The AMD XC2S200-6FGG494C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional value for engineers seeking a cost-effective solution for digital design applications. With 200,000 system gates and advanced 0.18µm CMOS technology, the XC2S200-6FGG494C provides the perfect balance of performance, flexibility, and reliability for industrial and commercial applications.
XC2S200-6FGG494C Key Features and Benefits
The XC2S200-6FGG494C FPGA offers numerous advantages that make it an ideal choice for embedded systems, telecommunications, and digital signal processing applications:
High Logic Density and Processing Power
- 200,000 System Gates – Enables complex digital design implementations
- 5,292 Logic Cells – Provides extensive logic resources for advanced applications
- 1,176 Configurable Logic Blocks (CLBs) – Arranged in a 28 x 42 array for optimal routing efficiency
- 75,264 Bits of Distributed RAM – Fast on-chip memory for high-speed data buffering
Robust Memory Architecture
The XC2S200-6FGG494C features a comprehensive memory system designed for demanding applications:
- 56 Kbits of Block RAM – Organized in 14 dedicated memory blocks
- Dual-Port RAM Capability – Each 4,096-bit block supports independent read/write operations
- Flexible Port Configurations – Configurable data widths from 1-bit to 16-bit
- Synchronous Operation – Fully clocked RAM operations ensure data integrity
Advanced Clock Management
- Four Delay-Locked Loops (DLLs) – Positioned at each corner of the die
- Clock Multiplication and Division – Supports precise frequency synthesis
- Low Clock Skew Distribution – Ensures timing accuracy across the device
- Clock Mirroring Capability – Enables external clock loop-back for system synchronization
XC2S200-6FGG494C Technical Specifications
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG494C |
| Device Family |
Spartan-II FPGA |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 CLBs) |
| Block RAM |
56 Kbits (14 Blocks) |
| Distributed RAM |
75,264 Bits |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Fastest) |
| Package Type |
FGG494 (Fine-pitch BGA) |
| Pin Count |
494 Pins |
| Core Voltage |
2.5V |
| Process Technology |
0.18µm CMOS |
| Maximum Frequency |
263 MHz |
| Operating Temperature |
Commercial (0°C to +85°C) |
| Pb-Free Packaging |
Yes (RoHS Compliant) |
XC2S200-6FGG494C Architecture Overview
Configurable Logic Block (CLB) Structure
Each CLB in the XC2S200-6FGG494C contains four Logic Cells (LCs), providing:
- Four-Input Look-Up Tables (LUTs) – Implements any Boolean function
- Dedicated Carry Logic – Enables fast arithmetic operations
- Multiplexer Resources – Wide function implementation capability
- Register Elements – Configurable as flip-flops or latches
- Direct Feedthrough Paths – Reduces routing congestion
Input/Output Block (IOB) Features
The XC2S200-6FGG494C offers flexible I/O capabilities with the Xilinx FPGA IOB architecture:
- Multiple I/O Standards Support – LVTTL, LVCMOS, PCI, GTL, SSTL, and more
- Programmable Drive Strength – 2mA to 24mA selectable output current
- Slew Rate Control – Fast or slow edge rate selection
- Input Delay Elements – Enables precise signal timing adjustment
- Pull-up/Pull-down Resistors – Integrated weak resistors for unused pins
Global Routing Resources
- Primary Global Clock Networks – Four dedicated high-speed clock distribution lines
- Secondary Global Networks – 24 additional routing channels
- VersaRing Routing – Facilitates easy pin-swapping during PCB redesigns
- Programmable Interconnect Points (PIPs) – Flexible signal routing throughout the device
XC2S200-6FGG494C Speed Grade Information
The “-6” speed grade designation indicates the fastest performance tier available:
| Speed Grade |
Performance Level |
Application Suitability |
| -4 |
Standard |
General-purpose applications |
| -5 |
Enhanced |
Moderate performance requirements |
| -6 |
Maximum |
High-speed, timing-critical designs |
XC2S200-6FGG494C Package Information
FGG494 Package Characteristics
The Fine-pitch Ball Grid Array (FGG494) package offers:
- 494 Total Balls – High pin density for complex designs
- 1.0mm Ball Pitch – Industry-standard spacing for reliable assembly
- Lead-Free Construction – Environmentally compliant (RoHS)
- Enhanced Thermal Performance – Efficient heat dissipation capability
- Compact Footprint – Optimized PCB real estate utilization
Mechanical Dimensions
| Dimension |
Value |
| Package Type |
FBGA (Fine-pitch BGA) |
| Ball Count |
494 |
| Ball Pitch |
1.0 mm |
| Body Size |
27mm x 27mm |
XC2S200-6FGG494C Application Areas
The versatility of the XC2S200-6FGG494C makes it suitable for numerous applications:
Telecommunications and Networking
- Protocol bridging and conversion
- Data encryption and compression
- Network interface controllers
- SDH/SONET framing
Industrial Automation
- Motor control systems
- PLC implementations
- Sensor data acquisition
- Real-time process monitoring
Digital Signal Processing
- FIR and IIR filter implementations
- FFT accelerators
- Audio/video processing
- Image enhancement algorithms
Consumer Electronics
- Display controllers
- Audio processing systems
- Gaming peripherals
- Home automation devices
Automotive Systems
- Infotainment interfaces
- Diagnostic systems
- Sensor fusion applications
- Communication gateways
XC2S200-6FGG494C Design Considerations
Power Supply Requirements
| Supply Rail |
Voltage |
Purpose |
| VCCINT |
2.5V ± 5% |
Internal core logic |
| VCCO |
1.5V – 3.3V |
I/O banks (voltage-dependent on I/O standard) |
Configuration Options
The XC2S200-6FGG494C supports multiple configuration modes:
- Master Serial Mode – FPGA controls configuration timing
- Slave Serial Mode – External controller manages configuration
- Master Parallel Mode – 8-bit parallel data interface
- Slave Parallel Mode – External parallel data control
- JTAG Boundary Scan – IEEE 1149.1 compliant programming
Development Tool Support
- Xilinx ISE Design Suite – Complete design environment
- ISE WebPACK – Free development tools for Spartan-II
- Third-Party Synthesis Tools – Synplify, Precision Synthesis compatible
- Simulation Support – ModelSim, ActiveHDL integration
XC2S200-6FGG494C Ordering Information
Part Number Decoder
XC2S200-6FGG494C breaks down as follows:
| Segment |
Meaning |
| XC |
Xilinx Component |
| 2S |
Spartan-II Family |
| 200 |
200K System Gates |
| -6 |
Speed Grade (Fastest) |
| FGG |
Fine-pitch BGA, Pb-Free |
| 494 |
Pin Count |
| C |
Commercial Temperature (0°C to +85°C) |
Available Variants
| Part Number |
Speed |
Temperature |
Package |
| XC2S200-6FGG494C |
-6 |
Commercial |
494 FBGA |
| XC2S200-6FGG494I |
-6 |
Industrial |
494 FBGA |
| XC2S200-5FGG494C |
-5 |
Commercial |
494 FBGA |
Why Choose the XC2S200-6FGG494C?
Cost-Effective Alternative to ASICs
The XC2S200-6FGG494C eliminates the high NRE (Non-Recurring Engineering) costs associated with mask-programmed ASICs. Engineers benefit from:
- Zero Upfront Tooling Costs – No mask charges or fabrication fees
- Rapid Prototyping – Immediate design verification capability
- Field Upgradability – In-system reprogramming for design updates
- Reduced Time-to-Market – Faster development cycles than custom silicon
Proven Reliability
The Spartan-II FPGA family has demonstrated exceptional reliability across millions of deployed units:
- Mature Process Technology – Proven 0.18µm CMOS fabrication
- Extensive Qualification Testing – Comprehensive environmental stress screening
- Long-Term Availability – Continued manufacturing support
- Global Support Network – Worldwide technical assistance
XC2S200-6FGG494C Summary
The AMD XC2S200-6FGG494C Spartan-II FPGA represents an excellent choice for engineers requiring a reliable, high-performance programmable logic solution. With its combination of 200,000 system gates, 5,292 logic cells, 56 Kbits of block RAM, and the fastest -6 speed grade, this device delivers outstanding value for telecommunications, industrial, DSP, and embedded applications.
The lead-free FGG494 package ensures environmental compliance while providing the pin density needed for complex system designs. Whether you’re developing new products or upgrading existing designs, the XC2S200-6FGG494C offers the flexibility, performance, and cost-effectiveness that modern electronic designs demand.
