The AMD XC2S200-6FGG526C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional value for cost-sensitive applications requiring robust digital logic implementation. As a member of the

Xilinx FPGA product line (now part of AMD), this device combines advanced 0.18μm CMOS technology with a streamlined architecture derived from the industry-leading Virtex platform.

The XC2S200-6FGG526C FPGA serves as a superior alternative to mask-programmed ASICs, eliminating high initial costs, lengthy development cycles, and the inflexibility inherent to traditional ASIC solutions. With unlimited in-system reprogrammability, engineers can implement design upgrades in the field without hardware replacement.

XC2S200-6FGG526C Key Technical Specifications

The AMD XC2S200-6FGG526C FPGA offers an optimal balance of logic density, I/O flexibility, and performance for embedded systems and digital design applications.

Parameter	Specification
Part Number	XC2S200-6FGG526C
Device Family	Spartan-II
System Gates	200,000
Logic Cells	5,292
CLB Array	28 x 42 (1,176 CLBs)
Maximum User I/O	284
Distributed RAM	75,264 bits
Block RAM	56Kb (14 blocks × 4Kb)
Delay-Locked Loops (DLL)	4
Global Clock Networks	4
Speed Grade	-6 (Commercial)
Core Voltage (VCCINT)	2.5V
I/O Voltage (VCCO)	1.5V / 2.5V / 3.3V
Operating Temperature	0°C to +85°C (Commercial)
Package Type	FGG526 (Fine-Pitch BGA)
Package Pins	526
Ball Pitch	1.0mm
Process Technology	0.18μm CMOS
RoHS Compliance	Yes (Pb-free)
Maximum Frequency	263MHz

Spartan-II FPGA Architecture and Design Features

Configurable Logic Block (CLB) Structure

The XC2S200-6FGG526C features a 28 x 42 CLB array providing 1,176 total Configurable Logic Blocks. Each CLB contains four logic cells with Look-Up Tables (LUTs) for implementing combinational logic functions. The architecture supports dedicated carry logic chains for high-speed arithmetic operations and efficient multiplier implementations.

SelectRAM Hierarchical Memory System

The XC2S200-6FGG526C incorporates a sophisticated dual-tier memory hierarchy through the SelectRAM architecture. Distributed RAM provides 75,264 bits of flexible storage integrated within the logic fabric at 16 bits per LUT. Additionally, 14 dedicated Block RAM modules deliver 56Kb of high-bandwidth synchronous memory supporting both single-port and dual-port configurations.

Advanced Clock Management with DLL Technology

Four integrated Delay-Locked Loops (DLLs) positioned at each corner of the die enable sophisticated clock management capabilities. These DLLs support clock multiplication, division, and phase shifting for precise timing control. The four primary low-skew global clock distribution networks ensure minimal clock-to-output delays across the entire device.

Flexible I/O Interface Standards and Connectivity

Multi-Standard I/O Support

The XC2S200-6FGG526C supports 16 high-performance interface standards, providing maximum design flexibility:

• LVTTL and LVCMOS (1.5V, 2.5V, 3.3V) for general-purpose interfacing
• PCI 33MHz and PCI 66MHz compliant interfaces
• SSTL2/SSTL3 for DDR memory applications
• HSTL Class III and IV for high-speed signaling
• GTL/GTL+ for bus applications
• CTT for cache tag RAM interfaces
• AGP for graphics applications

FGG526 Fine-Pitch BGA Package Features

The FGG526 package utilizes fine-pitch ball grid array technology with 1.0mm ball pitch, providing excellent signal integrity and thermal performance. This Pb-free (RoHS compliant) package option supports 284 user I/O pins plus four dedicated global clock inputs. The package enables hot-swap Compact PCI friendly operation with controlled power-up sequencing.

XC2S200-6FGG526C FPGA Key Features and Benefits

High-Performance Design Capabilities

• System clock rates up to 200MHz for demanding applications
• 263MHz maximum internal operating frequency (-6 speed grade)
• Low-power segmented routing architecture for optimized power consumption
• Zero hold time simplifying system timing closure
• Fast interfaces to external RAM including DDR support

Design Flexibility and Development Support

• Unlimited in-system reprogrammability for iterative development
• Full readback capability for verification and observability
• IEEE 1149.1 (JTAG) boundary scan logic for testing
• Supported by AMD Vivado and legacy ISE development tools
• Automatic mapping, placement, and routing tools

Target Applications for XC2S200-6FGG526C FPGA

The XC2S200-6FGG526C Spartan-II FPGA is ideal for high-volume, cost-sensitive applications across multiple industries:

Consumer Electronics Applications

• Digital television and display/projection systems
• Set-top boxes and streaming devices
• Gaming consoles and entertainment systems

Networking and Communications

• Broadband access equipment (DSL, cable modems)
• Home networking routers and switches
• Telecommunications infrastructure equipment

Industrial and Embedded Systems

• Industrial automation and control systems
• Test and measurement equipment
• Medical device electronics
• Automotive body electronics and infotainment

Power Supply and Operating Conditions

Voltage Requirements

The XC2S200-6FGG526C operates with a 2.5V core voltage (VCCINT) for internal logic, while I/O banks support flexible VCCO voltages of 1.5V, 2.5V, or 3.3V. This split-rail architecture enables direct interfacing with multiple voltage domains while maintaining low core power consumption. Eight independent VCCO banks provide maximum flexibility for mixed-voltage designs.

Operating Temperature Range

The -6 speed grade XC2S200-6FGG526C is specified for commercial temperature operation from 0°C to +85°C ambient. This operating range covers most consumer, networking, and industrial applications. The device features thermal management capabilities through the BGA package’s excellent thermal dissipation characteristics.

XC2S200-6FGG526C Part Number Breakdown

Understanding the AMD XC2S200-6FGG526C part number structure helps identify device specifications:

Code	Description
XC2S	Device family (Spartan-II)
200	Device density (200K system gates)
-6	Speed grade (fastest commercial grade)
FG	Package type (Fine-Pitch BGA)
G	Pb-free (RoHS compliant)
526	Number of package pins
C	Commercial temperature range (0°C to +85°C)

FPGA Configuration Options

The XC2S200-6FGG526C supports multiple configuration modes including Master/Slave Serial, Master/Slave SelectMAP (parallel), and JTAG boundary scan programming. Configuration can be stored in external serial PROMs, parallel Flash memory, or loaded from an external processor. The device requires approximately 1.4 million configuration bits and supports partial reconfiguration for dynamic system updates.

Why Choose AMD XC2S200-6FGG526C for Your Design

The XC2S200-6FGG526C represents an optimal choice for designers seeking proven reliability, cost efficiency, and design flexibility. As a second-generation ASIC replacement technology, it eliminates the risk and NRE costs associated with custom silicon development. The device’s mature 0.18μm process technology ensures stable supply and predictable pricing for production volumes.

With comprehensive development tool support, extensive documentation, and a large user community, engineers can rapidly prototype and deploy designs using the XC2S200-6FGG526C Spartan-II FPGA. The combination of 200,000 system gates, flexible I/O standards, and integrated memory resources delivers an exceptional platform for diverse digital design applications.

Conclusion

The AMD XC2S200-6FGG526C Spartan-II FPGA delivers industry-leading value for high-volume programmable logic applications. Its combination of 5,292 logic cells, 56Kb block RAM, 284 user I/Os, and support for 16 interface standards makes it an ideal solution for consumer electronics, networking equipment, and industrial systems requiring cost-effective, reprogrammable digital logic implementation.