMD’s SelectRAM hierarchical memory architecture, providing flexible on-chip storage options for diverse application requirements.
Distributed RAM Capabilities
Each look-up table (LUT) within the configurable logic blocks can function as 16 bits of high-speed distributed RAM. This distributed memory architecture delivers 75,264 bits of total distributed RAM capacity, enabling efficient implementation of small, fast memory structures throughout the design.
Configurable Block RAM
The device includes 14 dedicated block RAM modules, each offering 4K-bit capacity. These dual-port memory blocks provide 56K bits of total block RAM, organized in two columns along the vertical edges of the die. Block RAM resources support synchronous read and write operations with independent port configurations.
XC2S200-6FGG528C Clock Management
Delay-Locked Loop Technology
Four dedicated Delay-Locked Loops (DLLs) positioned at each corner of the die provide advanced clock management capabilities. The DLL system enables precise clock distribution with minimal skew across the entire FPGA fabric.
Global Clock Distribution Network
The XC2S200-6FGG528C features four primary low-skew global clock distribution networks. These dedicated routing resources ensure synchronized operation for high-speed synchronous designs requiring precise timing control.
I/O Capabilities and Interface Standards
Versatile Input/Output Configuration
The XC2S200-6FGG528C supports 16 high-performance interface standards, providing exceptional flexibility for system integration. The I/O architecture divides pins into banks with independent VCCO supplies, enabling mixed-voltage designs within a single device.
Supported I/O Standards
The device accommodates multiple signaling standards including:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS) at multiple voltage levels
- PCI (Peripheral Component Interconnect) compliant interfaces
- GTL and GTL+ terminated standards
- 5V tolerant inputs for LVTTL, LVCMOS2, and PCI modes
Hot-Swap and PCI Compliance
The XC2S200-6FGG528C offers hot-swap Compact PCI friendly operation, simplifying integration into hot-pluggable system architectures. Full PCI compliance ensures reliable operation in standard computer bus environments.
XC2S200-6FGG528C Speed Grade and Operating Conditions
Commercial Temperature Range Operation
The -6 speed grade operates exclusively within the commercial temperature range. This specification defines operation from 0°C to +85°C junction temperature, suitable for standard commercial and industrial environments.
Voltage Requirements
| Supply |
Specification |
| Core Logic (VCCINT) |
2.5V |
| I/O Banks (VCCO) |
1.5V, 2.5V, or 3.3V |
Configuration and Programming Options
In-System Programmability
The XC2S200-6FGG528C supports multiple configuration modes including Master Serial, Slave Serial, and SelectMAP parallel configuration. JTAG boundary scan capability enables in-system programming and real-time debugging through IEEE 1149.1 compliant interfaces.
Unlimited Reprogrammability
As an SRAM-based FPGA, the device offers unlimited reprogrammability throughout its operational lifetime. This capability enables field upgrades without hardware replacement, significantly reducing maintenance costs and extending product lifecycles.
Application Areas for XC2S200-6FGG528C
Telecommunications and Networking
The XC2S200-6FGG528C excels in telecommunications applications requiring high-speed data processing and protocol implementation. Fast interfaces to external RAM combined with dedicated carry logic support efficient implementation of communication protocols and network routing functions.
Industrial Automation and Control
Industrial control systems benefit from the device’s reliable operation and flexible I/O capabilities. Motor control, process automation, and programmable logic controller (PLC) implementations leverage the extensive logic resources and deterministic timing characteristics.
Embedded Systems Integration
The Spartan-II architecture provides an excellent platform for embedded system designs requiring custom peripheral interfaces and dedicated processing functions. The combination of block RAM and distributed memory supports efficient data buffering and state machine implementations.
Consumer Electronics Development
Cost-sensitive consumer applications utilize the XC2S200-6FGG528C for custom digital signal processing, display controllers, and multimedia interface implementations. The device’s cost-effective 0.18 micron process technology delivers high gate density at competitive pricing.
Development Tools and Design Support
AMD Vivado and ISE Design Suite
The XC2S200-6FGG528C is fully supported by AMD’s comprehensive development ecosystem. The ISE Design Suite provides synthesis, implementation, and timing analysis tools optimized for Spartan-II architecture. Automatic mapping, placement, and routing algorithms accelerate design closure.
Boundary Scan Testing
IEEE 1149.1 compatible boundary scan logic enables comprehensive board-level testing and debugging. EXTEST and other standard boundary scan modes facilitate production testing and fault diagnosis in assembled systems.
XC2S200-6FGG528C Ordering Information
Part Number Breakdown
The complete part number XC2S200-6FGG528C decodes as follows:
- XC2S200: Spartan-II device with 200,000 system gates
- -6: Speed grade (commercial temperature only)
- FGG: Fine-Pitch BGA, Pb-free packaging
- 528: 528-ball package configuration
- C: Commercial temperature range
Why Choose AMD XC2S200-6FGG528C
The XC2S200-6FGG528C delivers proven reliability backed by extensive field deployment across diverse applications. As a superior alternative to mask-programmed ASICs, this Spartan-II FPGA eliminates initial tooling costs, reduces development cycles, and mitigates the inherent risks associated with conventional ASIC development. The device’s comprehensive feature set, combined with robust development tool support, makes it an excellent choice for both prototyping and production deployment.
Engineers seeking a balance between performance, flexibility, and cost-effectiveness will find the XC2S200-6FGG528C addresses their requirements across telecommunications, industrial, embedded, and consumer electronics applications.
