Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG508C Spartan-II FPGA | High-Performance Programmable Logic Device

Product Details

The AMD XC2S200-6FGG508C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This versatile programmable logic device delivers exceptional performance with 200,000 system gates, making it ideal for cost-sensitive digital designs requiring flexibility and reliability. The -6 speed grade offers the fastest performance available in the commercial temperature range.

XC2S200-6FGG508C Key Features and Benefits

The XC2S200-6FGG508C combines powerful logic resources with advanced memory capabilities, providing engineers with a superior alternative to mask-programmed ASICs. This FPGA eliminates lengthy development cycles and reduces design risk while enabling field-upgradable functionality.

Core Logic Resources

The device features 1,176 Configurable Logic Blocks (CLBs) arranged in a 28×42 array architecture. Each CLB contains four logic cells with 4-input function generators (LUTs), storage elements, and dedicated carry logic. This translates to 5,292 logic cells capable of implementing complex digital designs.

High-Capacity Embedded Block RAM

Integrated 56Kb of dual-port Block RAM provides high-speed on-chip memory for data buffering, FIFO implementation, and register file applications. Each 4,096-bit RAM block operates as fully synchronous dual-ported memory with independent control signals and configurable data widths for maximum design flexibility.

Advanced Clock Management

Four integrated Delay-Locked Loops (DLLs) positioned at each die corner deliver precise clock distribution and deskewing capabilities. The DLLs support clock multiplication, division, and phase shifting to optimize system timing across your entire design.

XC2S200-6FGG508C Technical Specifications

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Maximum User I/O 284
Block RAM 56Kb (14 × 4,096 bits)
Distributed RAM 75,264 bits
DLLs 4
Maximum Frequency 263MHz
Process Technology 0.18µm CMOS
Core Voltage 2.5V
I/O Voltage 1.5V to 3.3V
Speed Grade -6 (Fastest)
Package Type 508-Pin Fine-Pitch BGA (Pb-Free)
Temperature Range Commercial (0°C to +85°C)
Configuration Memory 1,335,840 bits

XC2S200-6FGG508C Package Information

The FGG508 package utilizes a fine-pitch Ball Grid Array (BGA) format with lead-free (Pb-free) solder balls, ensuring RoHS compliance for environmentally conscious manufacturing. This package provides excellent thermal dissipation characteristics and superior signal integrity for high-speed applications.

Flexible I/O Standards Support

The XC2S200-6FGG508C Input/Output Blocks (IOBs) support multiple signaling standards including:

  • LVTTL and LVCMOS (3.3V, 2.5V, 1.8V, 1.5V)
  • PCI 3.3V compliant
  • GTL and GTL+
  • SSTL3 Class I and II
  • SSTL2 Class I and II
  • HSTL Class I, III, and IV
  • CTT

VersaRing I/O Routing Technology

The VersaRing routing architecture between the CLB array and IOBs facilitates efficient pin-swapping and pin-locking. This technology enables logic redesigns to adapt to existing PCB layouts, significantly reducing time-to-market for iterative development cycles.

XC2S200-6FGG508C Applications

This versatile Xilinx FPGA excels in numerous application areas where programmable flexibility and cost-effectiveness are paramount:

Industrial and Automation

  • Motor control systems
  • Process control interfaces
  • Industrial communication protocols
  • Sensor data acquisition

Consumer Electronics

  • Display controllers
  • Audio/video processing
  • Peripheral interfaces
  • Consumer appliance control

Communications Equipment

  • Protocol conversion bridges
  • Data encoding/decoding
  • Interface adapters
  • Network processing

Embedded Systems

  • Microcontroller peripherals
  • Custom logic functions
  • Glue logic replacement
  • Prototype development

XC2S200-6FGG508C Configuration Options

The Spartan-II FPGA supports multiple configuration modes for maximum system design flexibility:

Configuration Mode Data Width CCLK Direction
Master Serial 1-bit Output
Slave Serial 1-bit Input
Slave Parallel 8-bit Input
Boundary-Scan (JTAG) 1-bit N/A

Configuration data can be loaded from serial PROMs, parallel flash memory, microcontrollers, or via JTAG interface for in-system programming and debugging capabilities.

Why Choose the XC2S200-6FGG508C FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG508C eliminates expensive mask charges and lengthy fabrication cycles associated with traditional ASICs. Design modifications can be implemented through simple configuration updates without hardware changes.

Rapid Prototyping to Production

The same device seamlessly transitions from initial prototyping through full production deployment. Field-upgradable firmware enables post-deployment feature enhancements and bug fixes.

Proven Reliability

Built on mature 0.18µm CMOS process technology, the Spartan-II family delivers proven reliability backed by extensive characterization data and industry-wide deployment experience.

Comprehensive Development Support

Compatible with AMD/Xilinx ISE Design Suite tools, providing complete synthesis, implementation, and verification capabilities. Extensive documentation, application notes, and reference designs accelerate development timelines.

XC2S200-6FGG508C Ordering Information

The part number XC2S200-6FGG508C decodes as follows:

  • XC2S200: Spartan-II device with 200K system gates
  • -6: Fastest speed grade (commercial)
  • FGG: Fine-pitch BGA package (Pb-free/Green)
  • 508: 508-pin package
  • C: Commercial temperature range (0°C to +85°C)

Related Spartan-II FPGA Products

The Spartan-II family includes devices ranging from 15,000 to 200,000 system gates in various package options:

  • XC2S15: 15,000 gates, 432 logic cells
  • XC2S30: 30,000 gates, 972 logic cells
  • XC2S50: 50,000 gates, 1,728 logic cells
  • XC2S100: 100,000 gates, 2,700 logic cells
  • XC2S150: 150,000 gates, 3,888 logic cells
  • XC2S200: 200,000 gates, 5,292 logic cells

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.