The AMD XC2S200-6FGG522C is a high-performance field-programmable gate array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional flexibility and reliability for digital design applications, offering engineers a cost-effective alternative to traditional ASICs.
XC2S200-6FGG522C Product Overview
The XC2S200-6FGG522C belongs to AMD’s (formerly Xilinx) Spartan-II FPGA product line, engineered using advanced 0.18μm CMOS process technology. This Xilinx FPGA solution provides unlimited in-system reprogrammability, enabling design modifications without hardware replacement—a capability impossible with conventional ASICs.
Key Features of the Spartan-II XC2S200 FPGA
The XC2S200-6FGG522C integrates several powerful features that make it ideal for demanding digital applications:
- 200,000 System Gates for complex logic implementations
- 5,292 Logic Cells providing extensive design flexibility
- Operating Frequency up to 263MHz
- 2.5V Core Voltage for efficient power consumption
- 522-Pin FGG Package with fine-pitch ball grid array configuration
XC2S200-6FGG522C Technical Specifications
Logic Resources and Architecture
The XC2S200-6FGG522C architecture is built around Configurable Logic Blocks (CLBs) arranged in a 28 x 42 array, totaling 1,176 CLBs. Each CLB contains four logic cells, where each logic cell comprises a 4-input function generator (Look-Up Table), a storage element, and dedicated carry logic.
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Process Technology |
0.18μm |
Memory Resources on XC2S200-6FGG522C
The Spartan-II XC2S200 FPGA provides flexible memory options for various application requirements:
Block RAM Configuration
- Total Block RAM: 56 Kbits
- Number of RAM Blocks: 14
- RAM Architecture: Dual-port synchronous 4096-bit blocks
- Configurable Aspect Ratios: 1×4096, 2×2048, 4×1024, 8×512, 16×256
Distributed RAM
- Total Distributed RAM: 75,264 bits
- Implementation: 16 bits per Look-Up Table
- Configuration: Single-port or dual-port modes
XC2S200-6FGG522C Speed Grade and Performance
The “-6” designation in XC2S200-6FGG522C indicates the speed grade, which is the fastest available option for the Spartan-II family. This speed grade is exclusively available in the Commercial temperature range (0°C to +85°C), making it optimal for high-performance commercial applications.
I/O Capabilities and Standards
User I/O Configuration
The FGG522 package variant of the XC2S200 provides up to 284 user I/O pins, plus four global clock/user input pins. The I/O structure is organized into banks, allowing different voltage standards across the device.
Supported I/O Standards
The XC2S200-6FGG522C supports multiple industry-standard I/O interfaces:
- LVTTL (Low-Voltage TTL)
- LVCMOS (Low-Voltage CMOS)
- PCI (Peripheral Component Interconnect)
- GTL/GTL+ signaling
- SSTL (Stub Series Terminated Logic)
Clock Management and DLL Features
Delay-Locked Loop (DLL) System
The XC2S200-6FGG522C incorporates four Delay-Locked Loops positioned at each corner of the die. These DLLs provide:
- Clock deskewing across the entire FPGA
- Clock multiplication and division
- Phase shifting capabilities
- Board-level clock distribution management
The DLL system enables precise clock management, essential for synchronous designs requiring tight timing specifications.
Configuration Options for XC2S200-6FGG522C
Programming Modes
The Spartan-II XC2S200 supports multiple configuration interfaces:
JTAG/Boundary-Scan Configuration
- IEEE 1149.1 compliant
- In-system programming capability
- Built-in boundary scan for testing and debugging
Serial Configuration Modes
- Master Serial: FPGA generates configuration clock
- Slave Serial: External clock source drives configuration
Parallel Configuration
- Slave Parallel Mode: 8-bit data interface for high-speed configuration
Configuration Requirements
For proper configuration operation, VCCO_2 and VCCO_3 pins require a 3.3V supply. Configuration pins support LVTTL signaling during the programming sequence.
FGG522 Package Information
Package Specifications
The XC2S200-6FGG522C utilizes a Fine-pitch Ball Grid Array (FBGA) package:
- Package Type: FGG522 (Fine-pitch BGA)
- Pin Count: 522 balls
- Lead-Free Option: Available with “G” suffix designation
Pb-Free Packaging
The “G” in FGG522 indicates Pb-free (lead-free) packaging compliance, meeting RoHS environmental regulations for applications requiring lead-free components.
Application Areas for Spartan-II XC2S200
Industrial Applications
The XC2S200-6FGG522C excels in various industrial control and automation systems:
- Motor control and drive systems
- Industrial networking equipment
- Process automation controllers
- Machine vision systems
Communications Equipment
- Network interface cards
- Protocol converters
- Data encryption/decryption systems
- Telecommunications infrastructure
Consumer Electronics
- Video processing systems
- Audio equipment
- Display controllers
- Gaming hardware
Design Development Tools
Software Support
Engineers developing with the XC2S200-6FGG522C can utilize Xilinx ISE Design Suite, which provides:
- HDL synthesis and implementation
- Timing analysis and verification
- Configuration file generation
- Simulation capabilities
Hardware Development
Compatible development resources include:
- JTAG programming cables
- Configuration PROMs
- Evaluation boards
- Reference designs
XC2S200-6FGG522C Part Number Breakdown
Understanding the AMD/Xilinx part numbering system:
| Segment |
Meaning |
| XC2S |
Spartan-II Family |
| 200 |
200K System Gates |
| -6 |
Speed Grade (Fastest) |
| FGG |
Fine-pitch BGA Package |
| 522 |
522-Pin Configuration |
| C |
Commercial Temperature Range |
Advantages Over Mask-Programmed ASICs
The XC2S200-6FGG522C offers significant benefits compared to traditional ASIC solutions:
Cost Efficiency
- No NRE (Non-Recurring Engineering) costs
- Reduced time-to-market
- Lower minimum order quantities
Flexibility
- Field-upgradable designs
- Design modifications without hardware changes
- Rapid prototyping capability
Risk Mitigation
- No mask charges for design revisions
- Shortened development cycles
- Proven silicon availability
Ordering Information and Availability
Standard Part Numbers
- XC2S200-6FGG522C: Commercial temperature, Pb-free package
- XC2S200-6FGG522I: Industrial temperature variant (where available)
Supply Chain Considerations
The Spartan-II family, while mature, remains available through authorized distributors. Engineers should verify current availability and consider lifecycle status for new designs.
Technical Documentation Resources
Comprehensive technical resources support XC2S200-6FGG522C implementation:
- DS001: Spartan-II FPGA Family Data Sheet
- Application Notes for configuration and design
- Pinout tables and package drawings
- Timing specifications and AC/DC characteristics
Conclusion
The AMD XC2S200-6FGG522C Spartan-II FPGA delivers a proven, reliable solution for digital design applications requiring substantial logic resources, flexible I/O capabilities, and high-performance clock management. With 200,000 system gates, 5,292 logic cells, and comprehensive memory resources, this FPGA provides engineers the tools needed for successful product development while avoiding the costs and risks associated with custom ASIC development.
Whether implementing industrial control systems, communications equipment, or consumer electronics, the XC2S200-6FGG522C offers the performance, flexibility, and cost-effectiveness that modern digital design demands.
