The AMD XC2S200-6FGG510C is a high-performance Field Programmable Gate Array (FPGA) from the industry-proven Spartan-II family. This versatile programmable logic device delivers exceptional flexibility, reliability, and cost-effectiveness for demanding digital design applications. Engineered with advanced 0.18μm process technology, the XC2S200-6FGG510C offers superior performance characteristics that make it an ideal choice for telecommunications, industrial automation, and embedded system designs.

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Key Features of AMD XC2S200-6FGG510C FPGA

The XC2S200-6FGG510C stands out as a premium Xilinx FPGA solution, combining substantial logic capacity with high-speed performance. This device incorporates numerous advanced features that distinguish it from competing programmable logic solutions.

High-Density Logic Architecture

The XC2S200-6FGG510C provides an impressive 200,000 system gates with 5,292 logic cells organized in a 28 × 42 Configurable Logic Block (CLB) array. Each CLB contains four Logic Cells (LCs), where every LC includes a 4-input function generator, carry logic, and a storage element. This architecture enables efficient implementation of complex digital circuits while maintaining excellent resource utilization.

Advanced Memory Resources

This Spartan-II FPGA integrates dual memory architectures to accommodate diverse application requirements:

• Distributed RAM: 75,264 bits of distributed memory embedded within CLBs for fast, localized data storage
• Block RAM: 56 Kbits (14 dedicated blocks) of dual-port synchronous RAM with independent read/write ports

The dual-port Block RAM cells operate as fully synchronous 4,096-bit memories with configurable data widths, enabling flexible memory implementations for FIFOs, buffers, and lookup tables.

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XC2S200-6FGG510C Technical Specifications

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XC2S200-6FGG510C Package Information

FGG510 Ball Grid Array Package

The XC2S200-6FGG510C utilizes the FGG510 fine-pitch ball grid array package, which delivers optimal board-level integration and thermal performance. This package configuration provides:

• 510-pin BGA format for maximum I/O flexibility
• Fine 1.0mm ball pitch enabling compact PCB layouts
• Enhanced thermal dissipation through BGA thermal path
• Excellent signal integrity with controlled impedance routing
• Lead-free (Pb-free) option available for RoHS compliance

I/O Banking Structure

The device features a sophisticated I/O banking architecture with four independent I/O banks. Each bank supports multiple I/O standards including LVTTL, LVCMOS, PCI, GTL+, SSTL, and HSTL interfaces, enabling seamless connectivity with diverse system components.

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Speed Grade -6 Performance Characteristics

The -6 speed grade designation indicates the highest performance tier within the XC2S200 device family. This grade delivers:

• Maximum internal clock frequency of 263 MHz
• Optimized timing parameters for demanding applications
• Enhanced setup and hold times for reliable operation
• Superior clock-to-output delays enabling high-speed interfaces

Engineers selecting the -6 variant gain access to faster logic paths and reduced propagation delays compared to -4 and -5 speed grades, making this device ideal for performance-critical designs.

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Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG510C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide essential clock management capabilities:

Clock Conditioning Features

• Duty cycle correction maintaining 50% duty cycle output
• Phase shifting in 90° increments
• Clock multiplication (2×) and division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×)
• De-skewing eliminating clock distribution delays
• Clock mirroring for external timing synchronization

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Applications for XC2S200-6FGG510C FPGA

Telecommunications Infrastructure

The XC2S200-6FGG510C excels in telecommunications equipment including base station controllers, network switches, routers, and protocol converters. Its high I/O count and fast processing capabilities enable efficient packet processing and signal conditioning.

Industrial Automation Systems

Manufacturing environments benefit from this FPGA’s reliability in motor control systems, programmable logic controllers (PLCs), sensor interfaces, and real-time monitoring equipment. The commercial temperature rating ensures stable operation in factory settings.

Embedded Computing Platforms

System designers leverage the XC2S200-6FGG510C for embedded applications requiring custom peripheral interfaces, hardware acceleration, and flexible I/O expansion. The device serves as an excellent coprocessor for microcontroller-based systems.

Digital Signal Processing

With substantial logic resources and integrated block RAM, this FPGA handles DSP algorithms including filtering, modulation/demodulation, and signal analysis. The high-speed architecture supports real-time processing requirements.

Prototyping and Development

Engineers utilize the XC2S200-6FGG510C for ASIC prototyping and product development, benefiting from rapid design iterations and field-upgradable implementations that reduce time-to-market.

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XC2S200-6FGG510C Ordering Information

Part Number Decoding

XC2S200-6FGG510C breaks down as follows:

Available Temperature Grades

• C (Commercial): 0°C to +85°C ambient
• I (Industrial): -40°C to +100°C ambient (check availability)

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Design Resources and Development Tools

ISE Design Suite

AMD provides the ISE Design Suite for Spartan-II development, offering comprehensive synthesis, implementation, and verification capabilities. The toolset includes:

• ISE Foundation for complete design flow
• ISE WebPACK (free version) supporting Spartan-II devices
• ChipScope Pro for embedded logic analysis
• CORE Generator IP catalog access

Configuration Options

The XC2S200-6FGG510C supports multiple configuration modes:

• Master Serial Mode using Xilinx Platform Flash PROMs
• Slave Serial Mode for processor-controlled loading
• Master/Slave Parallel Mode for faster configuration
• JTAG/Boundary Scan for in-system programming

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Why Choose AMD XC2S200-6FGG510C?

Cost-Effective ASIC Alternative

The XC2S200-6FGG510C eliminates non-recurring engineering (NRE) costs associated with custom ASIC development. Its in-system reprogrammability enables design modifications without hardware changes, significantly reducing product development expenses and risks.

Proven Reliability

The Spartan-II family has established an exceptional track record across millions of deployed units worldwide. This mature platform provides engineers with confidence in long-term availability and consistent performance.

Comprehensive Ecosystem

Extensive documentation, application notes, reference designs, and third-party IP cores accelerate development cycles. The active user community and technical support resources ensure designers can resolve challenges quickly.

Field Upgradeability

Unlike fixed-function devices, the XC2S200-6FGG510C accepts firmware updates in deployed systems. This capability enables bug fixes, feature additions, and performance optimizations throughout the product lifecycle.

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Conclusion

The AMD XC2S200-6FGG510C represents an outstanding choice for engineers requiring a robust, high-performance FPGA solution. With its generous 200,000 system gates, 5,292 logic cells, integrated block RAM, and four DLLs packaged in a 510-pin BGA, this Spartan-II device delivers the resources needed for sophisticated digital designs. The -6 speed grade ensures maximum performance, while the commercial temperature rating provides reliable operation across typical operating environments. Whether developing telecommunications equipment, industrial controls, or embedded systems, the XC2S200-6FGG510C offers the flexibility, performance, and value that professional designers demand.