Overview of the AMD XC2S200-6FGG507C FPGA

The AMD XC2S200-6FGG507C is a field-programmable gate array (FPGA) belonging to the renowned Spartan-II family. This high-performance programmable logic device delivers exceptional flexibility and processing power for demanding digital design applications. Engineers seeking a cost-effective alternative to mask-programmed ASICs will find the XC2S200-6FGG507C an excellent choice for prototyping and production environments.

Originally developed by Xilinx (now part of AMD), this Xilinx FPGA combines substantial logic capacity with industry-leading reliability. The device operates at a 2.5V core voltage while supporting multiple I/O standards, making it versatile for various system integration requirements.

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Key Features and Specifications

Logic Resources and Capacity

The XC2S200-6FGG507C delivers impressive computational resources within its compact footprint:

Speed Grade and Performance

The “-6” speed grade designation indicates this is the fastest variant available in the XC2S200 product line. This FPGA achieves operating frequencies up to 263 MHz, enabling high-throughput data processing and complex signal manipulation. The -6 speed grade is exclusively available in the commercial temperature range, optimized for maximum performance in controlled operating environments.

Package Information

Operating Conditions

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Architecture and Functional Description

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG507C contains 1,176 configurable logic blocks arranged in a 28×42 array. Each CLB provides flexible logic implementation capabilities, including look-up tables (LUTs), flip-flops, and dedicated carry logic. This architecture enables efficient implementation of combinational and sequential logic circuits.

Input/Output Blocks (IOBs)

The device features programmable I/O blocks supporting multiple interface standards:

• LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
• PCI compliant I/O
• GTL and GTL+
• SSTL and HSTL standards
• Differential signaling support

Each IOB includes programmable slew rate control, pull-up/pull-down resistors, and configurable drive strength options.

Block RAM Memory

The integrated 56 Kbits of block RAM provides dedicated memory resources for implementing FIFOs, buffers, and lookup tables without consuming valuable logic resources. This dual-port memory architecture supports synchronous read and write operations.

Delay-Locked Loops (DLLs)

Four DLLs positioned at each corner of the die provide precise clock management capabilities:

• Clock deskewing and distribution
• Frequency synthesis
• Phase shifting
• Duty cycle correction

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Applications and Use Cases

The XC2S200-6FGG507C excels across numerous industrial and commercial applications:

Telecommunications

• Base station infrastructure
• Network switching equipment
• Protocol conversion bridges
• SDH/SONET interfaces

Industrial Control

• Motor drive systems
• PLC implementations
• Process automation
• Sensor interface processing

Embedded Systems

• Video processing pipelines
• Audio codec implementations
• Peripheral controllers
• Custom microcontroller designs

Aerospace and Defense

• Avionics data processing
• Radar signal processing
• Secure communication systems

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Development Tools and Software Support

Engineers working with the XC2S200-6FGG507C benefit from comprehensive development tool support:

Design Software

• ISE Design Suite: Complete FPGA design environment
• WebPACK: Free downloadable design tools
• ModelSim: Simulation and verification
• ChipScope Pro: On-chip debugging and analysis

IP Cores and Reference Designs

• Pre-verified intellectual property cores
• Reference designs for common applications
• Application notes and design guides
• Technical documentation library

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Ordering Information Breakdown

Understanding the XC2S200-6FGG507C part number structure:

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Advantages Over Mask-Programmed ASICs

Choosing the XC2S200-6FGG507C provides significant benefits compared to traditional ASIC solutions:

1. Eliminates NRE Costs: No expensive mask charges or tooling fees
2. Rapid Time-to-Market: Immediate programmability reduces development cycles
3. Field Upgradability: In-system reprogramming enables design modifications post-deployment
4. Risk Mitigation: Design changes possible without hardware replacement
5. Prototyping Efficiency: Same device for development and production

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Quality and Compliance

The XC2S200-6FGG507C meets stringent quality and environmental standards:

• Pb-free (lead-free) packaging option available (indicated by “G” in FGG)
• Compliant with RoHS directives
• Manufactured under ISO 9001 quality management systems
• Full boundary scan (JTAG) support for manufacturing test

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Technical Documentation

Comprehensive documentation supports successful design implementation:

• DS001 Complete Data Sheet (four modules)
• Module 1: Introduction and Ordering Information
• Module 2: Functional Description
• Module 3: DC and Switching Characteristics
• Module 4: Pinout Tables

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Conclusion

The AMD XC2S200-6FGG507C represents a proven, reliable solution for designers requiring substantial programmable logic capacity in a compact BGA package. With 200,000 system gates, 5,292 logic cells, and the fastest -6 speed grade, this Spartan-II FPGA delivers the performance and flexibility needed for telecommunications, industrial control, and embedded system applications. The comprehensive development tool ecosystem and extensive documentation ensure successful project implementation from concept through production.