The AMD XC2S200-6FGG493C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family. This programmable logic device delivers exceptional versatility and reliability for industrial automation, telecommunications, and digital signal processing applications. Engineers worldwide trust this FPGA for complex digital designs requiring robust performance and cost-effective implementation.
Key Features of the XC2S200-6FGG493C FPGA
The XC2S200-6FGG493C combines advanced programmable logic capabilities with proven Spartan-II architecture. This FPGA serves as a superior alternative to mask-programmed ASICs, eliminating lengthy development cycles and reducing inherent design risks.
High-Density Logic Resources
The XC2S200-6FGG493C provides substantial logic capacity for demanding applications:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
Memory Architecture
This Xilinx FPGA features dual memory architectures for flexible design implementation:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
The block RAM operates as fully synchronous dual-ported 4096-bit RAM blocks with independent control signals for each port. Designers can configure data widths independently across both ports, providing built-in flexibility for various memory configurations.
XC2S200-6FGG493C Technical Specifications
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| Process Technology |
0.18µm CMOS |
| Speed Grade |
-6 (Highest Performance) |
| Maximum Frequency |
263 MHz |
| Temperature Range |
Commercial (0°C to +85°C) |
Package Information
| Attribute |
Detail |
| Package Type |
FGG (Fine-pitch Ball Grid Array) |
| Pin Count |
493 |
| Mounting |
Surface Mount |
| RoHS Compliance |
Pb-Free (Lead-Free) |
Spartan-II Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG493C features a sophisticated CLB structure that serves as the primary logic resource. Each CLB contains four logic cells, with each cell comprising a 4-input function generator, storage element, and dedicated carry logic. The four direct feedthrough paths per CLB enable extra data input lines and additional local routing without consuming logic resources.
Input/Output Block (IOB) Capabilities
The IOB architecture supports 16 different I/O signaling standards, making the XC2S200-6FGG493C compatible with modern memory and bus interfaces. Each IOB includes three registers functioning as D-type edge-triggered flip-flops or level-sensitive latches, providing versatile interfacing options for diverse system requirements.
Delay-Locked Loop (DLL) Features
Four integrated DLLs provide advanced clock management capabilities. These DLLs enable precise clock distribution across the device, supporting clock mirroring functionality for optimal timing performance in high-speed designs.
Application Areas for XC2S200-6FGG493C
Industrial Automation
The XC2S200-6FGG493C excels in industrial control systems where reliability and real-time processing are critical. Its programmable nature allows field upgrades without hardware replacement, ensuring long-term product viability.
Telecommunications Equipment
Network infrastructure and communication systems benefit from the FPGA’s high-speed signal processing capabilities and flexible I/O standards support.
Digital Signal Processing (DSP)
The combination of distributed and block RAM with extensive logic resources makes this FPGA ideal for implementing complex DSP algorithms and filtering operations.
Embedded Systems
Designers integrate the XC2S200-6FGG493C into embedded platforms requiring custom logic functions, protocol conversion, and intelligent peripheral control.
Advantages Over Traditional ASICs
The XC2S200-6FGG493C offers compelling benefits compared to mask-programmed application-specific integrated circuits:
- Eliminated NRE Costs: No initial mask charges or setup fees
- Rapid Prototyping: Immediate design iteration without waiting for fabrication
- Field Upgradability: Hardware reprogramming enables post-deployment enhancements
- Risk Mitigation: Design verification before production commitment
- Shorter Time-to-Market: Accelerated development cycles for competitive advantage
Development Tools and Design Support
Software Compatibility
The XC2S200-6FGG493C is fully supported by the ISE Design Suite, providing comprehensive synthesis, implementation, and verification capabilities. The development environment includes schematic capture, HDL entry, timing analysis, and configuration utilities.
Configuration Options
Multiple configuration modes support various system architectures including serial and parallel PROM programming, boundary scan (JTAG), and in-system reconfiguration for dynamic design updates during operation.
Ordering Information Explained
The part number XC2S200-6FGG493C follows standard AMD/Xilinx nomenclature:
| Code Segment |
Meaning |
| XC2S |
Spartan-II Family |
| 200 |
200K System Gates |
| -6 |
Speed Grade (Highest Performance) |
| FGG |
Fine-pitch BGA, Pb-Free |
| 493 |
Pin Count |
| C |
Commercial Temperature (0°C to +85°C) |
Quality and Reliability Standards
The XC2S200-6FGG493C meets stringent quality standards for commercial applications. The Pb-free packaging complies with RoHS environmental directives, ensuring compatibility with modern manufacturing processes and regulatory requirements.
Summary
The AMD XC2S200-6FGG493C represents a proven solution for engineers requiring reliable high-performance FPGA capabilities. With 200,000 system gates, 5,292 logic cells, and comprehensive memory resources in a compact BGA package, this Spartan-II FPGA delivers exceptional value for industrial, telecommunications, and embedded applications. The -6 speed grade ensures maximum performance while the commercial temperature rating provides reliability for standard operating environments.
