The AMD XC2S200-6FGG521C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional value for engineers seeking cost-effective, reliable digital design solutions. Built on proven 0.18-micron CMOS technology, this Xilinx FPGA offers the perfect balance of performance, flexibility, and affordability for industrial, telecommunications, and embedded applications.

Key Features of the XC2S200-6FGG521C FPGA

The XC2S200-6FGG521C combines advanced programmable logic capabilities with robust architecture. This device provides engineers with comprehensive resources for implementing complex digital designs without the high costs associated with ASICs.

XC2S200-6FGG521C Technical Specifications

Spartan-II FPGA Architecture Overview

The XC2S200-6FGG521C leverages the proven Spartan-II architecture, which builds upon the successful Virtex FPGA design philosophy. This architecture provides a flexible, regular array of Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs).

Configurable Logic Block (CLB) Structure

Each CLB in the XC2S200-6FGG521C contains four Logic Cells (LCs), organized into two slices. Every Logic Cell includes:

• One 4-input Look-Up Table (LUT) for function generation
• One dedicated flip-flop with configurable clock enable
• Independent Set/Reset control signals
• Fast carry logic for arithmetic operations
• Dedicated multiplexer outputs

The 28 x 42 CLB array provides 1,176 total CLBs, delivering substantial logic resources for complex digital designs. This architecture supports both synchronous and asynchronous design methodologies.

SelectRAM Hierarchical Memory System

The XC2S200-6FGG521C features a comprehensive SelectRAM memory hierarchy that offers flexibility for various data storage requirements.

Distributed RAM Specifications

• Total Distributed RAM: 75,264 bits
• Configuration: 16 bits per LUT
• Access Type: Single-port or dual-port
• Synchronous Operation: Yes
• Use Cases: FIFOs, small buffers, register files

Block RAM Configuration

• Total Block RAM: 56 Kbits
• Number of RAM Blocks: 14 dedicated blocks
• Block Size: 4,096 bits per block
• Port Configuration: Dual-port with independent controls
• Data Width Options: 1, 2, 4, 8, or 16 bits
• Synchronous Operation: Fully synchronous read and write

The dual-port block RAM supports independent read and write operations with configurable aspect ratios. Engineers can configure each port independently for different data widths, enabling efficient memory utilization.

Digital Clock Management with DLL Technology

The XC2S200-6FGG521C incorporates four dedicated Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These DLLs provide advanced clock management capabilities essential for high-performance digital systems.

DLL Features and Capabilities

• Zero Propagation Delay: Eliminates on-chip clock distribution delay
• Low Clock Skew: Ensures synchronized clock delivery across the device
• Clock Multiplication: 2x frequency synthesis capability
• Clock Division: Divide input clock for lower-frequency domains
• Duty Cycle Correction: Maintains 50% duty cycle for optimal performance
• Board-Level Deskew: Synchronizes clocks across multiple FPGAs

The DLL can delay configuration completion until lock is achieved, ensuring stable system clock operation before device activation.

XC2S200-6FGG521C I/O Standards and Capabilities

The SelectIO technology in the XC2S200-6FGG521C supports 16 different I/O standards, providing exceptional interface flexibility.

Supported I/O Standards

I/O Bank Organization

The device organizes I/O pins into banks, with each bank supporting specific voltage levels. This architecture enables mixed-voltage interfacing within a single device while maintaining signal integrity.

FGG521 BGA Package Information

The XC2S200-6FGG521C utilizes the FGG521 Fine-Pitch Ball Grid Array package, optimized for high pin-count applications requiring compact board space.

Package Characteristics

• Package Type: Fine-Pitch BGA (FBGA)
• Total Balls: 521
• Ball Pitch: 1.0mm
• Body Size: Compact form factor
• Thermal Performance: Enhanced thermal dissipation
• Pb-Free Option: RoHS compliant variants available

The “G” designation in FGG521 indicates Pb-free (lead-free) packaging, making this device compliant with environmental regulations.

Speed Grade -6 Performance Specifications

The -6 speed grade represents the highest performance tier in the Spartan-II family, offering superior timing characteristics for demanding applications.

Timing Specifications

• Maximum System Frequency: 263 MHz
• CLB-to-CLB Delay: Optimized routing
• Block RAM Access Time: High-speed synchronous access
• I/O Timing: Fast input/output switching
• DLL Lock Time: Rapid clock stabilization

The -6 speed grade is exclusively available in the Commercial temperature range, ensuring optimal performance for standard operating environments.

Configuration and Programming Options

The XC2S200-6FGG521C supports multiple configuration modes for flexible system integration.

Configuration Modes

• Master Serial Mode: FPGA generates clock, reads from serial PROM
• Slave Serial Mode: External controller provides clock and data
• Master Parallel Mode: 8-bit parallel data from external memory
• Slave Parallel Mode: Controlled by external processor
• JTAG/Boundary Scan: IEEE 1149.1 compliant programming

Configuration Features

• In-System Programming: Unlimited reprogrammability
• Readback Capability: Design verification support
• Partial Reconfiguration: Module-level updates
• Encryption Support: Design security options

XC2S200-6FGG521C Application Areas

The versatility of the XC2S200-6FGG521C makes it suitable for numerous application domains.

Industrial Applications

• Programmable Logic Controllers (PLCs)
• Motor control systems
• Factory automation equipment
• Process control instrumentation

Telecommunications Applications

• Network switching equipment
• Base station infrastructure
• Protocol conversion bridges
• Digital signal processing

Consumer Electronics Applications

• Video processing systems
• Audio equipment
• Gaming peripherals
• Display controllers

Automotive Applications

• Infotainment systems
• Advanced driver assistance systems (ADAS)
• Sensor fusion platforms
• Vehicle network gateways

Advantages Over ASIC Solutions

The XC2S200-6FGG521C offers significant advantages compared to Application-Specific Integrated Circuits.

Cost Benefits

• Zero NRE (Non-Recurring Engineering) costs
• No mask charges or fabrication fees
• Reduced inventory risk with single SKU
• Lower minimum order quantities

Development Benefits

• Faster time-to-market
• In-field upgradability
• Design iteration flexibility
• Reduced development risk

Technical Benefits

• Unlimited reprogrammability
• Field-upgradable functionality
• Hardware debugging capability
• Design reuse across projects

Development Tool Support

The XC2S200-6FGG521C is fully supported by comprehensive development tools.

Software Tools

• ISE Design Suite: Complete design environment
• HDL Support: VHDL and Verilog synthesis
• Schematic Capture: Graphical design entry
• Simulation: Behavioral and timing simulation
• Implementation: Automatic place and route

IP Core Availability

• Processor cores (soft processors)
• Memory controllers
• Communication interfaces
• DSP functions

Ordering Information for XC2S200-6FGG521C

Understanding the part number structure helps ensure correct device selection.

Part Number Breakdown

XC2S200-6FGG521C
│  │   │ │  │  │
│  │   │ │  │  └─ Temperature: C = Commercial (0°C to +85°C)
│  │   │ │  └──── Pin Count: 521
│  │   │ └─────── Package: FGG = Fine-pitch BGA, Pb-free
│  │   └───────── Speed Grade: -6 (Fastest)
│  └───────────── Device Density: 200K system gates
└──────────────── Family: XC2S = Spartan-II

Related Spartan-II FPGA Family Devices

Quality and Reliability Standards

The XC2S200-6FGG521C meets stringent quality standards.

Compliance

• RoHS compliant (Pb-free variants)
• REACH compliant
• ISO 9001 manufacturing
• JEDEC qualified

Reliability Testing

• Temperature cycling
• Humidity testing
• Electrostatic discharge (ESD) testing
• Latch-up testing

Technical Documentation Resources

Engineers working with the XC2S200-6FGG521C should reference these key documents:

• DS001: Spartan-II FPGA Family Data Sheet
• Configuration guides
• Application notes
• PCB design guidelines

Summary

The AMD XC2S200-6FGG521C represents an excellent choice for engineers requiring a cost-effective, high-performance FPGA solution. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O support, this Spartan-II device delivers the resources needed for complex digital designs. The -6 speed grade ensures maximum performance, while the FGG521 BGA package provides compact, reliable physical integration. Whether for industrial automation, telecommunications infrastructure, or embedded systems, the XC2S200-6FGG521C offers proven reliability and exceptional value.