The AMD XC2S200-6FGG506C is a high-density field-programmable gate array (FPGA) from the renowned Spartan-II family. Engineered with 200,000 system gates and advanced 0.18μm process technology, this Xilinx FPGA delivers exceptional performance, flexibility, and cost-efficiency for demanding digital design applications.
Key Features of the XC2S200-6FGG506C FPGA
The XC2S200-6FGG506C combines robust logic resources with versatile I/O capabilities, making it an ideal choice for engineers seeking a reliable programmable logic solution.
Logic and Gate Capacity
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
Memory Architecture
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks × 4,096 bits) |
| Block RAM Configuration |
Dual-port with independent controls |
XC2S200-6FGG506C Technical Specifications
Package and Physical Characteristics
The XC2S200-6FGG506C utilizes a Fine-Pitch Ball Grid Array (FBGA) package, providing excellent thermal performance and high pin density for complex PCB designs.
| Specification |
Value |
| Package Type |
FGG (Fine-Pitch BGA, Pb-Free) |
| Pin Count |
506 Balls |
| Speed Grade |
-6 (Higher Performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Core Voltage |
2.5V |
| I/O Voltage |
1.5V / 2.5V / 3.3V |
| Process Technology |
0.18μm |
Speed Grade Performance
The -6 speed grade designation indicates higher performance timing characteristics, delivering faster signal propagation and improved system clock rates compared to the -5 standard grade. This makes the XC2S200-6FGG506C suitable for applications requiring aggressive timing margins.
Advanced I/O Standards Support
The XC2S200-6FGG506C supports 16 high-performance interface standards, enabling seamless integration with various system architectures and memory interfaces.
Supported I/O Standards
| Standard |
Reference Voltage (VREF) |
Output Voltage (VCCO) |
| LVTTL (2-24mA) |
N/A |
3.3V |
| LVCMOS2 |
N/A |
2.5V |
| PCI (3V/5V, 33/66 MHz) |
N/A |
3.3V |
| GTL |
0.8V |
N/A |
| GTL+ |
1.0V |
N/A |
| HSTL Class I |
0.75V |
1.5V |
| HSTL Class III/IV |
0.9V |
1.5V |
| SSTL3 Class I/II |
1.5V |
3.3V |
| SSTL2 Class I/II |
1.25V |
2.5V |
| CTT |
1.5V |
3.3V |
| AGP-2X |
1.32V |
3.3V |
Clock Management with Delay-Locked Loop (DLL)
The XC2S200-6FGG506C incorporates four dedicated Delay-Locked Loops (DLLs) for advanced clock distribution and domain control.
DLL Capabilities
- Zero propagation delay clock distribution
- Low clock skew across all device outputs
- Clock multiplication (2×) and division (÷1.5 to ÷16)
- Four quadrature phase outputs (0°, 90°, 180°, 270°)
- Board-level clock deskew capability
- Automatic delay compensation for routing networks
Configurable Logic Block (CLB) Architecture
Each CLB in the XC2S200-6FGG506C contains four Logic Cells (LCs) organized in two slices, providing extensive design flexibility.
CLB Features
- 4-input Look-Up Tables (LUTs) for function generation
- Distributed RAM capability (16 × 1-bit per LUT)
- 16-bit shift register mode for DSP applications
- Dedicated carry logic for high-speed arithmetic
- Cascade chains for wide-input functions
- Edge-triggered flip-flops or level-sensitive latches
Block RAM Specifications
The XC2S200-6FGG506C provides 14 dedicated Block RAM modules, each offering 4,096 bits of dual-port memory with configurable aspect ratios.
Block RAM Aspect Ratios
| Width |
Depth |
Address Bus |
Data Bus |
| 1-bit |
4096 |
ADDR[11:0] |
DATA[0] |
| 2-bit |
2048 |
ADDR[10:0] |
DATA[1:0] |
| 4-bit |
1024 |
ADDR[9:0] |
DATA[3:0] |
| 8-bit |
512 |
ADDR[8:0] |
DATA[7:0] |
| 16-bit |
256 |
ADDR[7:0] |
DATA[15:0] |
Configuration Options
The XC2S200-6FGG506C supports multiple configuration modes for maximum design flexibility.
Configuration Modes
| Mode |
Clock Direction |
Data Width |
| Master Serial |
Output |
1-bit |
| Slave Serial |
Input |
1-bit |
| Slave Parallel |
Input |
8-bit |
| Boundary Scan (JTAG) |
N/A |
1-bit |
Configuration File Size: 1,335,840 bits
Boundary Scan and IEEE 1149.1 Compliance
The XC2S200-6FGG506C is fully compliant with IEEE 1149.1 boundary scan standard, supporting comprehensive test and debug capabilities.
Supported JTAG Instructions
- EXTEST – External interconnect testing
- SAMPLE/PRELOAD – Capture/preload boundary scan register
- BYPASS – Single-bit bypass register
- IDCODE – Device identification
- INTEST – Internal logic testing
- USERCODE – User-defined code access
Target Applications for XC2S200-6FGG506C
The XC2S200-6FGG506C excels in a wide range of applications requiring programmable logic solutions:
- Digital Signal Processing (DSP) – Leveraging distributed RAM and dedicated multiplier support
- Telecommunications Equipment – High-speed interface standard support
- Industrial Control Systems – Reliable operation with commercial temperature range
- Prototyping and Development – Unlimited reprogrammability for rapid iteration
- ASIC Replacement – Cost-effective alternative to mask-programmed devices
- Networking Equipment – PCI compliance and flexible I/O banking
- Consumer Electronics – Low-cost, high-density programmable logic
Why Choose the XC2S200-6FGG506C?
Cost-Effective ASIC Alternative
The XC2S200-6FGG506C eliminates the initial NRE costs and lengthy development cycles associated with traditional ASICs. Its unlimited reprogrammability allows field upgrades without hardware replacement.
Superior Performance-to-Cost Ratio
With system clock rates up to 200 MHz and comprehensive on-chip resources, the XC2S200-6FGG506C delivers outstanding value for high-volume production applications.
Pb-Free Packaging
The FGG package designation indicates RoHS-compliant, lead-free packaging, ensuring compliance with environmental regulations and modern manufacturing requirements.
Development Tool Support
The XC2S200-6FGG506C is fully supported by Xilinx ISE Design Suite, providing:
- Fully automatic mapping, placement, and routing
- Timing-driven implementation
- Comprehensive simulation and verification tools
- Over 400 library primitives and macros
- EDIF interface support for third-party tools
Ordering Information
| Part Number |
Description |
| XC2S200-6FGG506C |
Spartan-II FPGA, 200K Gates, -6 Speed, 506-Pin FBGA, Commercial Temp, Pb-Free |
Summary
The AMD XC2S200-6FGG506C represents the pinnacle of the Spartan-II FPGA family, offering 200,000 system gates, 5,292 logic cells, and 56K bits of block RAM in a compact 506-ball BGA package. With support for 16 I/O standards, four DLLs, and comprehensive configuration options, this FPGA delivers the performance and flexibility required for modern digital design challenges. Its Pb-free packaging and commercial temperature rating make it suitable for a wide range of applications from telecommunications to industrial control systems.
