Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

AMD XC2S200-6FGG495C Spartan-II FPGA | 200K Gate Programmable Logic Device

Product Details

The AMD XC2S200-6FGG495C is a high-performance field-programmable gate array (FPGA) from the renowned Spartan-II family. This 200,000-gate programmable logic device delivers exceptional flexibility and cost-effectiveness for industrial, commercial, and embedded applications. Engineers seeking reliable digital design solutions will find the XC2S200-6FGG495C an ideal choice for prototyping, production, and field-upgradable systems.


Key Features of the XC2S200-6FGG495C FPGA

The XC2S200-6FGG495C stands out as a superior alternative to traditional mask-programmed ASICs. This programmable device eliminates lengthy development cycles, reduces initial costs, and offers inherent design flexibility that conventional ASICs simply cannot match.

High-Density Logic Architecture

The XC2S200-6FGG495C features an impressive logic architecture designed for complex digital implementations:

  • 200,000 System Gates for robust design capacity
  • 5,292 Logic Cells enabling sophisticated signal processing
  • 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 × 42 array
  • 284 User I/O Pins for extensive peripheral connectivity

Advanced Memory Resources

Memory capabilities make the XC2S200-6FGG495C suitable for data-intensive applications:

  • 75,264 Bits of Distributed RAM integrated within CLBs
  • 56 Kbits of Dedicated Block RAM with dual-port functionality
  • Synchronous RAM Architecture supporting independent read/write operations

Clock Management Features

Four integrated Delay-Locked Loops (DLLs) provide superior clock management:

  • Clock de-skewing and phase adjustment
  • Frequency synthesis capabilities
  • Low-jitter clock distribution across the device
  • Support for multiple clock domains

XC2S200-6FGG495C Technical Specifications

Understanding the complete specifications helps engineers make informed procurement decisions for their Xilinx FPGA projects.

Electrical Characteristics

Parameter Specification
Core Voltage (VCCINT) 2.5V (2.375V – 2.625V)
I/O Voltage (VCCO) 1.5V to 3.3V Selectable
Operating Frequency Up to 263 MHz
Process Technology 0.18μm CMOS
Power Consumption Low-power architecture

Package Information

Attribute Value
Package Type Fine Pitch Ball Grid Array (FBGA)
Pin Count 456 Pins
Mounting Style Surface Mount (SMD)
Package Code FGG495
Lead-Free Option Available (Pb-Free)

Operating Conditions

Parameter Commercial Grade
Junction Temperature 0°C to +85°C
Speed Grade -6 (Highest Performance)
Storage Temperature -65°C to +150°C

XC2S200-6FGG495C Applications

The versatility of the XC2S200-6FGG495C makes it suitable for diverse applications across multiple industries.

Industrial Control Systems

Engineers deploy this FPGA in industrial automation for:

  • Motor control and drive systems
  • PLC replacement and enhancement
  • Real-time process monitoring
  • Industrial networking interfaces

Telecommunications Equipment

The XC2S200-6FGG495C excels in communication applications:

  • Protocol conversion and bridging
  • Data encoding and decoding
  • Signal processing pipelines
  • Network interface controllers

Consumer Electronics

Cost-effective implementation in consumer products including:

  • Video processing systems
  • Audio equipment
  • Gaming peripherals
  • Display controllers

Embedded Systems Development

Ideal for embedded designers requiring:

  • Rapid prototyping capabilities
  • Custom peripheral interfaces
  • Co-processor implementations
  • System-on-chip development

Configuration Options for XC2S200-6FGG495C

The XC2S200-6FGG495C supports multiple configuration modes for maximum design flexibility.

Supported Configuration Modes

Mode Description Data Width
Master Serial FPGA generates CCLK 1-bit
Slave Serial External CCLK input 1-bit
Slave Parallel External CCLK input 8-bit
Boundary Scan JTAG-based programming 1-bit

Configuration Memory Requirements

The complete configuration bitstream for the XC2S200-6FGG495C requires approximately 1.34 Mbit of storage. Compatible configuration devices include:

  • XC18V01 and XC18V02 In-System Programmable PROMs
  • Platform Flash devices
  • Standard serial EEPROMs

I/O Standards Supported by XC2S200-6FGG495C

The versatile I/O architecture supports numerous signaling standards.

Single-Ended Standards

  • LVTTL (3.3V)
  • LVCMOS (3.3V, 2.5V, 1.8V)
  • PCI (3.3V, 33 MHz)
  • GTL and GTL+

Differential Standards

  • LVDS (Low-Voltage Differential Signaling)
  • BLVDS (Bus LVDS)
  • LVPECL

I/O Banking Architecture

The FGG package offers eight independent VCCO supplies, enabling:

  • Multiple I/O voltage domains
  • Mixed-voltage system designs
  • Optimized signal integrity

Design Tools for XC2S200-6FGG495C Development

Successful implementation requires compatible development software.

Recommended Development Environment

  • Xilinx ISE Design Suite (Classic Development Tool)
  • Xilinx Foundation Series Software
  • Third-party Synthesis Tools: Synplify, Precision RTL

Supported Design Entry Methods

  • HDL Design (VHDL/Verilog)
  • Schematic Capture
  • IP Core Integration
  • Mixed Design Entry

Why Choose the XC2S200-6FGG495C FPGA?

Cost-Effective ASIC Alternative

The XC2S200-6FGG495C eliminates:

  • Non-recurring engineering (NRE) costs
  • Mask charges and setup fees
  • Lengthy fabrication lead times
  • Minimum order quantity requirements

Field Upgradeability

Unlike fixed-function ASICs, the XC2S200-6FGG495C enables:

  • In-field design modifications
  • Feature additions post-deployment
  • Bug fixes without hardware changes
  • Product line scalability

Proven Reliability

The Spartan-II architecture offers:

  • Mature, well-documented platform
  • Extensive application support
  • Global distributor availability
  • Long-term supply continuity

Ordering Information for XC2S200-6FGG495C

When procuring the XC2S200-6FGG495C, verify the following part number nomenclature:

XC2S200-6FGG495C

Code Segment Meaning
XC2S Spartan-II Family
200 200K System Gates
-6 Speed Grade (Fastest)
FGG Fine-pitch BGA, Pb-Free
495 Pin Count
C Commercial Temperature Range

Conclusion

The AMD XC2S200-6FGG495C represents a proven, reliable solution for engineers requiring programmable logic in a cost-effective package. With 200,000 system gates, comprehensive memory resources, and flexible I/O capabilities, this Spartan-II FPGA addresses demanding applications across industrial, telecommunications, and consumer markets. The field-programmable architecture ensures design flexibility while the mature Spartan-II platform provides extensive documentation and development tool support.

For applications demanding higher integration or enhanced features, consider exploring the broader AMD programmable logic portfolio to find the optimal device for your specific requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.