The AMD XC2S200-6FGG492C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, offering exceptional flexibility and high-speed performance for demanding electronic design applications. This programmable logic device delivers 200,000 system gates with advanced features that make it an ideal choice for telecommunications, networking equipment, and industrial control systems.
Key Features of the XC2S200-6FGG492C FPGA
The XC2S200-6FGG492C represents the top-tier offering in the Spartan-II FPGA family, combining robust architecture with cost-effective design principles. Built on proven 0.18-micron CMOS technology, this device provides engineers with a reliable platform for implementing complex digital logic designs.
Technical Specifications Overview
| Parameter |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Speed Grade |
-6 (Highest Performance) |
| Package Type |
FGG492 (Fine Pitch BGA) |
| Core Voltage |
2.5V |
| Operating Temperature |
Commercial (0°C to 85°C) |
Architecture and Design Capabilities
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG492C features 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB contains four logic cells with 4-input look-up tables (LUTs), providing exceptional flexibility for implementing combinatorial and sequential logic functions. The architecture supports dedicated carry logic for high-speed arithmetic operations, making it suitable for digital signal processing applications.
Memory Resources and Block RAM
This Xilinx FPGA offers substantial on-chip memory resources, including 75,264 bits of distributed RAM and 56K bits of dedicated block RAM. The block RAM consists of 14 independent 4096-bit dual-port memory blocks, enabling efficient data buffering and storage for high-bandwidth applications. Each block RAM cell supports configurable aspect ratios from 1-bit x 4096 deep to 16-bit x 256 deep.
Delay-Locked Loop (DLL) Technology
Four integrated Delay-Locked Loops provide advanced clock management capabilities. The DLLs eliminate clock distribution delays, offering zero-skew clock signals throughout the device. Additional features include clock multiplication (2x), clock division (up to 16x), and quadrature phase generation for sophisticated timing applications.
I/O Standards and Interface Support
Versatile I/O Banking
The XC2S200-6FGG492C supports 16 different I/O signaling standards, organized into eight independent I/O banks. This flexibility allows designers to interface with multiple voltage domains within a single device.
Supported Interface Standards
- LVTTL (2-24 mA drive strength)
- LVCMOS 2.5V
- PCI 3.3V/5V (33 MHz and 66 MHz compliant)
- GTL and GTL+
- HSTL Class I, III, and IV
- SSTL2 and SSTL3 (Class I and II)
- CTT
- AGP-2X
Applications and Use Cases
Telecommunications Infrastructure
The high-speed performance and abundant logic resources make the XC2S200-6FGG492C ideal for base stations, cell towers, routers, and switching equipment. The device supports system clock rates up to 200 MHz, enabling real-time signal processing and protocol implementation.
Industrial Control Systems
Engineers frequently deploy this FPGA in automation systems, process control applications, and motor drive controllers. The programmable nature allows rapid prototyping and field upgrades without hardware replacement.
Networking Equipment
The XC2S200-6FGG492C excels in network infrastructure applications, including firewalls, load balancers, and packet processing engines. With 284 user I/O pins and PCI compliance, it integrates seamlessly into existing system architectures.
Automotive Electronics
Advanced driver-assistance systems (ADAS), infotainment platforms, and automotive gateway modules benefit from the reliable performance and commercial temperature range operation of this device.
Package Information and Pin Configuration
FGG492 Fine Pitch BGA Package
The FGG492 package provides a compact 492-ball array with fine pitch spacing, optimizing board space utilization while maintaining excellent thermal and electrical performance. The Pb-free (RoHS compliant) package option ensures environmental compliance for modern manufacturing requirements.
Configuration Modes
The device supports multiple configuration options for maximum design flexibility:
- Master Serial Mode
- Slave Serial Mode
- Slave Parallel Mode (fastest option)
- Boundary-Scan (JTAG) Mode
Configuration data can be stored in external serial PROMs or loaded from microprocessors, providing versatile deployment options.
Development Tools and Software Support
ISE Design Suite Compatibility
The XC2S200-6FGG492C is fully supported by the Xilinx ISE development environment, offering comprehensive tools for design entry, synthesis, implementation, and verification. The unified library includes over 400 primitives and macros, from basic logic gates to complex arithmetic functions.
Design Implementation Features
- Timing-driven placement and routing
- Hierarchical design support
- EDIF netlist compatibility
- Boundary-scan testing (IEEE 1149.1)
- Full readback capability for verification
Advantages Over Traditional ASICs
Reduced Development Time
Unlike mask-programmed ASICs, the XC2S200-6FGG492C eliminates lengthy development cycles and initial tooling costs. Designers can iterate quickly, testing and modifying designs in real hardware within minutes.
Field Upgradeability
The unlimited reprogrammability of SRAM-based FPGA technology enables field upgrades and bug fixes without physical hardware replacement, significantly reducing lifecycle costs.
Lower Risk Development
Programmable logic eliminates the inherent risk of ASIC tape-out failures, allowing designs to be verified and validated before committing to production.
Ordering Information
When ordering the XC2S200-6FGG492C, note the following specifications encoded in the part number:
- XC2S200: Spartan-II device with 200K system gates
- -6: Highest performance speed grade
- FGG: Fine pitch BGA package, Pb-free
- 492: 492-ball package configuration
- C: Commercial temperature range (0°C to 85°C)
Conclusion
The AMD XC2S200-6FGG492C delivers exceptional value for engineers seeking a high-performance, cost-effective FPGA solution. With 200,000 system gates, 5,292 logic cells, comprehensive I/O standard support, and advanced clock management features, this Spartan-II family device addresses diverse application requirements from telecommunications to industrial automation. The combination of proven architecture, robust development tools, and field-programmable flexibility makes it an excellent choice for both prototyping and high-volume production applications.
