The AMD XC2S200-6FGG511C is a high-performance Field-Programmable Gate Array (FPGA) from the renowned Spartan-II family. This powerful programmable logic device offers 200,000 system gates, making it an ideal solution for engineers seeking cost-effective, reliable digital design implementation. Whether you’re developing industrial control systems, telecommunications equipment, or embedded applications, the XC2S200-6FGG511C delivers exceptional performance with advanced architectural features.
Key Features of the XC2S200-6FGG511C FPGA
The AMD XC2S200-6FGG511C combines cutting-edge semiconductor technology with versatile programmable architecture. This section covers the essential specifications that make this Xilinx FPGA a preferred choice among hardware designers.
System Gate Capacity and Logic Resources
The XC2S200-6FGG511C features impressive logic density:
- 200,000 System Gates for complex digital circuit implementation
- 5,292 Logic Cells providing extensive design flexibility
- 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 x 42 array
- 284 Maximum User I/O Pins for comprehensive external connectivity
Advanced Memory Architecture
This Spartan-II FPGA incorporates a hierarchical memory system designed for optimal performance:
- 56K Bits Block RAM organized in 14 dedicated memory blocks
- 75,264 Bits Distributed RAM utilizing Look-Up Tables (LUTs)
- Dual-Port Block RAM with independent control signals for each port
- Configurable Memory Widths supporting 1, 2, 4, 8, or 16-bit data paths
XC2S200-6FGG511C Technical Specifications
Package and Physical Characteristics
| Parameter |
Specification |
| Package Type |
FGG511 Fine Pitch BGA |
| Pin Count |
511 Balls |
| Process Technology |
0.18 Micron CMOS |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V, 2.5V, or 3.3V |
Speed Grade and Performance
The -6 speed grade designation indicates higher performance capabilities:
- Maximum System Clock Rate: Up to 200 MHz
- Internal Clock Frequency: 263 MHz maximum
- Temperature Range: Commercial (0°C to +85°C)
- Speed Grade: -6 (Higher Performance)
Clock Distribution and Delay-Locked Loops
DLL Architecture for Precision Timing
The XC2S200-6FGG511C integrates four fully digital Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide:
- Zero Propagation Delay clock distribution
- Low Clock Skew across all clock networks
- Clock Multiplication (2X) capabilities
- Clock Division options (1.5, 2, 2.5, 3, 4, 5, 8, or 16)
- Quadrature Phase Outputs (0°, 90°, 180°, 270°)
Global Clock Network
The device features dedicated global routing resources:
- Four Primary Global Clock Networks for high-fanout distribution
- 24 Secondary Backbone Lines for flexible clock routing
- Dedicated Clock Input Pins with minimal skew characteristics
Versatile I/O Standards and Interface Support
Supported I/O Standards
The XC2S200-6FGG511C supports 16 high-performance interface standards:
| Standard |
Reference Voltage (VREF) |
Output Voltage (VCCO) |
| LVTTL |
N/A |
3.3V |
| LVCMOS2 |
N/A |
2.5V |
| PCI (3V/5V) |
N/A |
3.3V |
| GTL |
0.8V |
N/A |
| GTL+ |
1.0V |
N/A |
| HSTL Class I |
0.75V |
1.5V |
| HSTL Class III/IV |
0.9V |
1.5V |
| SSTL3 Class I/II |
1.5V |
3.3V |
| SSTL2 Class I/II |
1.25V |
2.5V |
| CTT |
1.5V |
3.3V |
| AGP-2X |
1.32V |
3.3V |
I/O Bank Configuration
The FPGA organizes I/O resources into eight independent banks:
- Flexible VCCO Configuration per bank
- Independent VREF Routing for mixed-voltage designs
- 5V Tolerance Support on LVTTL, LVCMOS2, and PCI standards
- Programmable Pull-Up/Pull-Down Resistors on each I/O
Configurable Logic Block Architecture
CLB Structure and Capabilities
Each CLB in the XC2S200-6FGG511C contains four Logic Cells (LCs) organized in two slices:
- 4-Input Look-Up Tables (LUTs) for function generation
- Dedicated Carry Logic for high-speed arithmetic operations
- D-Type Flip-Flops with synchronous/asynchronous set/reset
- Cascade Chains for wide-input function implementation
- Dual 3-State Buffers (BUFTs) per CLB for on-chip busses
Arithmetic and Multiplier Support
The dedicated carry logic enables:
- High-Speed Addition/Subtraction operations
- Efficient Multiplier Implementation with dedicated AND gates
- Two-Bit Carry Chains per CLB for arithmetic cascading
Configuration Modes and Options
Supported Configuration Interfaces
The XC2S200-6FGG511C supports multiple configuration modes for design flexibility:
| Mode |
CCLK Direction |
Data Width |
Description |
| Master Serial |
Output |
1-bit |
FPGA controls PROM configuration |
| Slave Serial |
Input |
1-bit |
External controller provides data |
| Slave Parallel |
Input |
8-bit |
Fastest configuration option |
| Boundary Scan |
N/A |
1-bit |
IEEE 1149.1 JTAG interface |
Configuration Bitstream Size
- Configuration File Size: 1,335,840 bits
- Unlimited Reprogramming Cycles with SRAM-based architecture
- In-System Reconfiguration capability
Boundary Scan and JTAG Support
IEEE 1149.1 Compliance
The XC2S200-6FGG511C provides full IEEE 1149.1 boundary scan support:
- EXTEST for external interconnect testing
- SAMPLE/PRELOAD for device state capture
- BYPASS for scan chain optimization
- INTEST for internal logic testing
- IDCODE for device identification
- CFG_IN/CFG_OUT for JTAG configuration and readback
Application Areas for XC2S200-6FGG511C
The XC2S200-6FGG511C FPGA excels in numerous applications:
Industrial and Automation
- Motor control systems
- Industrial networking equipment
- Process automation controllers
- Machine vision processing
Telecommunications
- Protocol conversion bridges
- Baseband processing
- Network interface cards
- Digital signal processing
Consumer Electronics
- Video processing systems
- Audio codec implementation
- Display controllers
- Gaming peripherals
Embedded Systems
- Co-processor acceleration
- Custom peripheral interfaces
- Real-time control systems
- Prototyping and development
Design Tools and Development Support
Software Compatibility
The XC2S200-6FGG511C is fully supported by:
- Xilinx ISE Design Suite for synthesis, placement, and routing
- Industry-Standard HDL Tools supporting VHDL and Verilog
- EDIF Netlist Interface for third-party tool integration
- Timing Analyzer for performance verification
Design Resources
- 400+ Library Primitives and Macros for rapid development
- Hierarchical Design Support for complex projects
- Automatic Place-and-Route with timing-driven optimization
- In-Circuit Debugging capabilities via readback
Ordering Information and Part Numbering
Part Number Breakdown: XC2S200-6FGG511C
| Segment |
Value |
Meaning |
| XC2S |
200 |
Spartan-II family, 200K gates |
| Speed |
-6 |
Higher performance grade |
| Package |
FGG |
Fine Pitch BGA, Pb-free |
| Pins |
511 |
511-ball package |
| Temp |
C |
Commercial (0°C to +85°C) |
Pb-Free Packaging
The “G” designation in FGG indicates RoHS-compliant Pb-free packaging, meeting environmental and regulatory requirements for lead-free electronics manufacturing.
Why Choose the AMD XC2S200-6FGG511C
The XC2S200-6FGG511C offers compelling advantages for your next design:
- Cost-Effective ASIC Alternative eliminating NRE costs and long development cycles
- Field Upgradability through unlimited reprogramming
- Proven 0.18μm Technology ensuring reliability and availability
- Comprehensive I/O Flexibility with 16 supported standards
- Advanced Clock Management with four integrated DLLs
- Extensive Memory Resources combining block and distributed RAM
Summary
The AMD XC2S200-6FGG511C Spartan-II FPGA represents an excellent choice for designers requiring substantial logic density, versatile I/O capabilities, and reliable performance. With 200,000 system gates, 56K bits of block RAM, and support for 16 I/O standards, this FPGA delivers the flexibility and performance needed for demanding applications across industrial, telecommunications, and embedded markets.
For engineers evaluating programmable logic solutions, the XC2S200-6FGG511C combines proven architecture with comprehensive tool support, making it a smart investment for both new designs and legacy system maintenance.
